System-in-Package
Title | System-in-Package PDF eBook |
Author | Lei He |
Publisher | Now Publishers Inc |
Pages | 93 |
Release | 2011-06-20 |
Genre | Computers |
ISBN | 1601984588 |
Surveys the electrical and layout perspectives of System-in-Package, the system integration technology that has emerged as a required technology to reduce the system board space and height in addition to the overall time-to-market and design cost of consumer electronics products such as those of cell phones, audio/video players and digital cameras.
System on Package
Title | System on Package PDF eBook |
Author | Rao Tummala |
Publisher | McGraw Hill Professional |
Pages | 807 |
Release | 2007-07-22 |
Genre | Technology & Engineering |
ISBN | 0071593322 |
System-on-Package (SOP) is an emerging microelectronic technology that places an entire system on a single chip-size package. Where “systems” used to be bulky boxes housing hundreds of components, SOP saves interconnection time and heat generation by keep a full system with computing, communications, and consumer functions all in a single chip. Written by the Georgia Tech developers of the technology, this book explains the basic parameters, design functions, and manufacturing issues, showing electronic designers how this radical new packaging technology can be used to solve pressing electronics design challenges.
SiP System-in-Package Design and Simulation
Title | SiP System-in-Package Design and Simulation PDF eBook |
Author | Suny Li (Li Yang) |
Publisher | John Wiley & Sons |
Pages | 507 |
Release | 2017-07-12 |
Genre | Technology & Engineering |
ISBN | 1119046017 |
An advanced reference documenting, in detail, every step of a real System-in-Package (SiP) design flow Written by an engineer at the leading edge of SiP design and implementation, this book demonstrates how to design SiPs using Mentor EE Flow. Key topics covered include wire bonding, die stacks, cavity, flip chip and RDL (redistribution layer), Embedded Passive, RF design, concurrent design, Xtreme design, 3D real-time DRC (design rule checking), and SiP manufacture. Extensively illustrated throughout, System in Package Design and Simulation covers an array of issues of vital concern for SiP design and fabrication electronics engineers, as well as SiP users, including: Cavity and sacked dies design FlipChip and RDL design Routing and coppering 3D Real-Time DRC check SiP simulation technology Mentor SiP Design and Simulation Platform Designed to function equally well as a reference, tutorial, and self-study, System in Package Design and Simulation is an indispensable working resource for every SiP designer, especially those who use Mentor design tools.
Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz
Title | Low Temperature Co-fired Ceramics for System-in-Package Applications at 122 GHz PDF eBook |
Author | Bhutani, Akanksha |
Publisher | KIT Scientific Publishing |
Pages | 254 |
Release | 2019-10-17 |
Genre | Technology & Engineering |
ISBN | 3731509458 |
Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces
Title | Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces PDF eBook |
Author | Beth Keser |
Publisher | John Wiley & Sons |
Pages | 324 |
Release | 2021-12-29 |
Genre | Technology & Engineering |
ISBN | 1119793777 |
Discover an up-to-date exploration of Embedded and Fan-Out Waver and Panel Level technologies In Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces: High Performance Compute and System-in-Package, a team of accomplished semiconductor experts delivers an in-depth treatment of various fan-out and embedded die approaches. The book begins with a market analysis of the latest technology trends in Fan-Out and Wafer Level Packaging before moving on to a cost analysis of these solutions. The contributors discuss the new package types for advanced application spaces being created by companies like TSMC, Deca Technologies, and ASE Group. Finally, emerging technologies from academia are explored. Embedded and Fan-Out Wafer and Panel Level Packaging Technologies for Advanced Application Spaces is an indispensable resource for microelectronic package engineers, managers, and decision makers working with OEMs and IDMs. It is also a must-read for professors and graduate students working in microelectronics packaging research.
Packaging Sustainability
Title | Packaging Sustainability PDF eBook |
Author | Wendy Jedlicka |
Publisher | John Wiley & Sons |
Pages | 370 |
Release | 2015-03-05 |
Genre | Design |
ISBN | 111910386X |
Packaging Sustainability Take the lead with sustainable package design solutions The classic role of packaging is to “Protect, Inform, and Sell.” Today, packaging must do all that—but with minimal eco-impact. Packaging Sustainability: Tools, Systems, and Strategies for Innovative Package Design is a comprehensive guide to thinking outside the box to create practical, cost-effective, and eco-responsible packaging. With a broad range of contributions from pioneers of sustainability, Packaging Sustainability not only describes the concepts of sustainability but reveals the logic behind them, providing you with the tools to sift through and adapt to the ever changing barrage of materials, services, regulations, and mandates. The book: Enables the designer to make smart, informed decisions at all points throughout the packaging design process Offers a comprehensive overview of sustainable packaging design issues from leading practitioners, designers, engineers, marketers, psychologists, and ecologists Describes materials and processes in current use and helps the reader understand how they interconnect With solid information and actionable ideas, Packaging Sustainability gives you all the tools for maximizing a product’s shelf impact—while minimizing its ecological footprint.
System-in-package RF Design and Applications
Title | System-in-package RF Design and Applications PDF eBook |
Author | Michael P. Gaynor |
Publisher | Artech House Publishers |
Pages | 0 |
Release | 2007 |
Genre | Engineering |
ISBN | 9781580539050 |
In the past few years, System in Package (SiP) design has fueled a revolution in the use of modules in wireless devices due its effectiveness in meeting the increasingly demanding requirements for reliability, shielding, performance, size, and cost. Here's the first comprehensive resource on SiP design techniques that offers designers state-of-the-art packaging know-how. Moreover, the book provides numerous examples that illustrate real-world capabilities, constraints, trade-offs, and options at every step.