Thermal Management of Electronic Systems II
Title | Thermal Management of Electronic Systems II PDF eBook |
Author | E. Beyne |
Publisher | Springer Science & Business Media |
Pages | 358 |
Release | 2012-12-06 |
Genre | Technology & Engineering |
ISBN | 9401155062 |
For the second time, the Eurotherm Committee has chosen Thermal Managment of Electronic Systems as the subject for its 45th Seminar, held at IMEC in Leuven, Belgium, from 20 to 22 September 1995. After the successfui first edition of this seminar in Delft, June 14-16, 1993, it was decided to repeat this event on a two year basis. This volume constitutes the edited proceedings of the Seminar. Thermal management of electronic systems is gaining importance. Whereas a few years ago papers on this subject where mainly devoted to applications in high end markets, such as mainframes and telecommunication switching equipment, we see a growing importance in the "lower" end applications. This may be understood from the growing impact of electronics on every day life, from car electronics, GSM phones, personal computers to electronic games. These applications add new requirements to the thermal design. The thermal problem and the applicable cooling strategies are quite different from those in high end products. In this seminar the latest developments in many of the different aspects of the thermal design of electronic systems were discussed. Particular attention was given to thermal modelling, experimental characterisation and the impact of thermal design on the reliability of electronic systems.
Heat Transfer
Title | Heat Transfer PDF eBook |
Author | Younes Shabany |
Publisher | CRC Press |
Pages | 526 |
Release | 2009-12-17 |
Genre | Science |
ISBN | 1439814686 |
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Thermal Management of Electronic Systems
Title | Thermal Management of Electronic Systems PDF eBook |
Author | C.J. Hoogendoorn |
Publisher | Springer Science & Business Media |
Pages | 334 |
Release | 2012-12-06 |
Genre | Technology & Engineering |
ISBN | 9401110824 |
The Eurotherm Committee has chosen Thermal Management of Electronic Systems as the subject of its 29th Seminar, at Delft University of Technology, the Netherlands, 14-16 June 1993. This volume constitutes the proceedings of the Seminar. Thermal Management is but one of the several critical topics in the design of electronic systems. However, as a result of the combined effects of increasing heat fluxes, miniaturisation and the striving for zero defects, preferably in less time and at a lower cost than before, thermal management has become an increasingly tough challenge. Therefore, it is being increasingly recognised that cooling requirements could eventually hamper the technical progress in miniaturisation. It might be argued that we are on the verge of a revolution in thermal management techniques. Previously, a packaging engineer had no way of predicting the tempera tures of critical electronic parts with the required accuracy. He or she· had to rely on full-scale experiments, doubtful design rules, or worst-case estimates. This situation is going to be changed in the foreseeable future. User-friendly software tools, the acquisition and integrity of input and output data, the badly needed training mea sures, the introduction into a concurrent engineering environment: all these items will exert a heavy toll on the flexibility of the electronics industries. Fortunately, this situation is being realised at the appropriate management levels, and the interest in this seminar and the pre-conference tutorials testifies to this assertion.
Cooling of Electronic Systems
Title | Cooling of Electronic Systems PDF eBook |
Author | Sadik Kakaç |
Publisher | Springer Science & Business Media |
Pages | 953 |
Release | 2012-12-06 |
Genre | Technology & Engineering |
ISBN | 9401110905 |
Electronic technology is developing rapidly and, with it, the problems associated with the cooling of microelectronic equipment are becoming increasingly complex. So much so that it is necessary for experts in the fluid and thermal sciences to become involved with the cooling problem. Such thoughts as these led to an approach to leading specialists with a request to contribute to the present book. Cooling of Electronic Systems presents the technical progress achieved in the fundamentals of the thermal management of electronic systems and thermal strategies for the design of microelectronic equipment. The book starts with an introduction to the cooling of electronic systems, involving such topics as trends in computer system cooling, the cooling of high performance computers, thermal design of microelectronic components, natural and forced convection cooling, cooling by impinging air and liquid jets, thermal control systems for high speed computers, together with a detailed review of advances in manufacturing and assembly technology. Following this, practical methods for the determination of the parameters required for the thermal analysis of electronic systems and the accurate prediction of temperature in consumer electronics. Cooling of Electronic Systems is currently the most up-to-date book on the thermal management of electronic and microelectronic equipment, and the subject is presented by eminent scientists and experts in the field. Vital reading for all designers of modern, high-speed computers.
Thermal Management of Electronics, Volume II
Title | Thermal Management of Electronics, Volume II PDF eBook |
Author | Rajesh Baby |
Publisher | Momentum Press |
Pages | 167 |
Release | 2019-04-03 |
Genre | Technology & Engineering |
ISBN | 1949449424 |
Phase change material (PCM)-based composite heat sinks have attracted great interest in recent decades, especially in the context of thermal management of portable electronic devices such as mobile phones, digital cameras, personal digital assistants, and notebooks. In this monograph, a detailed analysis of plate fin heat sinks and plate fin heat sink matrix is presented, based on in-house experiments. Performance benchmarks are articulated and presented for these heat sinks. The state of the art in the development of PCM-based heat sinks and the challenges are outlined, and directions on future development are provided. It is our sincere hope and trust that this book will not only be informative but also awaken curiosity and inspire thermal management solution seekers to delve deep into the ocean of research in PCM-based heat sinks and discover their own pearls and diamonds.
Heat Pipes
Title | Heat Pipes PDF eBook |
Author | David Reay |
Publisher | Butterworth-Heinemann |
Pages | 280 |
Release | 2013-10-01 |
Genre | Technology & Engineering |
ISBN | 0080982794 |
Heat Pipes, Sixth Edition, takes a highly practical approach to the design and selection of heat pipes, making it an essential guide for practicing engineers and an ideal text for postgraduate students.This new edition has been revised to include new information on the underlying theory of heat pipes and heat transfer, and features fully updated applications, new data sections, and updated chapters on design and electronics cooling. The book is a useful reference for those with experience and an accessible introduction for those approaching the topic for the first time. - Contains all information required to design and manufacture a heat pipe - Suitable for use as a professional reference and graduate text - Revised with greater coverage of key electronic cooling applications
Thermal Management Handbook: For Electronic Assemblies
Title | Thermal Management Handbook: For Electronic Assemblies PDF eBook |
Author | Jerry E. Sergent |
Publisher | McGraw Hill Professional |
Pages | 370 |
Release | 1998 |
Genre | Science |
ISBN | 9780070266995 |
Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. The "hands-on" guide to thermal management! In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.