Nickel-Titanium Smart Hybrid Materials: From Micro- to Nano-structured Alloys for Emerging Applications describes advanced properties that can be adapted in NiTi-alloys. Nickel-Titanium (NiTi) systems are receiving wide demand in growing industries due to their smart, high-temperature or biocompatible behavior. These influenced behaviors are carefully described in the micro-scale and nanoscale range, with NiTi smart materials described on the basis of their shape memory effect (SME) and super-elastic (SE) properties for sensor and actuator application. This book discusses novel properties of nickel-titanium systems, helping materials scientists and engineers produce smart technologies and systems for the aeronautical, automobile, mechanical, healthcare and electronics industries. - Describes the use of nanotechnology and microtechnology in nickel-titanium-based systems - Outlines the major properties of Nickel-Titanium Nanoalloys - Assesses the major challenges of manufacturing nickel-titanium nanoalloys at an industrial scale

The theme for the November 2017 conference was Striving for 100% Success Rate. Papers focus on the tools and techniques needed for maximizing the success rate in every aspect of the electronic device failure analysis process.

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures. Case histories and review papers are included, as well as guides to new and unique tools and methodologies, applications and results.

The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Nanoelectronics is changing the way the world communicates, and is transforming our daily lives. Continuing Moore’s law and miniaturization of low-power semiconductor chips with ever-increasing functionality have been relentlessly driving R&D of new devices, materials, and process capabilities to meet performance, power, and cost requirements. This book covers up-to-date advances in research and industry practices in nanometrology, critical for continuing technology scaling and product innovation. It holistically approaches the subject matter and addresses emerging and important topics in semiconductor R&D and manufacturing. It is a complete guide for metrology and diagnostic techniques essential for process technology, electronics packaging, and product development and debugging—a unique approach compared to other books. The authors are from academia, government labs, and industry and have vast experience and expertise in the topics presented. The book is intended for all those involved in IC manufacturing and nanoelectronics and for those studying nanoelectronics process and assembly technologies or working in device testing, characterization, and diagnostic techniques.