The primary thrust of very large scale integration (VLS!) is the miniaturization of devices to increase packing density, achieve higher speed, and consume lower power. The fabrication of integrated circuits containing in excess of four million components per chip with design rules in the submicron range has now been made possible by the introduction of innovative circuit designs and the development of new microelectronic materials and processes. This book addresses the latter challenge by assessing the current status of the science and technology associated with the production of VLSI silicon circuits. It represents the cumulative effort of experts from academia and industry who have come together to blend their expertise into a tutorial overview and cohesive update of this rapidly expanding field. A balance of fundamental and applied contributions cover the basics of microelectronics materials and process engineering. Subjects in materials science include silicon, silicides, resists, dielectrics, and interconnect metallization. Subjects in process engineering include crystal growth, epitaxy, oxidation, thin film deposition, fine-line lithography, dry etching, ion implantation, and diffusion. Other related topics such as process simulation, defects phenomena, and diagnostic techniques are also included. This book is the result of a NATO-sponsored Advanced Study Institute (AS!) held in Castelvecchio Pascoli, Italy. Invited speakers at this institute provided manuscripts which were edited, updated, and integrated with other contributions solicited from non-participants to this AS!.

Lists citations with abstracts for aerospace related reports obtained from world wide sources and announces documents that have recently been entered into the NASA Scientific and Technical Information Database.

In Waveguide Spectroscopy of Thin Films new methods of study of the linear and nonlinear optical properties of thin films are presented. These techniques are based on the principles of the spatial Fourier spectroscopy of the light beam reflected from a prism-coupling device with the tunnel excitation of guided lightmodes in thin-film structures. Measurement techniques of determination of the absorption coefficient, refractive index and thickness of the dielectric, semiconductor or metallic films are considered. This book is highly recommended for specialists in the fields of integrated and thin film optics and for graduated students in related specialties. There are new techniques of measurement of thin-film parameters stated

Taiwan's electronics industry, especially the semiconductor and information products sectors, is characterized by rapid growth and high potential. This book investigates the past performance, current status, and future development of this industry, providing engineers with important data. Corporate business planners and electronics managers will find helpful information for decision making regarding joint ventures and alliances with Taiwanese manufacturers.