Silicide Technology for Integrated Circuits
Title | Silicide Technology for Integrated Circuits PDF eBook |
Author | Institution of Electrical Engineers |
Publisher | IET |
Pages | 302 |
Release | 2004-12-21 |
Genre | Social Science |
ISBN | 9780863413520 |
This is the first book to provide guidance on the development and application of metal silicide technology as it emerges from the scientific to the prototype and manufacturing stages. Other key topics covered are fundamentals, present and future silicide technology for Si-based devices, and characterisation methods. Suitable for engineers and students in microelectronics.
Technology of Integrated Circuits
Title | Technology of Integrated Circuits PDF eBook |
Author | D. Widmann |
Publisher | Springer Science & Business Media |
Pages | 355 |
Release | 2013-03-09 |
Genre | Technology & Engineering |
ISBN | 366204160X |
This is the first book to comprehensively record the authors’ authoritative knowledge and practical experience of IC manufacturing, including the tremendous developments of recent years. With its strong application orientation, this is a must-have book for professionals in semiconductor industries.
Invention of Integrated Circuits
Title | Invention of Integrated Circuits PDF eBook |
Author | Arjun N. Saxena |
Publisher | World Scientific |
Pages | 564 |
Release | 2009 |
Genre | Technology & Engineering |
ISBN | 9812814469 |
This book is the first to give an authoritative and comprehensive account of the invention of Integrated Circuits (ICs) from an insider who had participated and contributed from the beginning of their invention and advancement to the Ultra Large Scale ICs (ULSICs) of today. It reads like a mystery novel to engross the reader, but it is not based on fiction; it gives documented facts of the invention of ICs, analyzes the patents, and highlights additional details and clarifications of their history.
High Speed Integrated Circuit Technology - Towards 100 Ghz Logic
Title | High Speed Integrated Circuit Technology - Towards 100 Ghz Logic PDF eBook |
Author | Mark Rodwell |
Publisher | World Scientific |
Pages | 372 |
Release | 2001-04-24 |
Genre | Technology & Engineering |
ISBN | 9814490938 |
This book reviews the state of the art of very high speed digital integrated circuits. Commercial applications are in fiber optic transmission systems operating at 10, 40, and 100 Gb/s, while the military application is ADCs and DACs for microwave radar. The book contains detailed descriptions of the design, fabrication, and performance of wideband Si/SiGe-, GaAs-, and InP-based bipolar transistors. The analysis, design, and performance of high speed CMOS, silicon bipolar, and III-V digital ICs are presented in detail, with emphasis on application in optical fiber transmission and mixed signal ICs. The underlying physics and circuit design of rapid single flux quantum (RSFQ) superconducting logic circuits are reviewed, and there is extensive coverage of recent integrated circuit results in this technology.
Integrated Circuit Design and Technology
Title | Integrated Circuit Design and Technology PDF eBook |
Author | M. J. Morant |
Publisher | Springer |
Pages | 199 |
Release | 2013-12-01 |
Genre | Technology & Engineering |
ISBN | 148997198X |
Radio Frequency Integrated Circuits and Technologies
Title | Radio Frequency Integrated Circuits and Technologies PDF eBook |
Author | Frank Ellinger |
Publisher | Springer Science & Business Media |
Pages | 523 |
Release | 2008-09-11 |
Genre | Technology & Engineering |
ISBN | 3540693254 |
The striking feature of this book is its coverage of the upper GHz domain. However, the latest technologies, applications and broad range of circuits are discussed. Design examples are provided including cookbook-like optimization strategies. This state-of-the-art book is valuable for researchers as well as for engineers in industry. Furthermore, the book serves as fruitful basis for lectures in the area of IC design.
Handbook of 3D Integration, Volume 1
Title | Handbook of 3D Integration, Volume 1 PDF eBook |
Author | Philip Garrou |
Publisher | John Wiley & Sons |
Pages | 798 |
Release | 2011-09-22 |
Genre | Technology & Engineering |
ISBN | 352762306X |
The first encompassing treatise of this new, but very important field puts the known physical limitations for classic 2D electronics into perspective with the requirements for further electronics developments and market necessities. This two-volume handbook presents 3D solutions to the feature density problem, addressing all important issues, such as wafer processing, die bonding, packaging technology, and thermal aspects. It begins with an introductory part, which defines necessary goals, existing issues and relates 3D integration to the semiconductor roadmap of the industry. Before going on to cover processing technology and 3D structure fabrication strategies in detail. This is followed by fields of application and a look at the future of 3D integration. The contributions come from key players in the field, from both academia and industry, including such companies as Lincoln Labs, Fraunhofer, RPI, ASET, IMEC, CEA-LETI, IBM, and Renesas.