MIL-HDBK-419A 29 DECEMBER 1987 Volume 2 of 2 Applications Unfortunately, few Military Handbooks address the need for defense against electromagnetic pulse (EMP) and cybersecurity. While EMP has been thought of as a remote possibility (who in his right mind is going to launch a nuclear weapon of any kind against the U.S.?) Advances in non-nuclear EMP, miniaturization of electronics and autonomous drones suddenly brings EMP into the role of the possible. No longer would an adversary need to risk retaliation when a drone from an unknown source attacks a vital facility. The information in this book is part of the solution to the question "How do we defend against EMP?" List of Applicable EMP and Cybersecurity Publications: MIL-STD-188-125-1 High-altitude electromagnetic pulse (HEMP) Protection For Ground-Based C4I Facilities Performing Critical, Time-Urgent Missions MIL-STD-188-124A Grounding, Bonding and Shielding for Common Long Haul/Tactical Communication Systems MIL-HDBK -1195 Radio Frequency Shielded Enclosures TOP 01-2-620 High-Altitude Electromagnetic Pulse (HEMP) Testing MIL-HDBK-1012/1 Electronic Facilities Engineering MIL-HDBK-1013/1A Design Guidelines for Physical Security of Facilities

In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.