Proceedings of SPIE present the original research papers presented at SPIE conferences and other high-quality conferences in the broad-ranging fields of optics and photonics. These books provide prompt access to the latest innovations in research and technology in their respective fields. Proceedings of SPIE are among the most cited references in patent literature.

The main reason for the premature breakdown of today's electronic products (computers, cars, tools, appliances, etc.) is the failure of the components used to build these products. Today professionals are looking for effective ways to minimize the degradation of electronic components to help ensure longer-lasting, more technically sound products and systems. This practical book offers engineers specific guidance on how to design more reliable components and build more reliable electronic systems. Professionals learn how to optimize a virtual component prototype, accurately monitor product reliability during the entire production process, and add the burn-in and selection procedures that are the most appropriate for the intended applications. Moreover, the book helps system designers ensure that all components are correctly applied, margins are adequate, wear-out failure modes are prevented during the expected duration of life, and system interfaces cannot lead to failure.

The successful launch of viable MEMs product hinges on MEMS reliability, the reliability and qualification for MEMs based products is not widely understood. Companies that have a deep understanding of MEMs reliability view the information as a competitive advantage and are reluctant to share it. MEMs Reliability, focuses on the reliability and manufacturability of MEMS at a fundamental level by addressing process development and characterization, material property characterization, failure mechanisms and physics of failure (POF), design strategies for improving yield, design for reliability (DFR), packaging and testing.

In recent years microelectromechanical systems (MEMS) have emerged as a new technology with enormous application potential. MEMS manufacturing techniques are essentially the same as those used in the semiconductor industry, therefore they can be produced in large quantities at low cost. The added benefits of lightweight, miniature size and low energy consumption make MEMS commercialization very attractive. Modeling and simulation is an indispensable tool in the process of studying these new dynamic phenomena, development of new microdevices and improvement of the existing designs. MEMS technology is inherently multidisciplinary since operation of microdevices involves interaction of several energy domains of different physical nature, for example, mechanical, fluidic and electric forces. Dynamic behavior of contact-type electrostatic microactuators, such as a microswitches, is determined by nonlinear fluidic-structural, electrostatic-structural and vibro-impact interactions. The latter is particularly important: Therefore it is crucial to develop accurate computational models for numerical analysis of the aforementioned interactions in order to better understand coupled-field effects, study important system dynamic characteristics and thereby formulate guidelines for the development of more reliable microdevices with enhanced performance, reliability and functionality.

Where conventional testing and inspection techniques fail at the microscale, optical techniques provide a fast, robust, noninvasive, and relatively inexpensive alternative for investigating the properties and quality of microsystems. Speed, reliability, and cost are critical factors in the continued scale-up of microsystems technology across many industries, and optical techniques are in a unique position to satisfy modern commercial and industrial demands. Optical Inspection of Microsystems, Second Edition, extends and updates the first comprehensive survey of the most important optical measurement techniques to be successfully used for the inspection of microsystems. Under the guidance of accomplished researcher Wolfgang Osten, expert contributors from industrial and academic institutions around the world share their expertise and experience with techniques such as image processing, image correlation, light scattering, scanning probe microscopy, confocal microscopy, fringe projection, grid and moire techniques, interference microscopy, laser-Doppler vibrometry, digital holography, speckle metrology, spectroscopy, and sensor fusion technologies. They also examine modern approaches to data acquisition and processing, such as the determination of surface features and the estimation of uncertainty of measurement results. The book emphasizes the evaluation of various system properties and considers encapsulated components to increase quality and reliability. Numerous practical examples and illustrations of optical testing reinforce the concepts. Supplying effective tools for increased quality and reliability, this book Provides a comprehensive, up-to-date overview of optical techniques for the measurement and inspection of microsystems Discusses image correlation, displacement and strain measurement, electro-optic holography, and speckle metrology techniques Offers numerous practical examples and illustrations Includes calibration of optical measurement systems for the inspection of MEMS Presents the characterization of dynamics of MEMS

Recent advances in power electronics greatly benefit the multidisciplinary field of modern ultrasonics. More powerful, compact, and versatile electronic chips and software enable new computer-based devices for real-time data capture, storage, analysis, and display and advance the science and technology employed in commercial systems and applications of ultrasound. Reviewing the scientific basis behind these improvements, Ultrasonics: Fundamentals, Technologies, and Applications, Third Edition discusses them in detail, with new and additional figures and references, offering a completely revised and expanded examination of the state of modern ultrasonics. This new edition of a bestselling industry reference discusses the full breadth of ultrasonics applications for industrial and medical use and provides the fundamentals and insights gathered over the authors’ collective 80 years in the field. It provides a unique and comprehensive treatment of the science and technology behind the latest advancements and applications in both low and high power implementations. Coverage combines fundamental physics, a review and analysis of sensors and transducers, and the systems required for the full spectrum of industrial, nondestructive testing and medical and biomedical uses. It includes citations of numerous references and covers both main stream and the more unusual and obscure applications of ultrasound. Ultrasonics is ubiquitous in its industrial applications for sensing, NDT, and process measurements, in high power forms for processing and sonochemistry, as well as in medical procedures where it is used for diagnosis, therapy and surgery. This book provides a complete overview of the field, presenting numerous applications, cutting-edge advancements and improvements, additional figures and references, and a look at future directions.

Structural health monitoring (SHM) uses one or more in situ sensing systems placed in or around a structure, providing real-time evaluation of its performance and ultimately preventing structural failure. Although most commonly used in civil engineering, such as in roads, bridges, and dams, SHM is now finding applications in other engineering envir