The International Thermal Conductivity Conference was started in 1961 with the initiative of Mr. Charles F. Lucks, who passed away on 8 July 1982 and to the memory of whom this volume is dedicated. These Conferences on thermal conductivity grew out of the needs of researchers in the field. The Conferences were held annu ally from 1961 to 1973 and have been held biennially since 1975 when our Center for Information and Numerical Data Analysis and Synthesis (CINDAS) of Purdue University became the Permanent Sponsor of the Conferences. These Conferences provide a broadly based forum for researchers actively working on the thermal conduc tivity and closely related properties to convene on a regular basis to exchange their ideas and experiences and report their findings and results. The Conferences have been self-perpetuating and are an example of how a technical community with a common purpose can transcend the invisible, artificial barriers between disciplines and gather together in increasing numbers without the need of national pub licity and continuing funding support, when they see something worthwhile going on. It is believed that this series of Conferences not only will grow stronger, but will set an example for research ers in other fields on how to jointly attack their own problem areas.

Handbook of Thermal Conductivity of Liquids and Gases covers practically all of the data available on the thermalconductivity of pure liquids and gases. Thermal conductivity data included in the book is based on original experimental measurements and correlations recommended or adopted as a standard by the National Standard Reference Data Service of the Russian Federation. New tabulations of thermal conductivity data on high-molecular organic fluids and the alkali metals in both liquid and gaseous states are featured as well. This book will be an important reference for all researchers working in thermodynamics.

This book is intended to provide a deep understanding on the advanced treatments of thermal properties of materials through experimental, theoretical, and computational techniques. This area of interest is being taught in most universities and institutions at the graduate and postgraduate levels. Moreover, the increasing modern technical and social interest in energy has made the study of thermal properties more significant and exciting in the recent years. This book shares with the international community a sense of global motivation and collaboration on the subject of thermal conductivity and its wide spread applications in modern technologies. This book presents new results from leading laboratories and researchers on topics including materials, thermal insulation, modeling, steady and transient measurements, and thermal expansion. The materials of interest range from nanometers to meters, bringing together ideas and results from across the research field.

This long awaited second edition of a popular textbook has a simple and direct approach to the diversity and complexity of food processing. It explains the principles of operations and illustrates them by individual processes. The new edition has been enlarged to include sections on freezing, drying, psychrometry, and a completely new section on mechanical refrigeration. All the units have been converted to SI measure. Each chapter contains unworked examples to help the student gain a grasp of the subject, and although primarily intended for the student food technologist or process engineer, this book will also be useful to technical workers in the food industry