Digitally Assisted, Fully Integrated, Wideband Transmitters for High-Speed Millimeter-Wave Wireless Communication Links

Digitally Assisted, Fully Integrated, Wideband Transmitters for High-Speed Millimeter-Wave Wireless Communication Links
Title Digitally Assisted, Fully Integrated, Wideband Transmitters for High-Speed Millimeter-Wave Wireless Communication Links PDF eBook
Author David del Rio
Publisher Springer
Pages 269
Release 2018-07-07
Genre Technology & Engineering
ISBN 3319932810

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This book presents design methods and considerations for digitally-assisted wideband millimeter-wave transmitters. It addresses comprehensively both RF design and digital implementation simultaneously, in order to design energy- and cost-efficient high-performance transmitters for mm-wave high-speed communications. It covers the complete design flow, from link budget assessment to the transistor-level design of different RF front-end blocks, such as mixers and power amplifiers, presenting different alternatives and discussing the existing trade-offs. The authors also analyze the effect of the imperfections of these blocks in the overall performance, while describing techniques to correct and compensate for them digitally. Well-known techniques are revisited, and some new ones are described, giving examples of their applications and proving them in real integrated circuits.

High-Frequency Integrated Circuits

High-Frequency Integrated Circuits
Title High-Frequency Integrated Circuits PDF eBook
Author Sorin Voinigescu
Publisher Cambridge University Press
Pages 921
Release 2013-02-28
Genre Technology & Engineering
ISBN 0521873029

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A transistor-level, design-intensive overview of high speed and high frequency monolithic integrated circuits for wireless and broadband systems from 2 GHz to 200 GHz, this comprehensive text covers high-speed, RF, mm-wave, and optical fibre circuits using nanoscale CMOS, SiGe BiCMOS, and III-V technologies. Step-by-step design methodologies, end-of chapter problems, and practical simulation and design projects are provided, making this an ideal resource for senior undergraduate and graduate courses in circuit design. With an emphasis on device-circuit topology interaction and optimization, it gives circuit designers and students alike an in-depth understanding of device structures and process limitations affecting circuit performance.

Microwave Journal

Microwave Journal
Title Microwave Journal PDF eBook
Author
Publisher
Pages 844
Release 2007
Genre Microwaves
ISBN

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Electrical & Electronics Abstracts

Electrical & Electronics Abstracts
Title Electrical & Electronics Abstracts PDF eBook
Author
Publisher
Pages 1860
Release 1997
Genre Electrical engineering
ISBN

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Physics Briefs

Physics Briefs
Title Physics Briefs PDF eBook
Author
Publisher
Pages 820
Release 1992
Genre Physics
ISBN

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Antenna-in-Package Technology and Applications

Antenna-in-Package Technology and Applications
Title Antenna-in-Package Technology and Applications PDF eBook
Author Duixian Liu
Publisher John Wiley & Sons
Pages 416
Release 2020-03-31
Genre Technology & Engineering
ISBN 1119556635

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A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)

2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC)
Title 2021 IEEE Radio Frequency Integrated Circuits Symposium (RFIC) PDF eBook
Author IEEE Staff
Publisher
Pages
Release 2021-06-07
Genre
ISBN 9781665430821

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RFIC is the premier IC Conference focused on the latest developments in RF Microwave, and Millimeter Wave Integrated Circuit Technology and Innovation