"3-Dimensional VLSI: A 2.5-Dimensional Integration Scheme"elaborates the concept and importance of 3-Dimensional (3-D) VLSI. The authors have developed a new 3-D IC integration paradigm, so-called 2.5-D integration, to address many problems that are hard to resolve using traditional non-monolithic integration schemes. The book also introduces major 3-D VLSI design issues that need to be solved by IC designers and Electronic Design Automation (EDA) developers. By treating 3-D integration in an integrated framework, the book provides important insights for semiconductor process engineers, IC designers, and those working in EDA R&D. Dr. Yangdong Deng is an associate professor at the Institute of Microelectronics, Tsinghua University, China. Dr. Wojciech P. Maly is the U. A. and Helen Whitaker Professor at the Department of Electrical and Computer Engineering, Carnegie Mellon University, USA.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

The complexity of modern chip design requires extensive use of specialized software throughout the process. To achieve the best results, a user of this software needs a high-level understanding of the underlying mathematical models and algorithms. In addition, a developer of such software must have a keen understanding of relevant computer science aspects, including algorithmic performance bottlenecks and how various algorithms operate and interact. This book introduces and compares the fundamental algorithms that are used during the IC physical design phase, wherein a geometric chip layout is produced starting from an abstract circuit design. This updated second edition includes recent advancements in the state-of-the-art of physical design, and builds upon foundational coverage of essential and fundamental techniques. Numerous examples and tasks with solutions increase the clarity of presentation and facilitate deeper understanding. A comprehensive set of slides is available on the Internet for each chapter, simplifying use of the book in instructional settings. “This improved, second edition of the book will continue to serve the EDA and design community well. It is a foundational text and reference for the next generation of professionals who will be called on to continue the advancement of our chip design tools and design the most advanced micro-electronics.” Dr. Leon Stok, Vice President, Electronic Design Automation, IBM Systems Group “This is the book I wish I had when I taught EDA in the past, and the one I’m using from now on.” Dr. Louis K. Scheffer, Howard Hughes Medical Institute “I would happily use this book when teaching Physical Design. I know of no other work that’s as comprehensive and up-to-date, with algorithmic focus and clear pseudocode for the key algorithms. The book is beautifully designed!” Prof. John P. Hayes, University of Michigan “The entire field of electronic design automation owes the authors a great debt for providing a single coherent source on physical design that is clear and tutorial in nature, while providing details on key state-of-the-art topics such as timing closure.” Prof. Kurt Keutzer, University of California, Berkeley “An excellent balance of the basics and more advanced concepts, presented by top experts in the field.” Prof. Sachin Sapatnekar, University of Minnesota

This book focuses on the development of 3D design and implementation methodologies for Tree-based FPGA architecture. It also stresses the needs for new and augmented 3D CAD tools to support designs such as, the design for 3D, to manufacture high performance 3D integrated circuits and reconfigurable FPGA-based systems. This book was written as a text that covers the foundations of 3D integrated system design and FPGA architecture design. It was written for the use in an elective or core course at the graduate level in field of Electrical Engineering, Computer Engineering and Doctoral Research programs. No previous background on 3D integration is required, nevertheless fundamental understanding of 2D CMOS VLSI design is required. It is assumed that reader has taken the core curriculum in Electrical Engineering or Computer Engineering, with courses like CMOS VLSI design, Digital System Design and Microelectronics Circuits being the most important. It is accessible for self-study by both senior students and professionals alike.