An interdisciplinary group of materials scientists, physicists, chemists and engineers come together in this book to discuss recent advances in the structure and morphology of thin films. Both scientific and technological issues are addressed. Work on thin films for a host of applications including microelectronics, optics, tribology, biomedical technologies and microelectromechanical systems (MEMS) are featured. Topics include: kinetics of growth; grain growth; instabilities, segregation and ordering; silicides; metallization; stresses in thin films; deposition and growth simulations; energetic growth processes; diamond films and carbide and nitride films.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

By illustrating a wide range of specific applications in all major industries, this work broadens the coverage of X-ray diffraction beyond basic tenets, research and academic principles. The book serves as a guide to solving problems faced everyday in the laboratory, and offers a review of the current theory and practice of X-ray diffraction, major

Nanotechnology is a diverse science that has brought about new applications in fields such as colloidal science, device physics and supra molecular chemistry. This volume gives an overview of the development of nanomaterial applications in energy and power generation, medicine and healthcare, water purification, biotechnology, electronics, sporting goods, environmental issues, military defense, and textile/fabric industries. The text also explains the fundamentals of polymer nanocomposites and their industrial applications. Other chapters cover semiconductor applications of nanomaterials, nanomaterial synthesis, characterization of nanocomposites and uses of nanofillers. Readers will also find notes on the DFT study of II-VI semiconducting nano-clusters. This volume is intended to be an introductory reference for students and researchers undertaking advanced courses in materials science and engineering, giving readers a glimpse into the fascinating world of nanotechnology.

The inexorable drive for increased integrated circuit functionality and performance places growing demands on the metal and dielectric thin films used in fabricating these circuits, as well as spurring demand for new materials applications and processes. This book directly addresses issues of widespread concern in the microelectronics industry - smaller feature sizes, new materials and new applications that challenge the reliability of new technologies. While the book continues the focus on issues related to interconnect reliability, such as electromigration and stress, particular emphasis is placed on the effects of microstructure. An underlying theme is understanding the importance of interactions among different materials and associated interfaces comprising a single structure with dimensions near or below the micrometer scale. Topics include: adhesion and fracture; gate oxide growth and oxide interfaces; surface preparation and gate oxide reliability; oxide degradation and defects; micro-structure, texture and reliability; novel measurement techniques; interconnect performance and reliability modeling; electromigration and interconnect reliability and stress and stress relaxation.