In this book, Nigel Oxley describes fully the techniques of etching and aquatint employed by the artists who worked with him at Kelpra Studio where he established a reputation for using intaglio processes to create full colour images. Dame Elisabeth Frink, John Piper, John Hoyland, Jim Dine and Patrick Heron are illustrated within and the use of multi-plates is written with great detail. The author introduced the use of carborundum and polymer plates to the studio and the book includes step-by-step descriptions of these techniques. Having editioned for many years the author relates his experience of complex colour and plate combinations clearly enabling the reader to hav comprehensive insight to the work of the many artists illustrated within this book. This book is a valuable practical guide for the beginner and for those wishing to develop their printing and etching skills. For those interested in printmaking it provides a unique insight into the demands of a professional print.

This publication presents cleaning and etching solutions, their applications, and results on inorganic materials. It is a comprehensive collection of etching and cleaning solutions in a single source. Chemical formulas are presented in one of three standard formats - general, electrolytic or ionized gas formats - to insure inclusion of all necessary operational data as shown in references that accompany each numbered formula. The book describes other applications of specific solutions, including their use on other metals or metallic compounds. Physical properties, association of natural and man-made minerals, and materials are shown in relationship to crystal structure, special processing techniques and solid state devices and assemblies fabricated. This publication also presents a number of organic materials which are widely used in handling and general processing...waxes, plastics, and lacquers for example. It is useful to individuals involved in study, development, and processing of metals and metallic compounds. It is invaluable for readers from the college level to industrial R & D and full-scale device fabrication, testing and sales. Scientific disciplines, work areas and individuals with great interest include: chemistry, physics, metallurgy, geology, solid state, ceramic and glass, research libraries, individuals dealing with chemical processing of inorganic materials, societies and schools.

Etching can seem mysterious and inaccessible, but this practical book guides you through the process to reveal the potential of this distinctive means of creating artists' prints. With clear instructions and visual guides, it explains the many ways that marks are first made on a metal plate before ink is applied and the image transferred onto a sheet of paper. The book goes on to introduce a broad menu of techniques, allowing the visual artist to develop a uniquely personal approach. Explanations are given for photo-etching, aquatint, as well as related intaglio processes such as drypoint and photopolymer. This new book encourages artists to experiment and try combining techniques to explore their potential, and includes interviews with leading artists explaining their approaches.

Pattern transfer by dry etching and plasma-enhanced chemical vapor de position are two of the cornerstone techniques for modern integrated cir cuit fabrication. The success of these methods has also sparked interest in their application to other techniques, such as surface-micromachined sen sors, read/write heads for data storage and magnetic random access memory (MRAM). The extremely complex chemistry and physics of plasmas and their interactions with the exposed surfaces of semiconductors and other materi als is often overlooked at the manufacturing stage. In this case, the process is optimized by an informed "trial-and-error" approach which relies heavily on design-of-experiment techniques and the intuition of the process engineer. The need for regular cleaning of plasma reactors to remove built-up reaction or precursor gas products adds an extra degree of complexity because the interaction of the reactive species in the plasma with the reactor walls can also have a strong effect on the number of these species available for etching or deposition. Since the microelectronics industry depends on having high process yields at each step of the fabrication process, it is imperative that a full understanding of plasma etching and deposition techniques be achieved.