The frequency dependent characteristics of symmetric coupled microstrips in multilayer structures are considered in order to study transient signal distortion and coupling on these structures. Using the spectral domain approach with TEY (LSE) and TMY (LSM) modes, a simple recurrence relation is derived for the generalized Green's function of arbitrary multilayer structures. The frequency domain approach is used in conjunction with the even/odd mode analysis to formulate the time domain response for both of the coupled lines. Numerical results are presented for single layer structures, showing the effects of substrate materials, center conductor spacing, and line length. Results for multilayer structures are also given, showing the effects of additional substrates and superstrates on the line parameters. A new method for equalizing the even and odd phase velocities, and thus controlling the signal distortion and coupling, over a wide band of frequencies by properly selecting the dimensions and electrical properties of the substrate materials is presented. (RH).

Most existing books on wavelets are either too mathematical or they focus on too narrow a specialty. This book provides a thorough treatment of the subject from an engineering point of view. It is a one-stop source of theory, algorithms, applications, and computer codes related to wavelets. This second edition has been updated by the addition of: a section on "Other Wavelets" that describes curvelets, ridgelets, lifting wavelets, etc a section on lifting algorithms Sections on Edge Detection and Geophysical Applications Section on Multiresolution Time Domain Method (MRTD) and on Inverse problems

Microelectronic system interconnections provides a uniques approach to the subject.

Building on the success of the previous three editions, Foundations for Microstrip Circuit Design offers extensive new, updated and revised material based upon the latest research. Strongly design-oriented, this fourth edition provides the reader with a fundamental understanding of this fast expanding field making it a definitive source for professional engineers and researchers and an indispensable reference for senior students in electronic engineering. Topics new to this edition: microwave substrates, multilayer transmission line structures, modern EM tools and techniques, microstrip and planar transmision line design, transmission line theory, substrates for planar transmission lines, Vias, wirebonds, 3D integrated interposer structures, computer-aided design, microstrip and power-dependent effects, circuit models, microwave network analysis, microstrip passive elements, and slotline design fundamentals.