This presentation discusses the thermal performance and reliability of bonded interfaces for power electronics packaging applications.

Thermal Management for Opto-electronics Packaging and Applications A systematic guide to the theory, applications, and design of thermal management for LED packaging In Thermal Management for Opto-electronics Packaging and Applications, a team of distinguished engineers and researchers deliver an authoritative discussion of the fundamental theory and practical design required for LED product development. Readers will get a solid grounding in thermal management strategies and find up-to-date coverage of heat transfer fundamentals, thermal modeling, and thermal simulation and design. The authors explain cooling technologies and testing techniques that will help the reader evaluate device performance and accelerate the design and manufacturing cycle. In this all-inclusive guide to LED package thermal management, the book provides the latest advances in thermal engineering design and opto-electronic devices and systems. The book also includes: A thorough introduction to thermal conduction and solutions, including discussions of thermal resistance and high thermal conductivity materials Comprehensive explorations of thermal radiation and solutions, including angular- and spectra-regulation radiative cooling Practical discussions of thermally enhanced thermal interfacial materials (TIMs) Complete treatments of hybrid thermal management in downhole devices Perfect for engineers, researchers, and industry professionals in the fields of LED packaging and heat transfer, Thermal Management for Opto-electronics Packaging and Applications will also benefit advanced students focusing on the design of LED product design.

Power Electronic Packaging presents an in-depth overview of power electronic packaging design, assembly,reliability and modeling. Since there is a drastic difference between IC fabrication and power electronic packaging, the book systematically introduces typical power electronic packaging design, assembly, reliability and failure analysis and material selection so readers can clearly understand each task's unique characteristics. Power electronic packaging is one of the fastest growing segments in the power electronic industry, due to the rapid growth of power integrated circuit (IC) fabrication, especially for applications like portable, consumer, home, computing and automotive electronics. This book also covers how advances in both semiconductor content and power advanced package design have helped cause advances in power device capability in recent years. The author extrapolates the most recent trends in the book's areas of focus to highlight where further improvement in materials and techniques can drive continued advancements, particularly in thermal management, usability, efficiency, reliability and overall cost of power semiconductor solutions.

The book presents interesting topics from the area of modeling and simulation of electric vehicles application. The results presented by the authors of the book chapters are very interesting and inspiring. The book will familiarize the readers with the solutions and enable the readers to enlarge them by their own research. It will be useful for students of Electrical Engineering; it helps them solve practical problems.

Review of the Research Program of the U.S. DRIVE Partnership: Fifth Report follows on four previous reviews of the FreedomCAR and Fuel Partnership, which was the predecessor of the U.S. DRIVE Partnership. The U.S. DRIVE (Driving Research and Innovation for Vehicle Efficiency and Energy Sustainability) vision, according to the charter of the Partnership, is this: American consumers have a broad range of affordable personal transportation choices that reduce petroleum consumption and significantly reduce harmful emissions from the transportation sector. Its mission is as follows: accelerate the development of pre-competitive and innovative technologies to enable a full range of efficient and clean advanced light-duty vehicles (LDVs), as well as related energy infrastructure. The Partnership focuses on precompetitive research and development (R&D) that can help to accelerate the emergence of advanced technologies to be commercialization-feasible. The guidance for the work of the U.S. DRIVE Partnership as well as the priority setting and targets for needed research are provided by joint industry/government technical teams. This structure has been demonstrated to be an effective means of identifying high-priority, long-term precompetitive research needs for each technology with which the Partnership is involved. Technical areas in which research and development as well as technology validation programs have been pursued include the following: internal combustion engines (ICEs) potentially operating on conventional and various alternative fuels, automotive fuel cell power systems, hydrogen storage systems (especially onboard vehicles), batteries and other forms of electrochemical energy storage, electric propulsion systems, hydrogen production and delivery, and materials leading to vehicle weight reductions.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.

Power Electronics Handbook, Fourth Edition, brings together over 100 years of combined experience in the specialist areas of power engineering to offer a fully revised and updated expert guide to total power solutions. Designed to provide the best technical and most commercially viable solutions available, this handbook undertakes any or all aspects of a project requiring specialist design, installation, commissioning and maintenance services. Comprising a complete revision throughout and enhanced chapters on semiconductor diodes and transistors and thyristors, this volume includes renewable resource content useful for the new generation of engineering professionals. This market leading reference has new chapters covering electric traction theory and motors and wide band gap (WBG) materials and devices. With this book in hand, engineers will be able to execute design, analysis and evaluation of assigned projects using sound engineering principles and adhering to the business policies and product/program requirements. - Includes a list of leading international academic and professional contributors - Offers practical concepts and developments for laboratory test plans - Includes new technical chapters on electric vehicle charging and traction theory and motors - Includes renewable resource content useful for the new generation of engineering professionals