he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.

he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.

he very name application-specific integrated circuit, or ASIC, con T notes an ability to provide a dense package for a highly complex design targeted at a focused, often complex solution. The ability to create customized high-performance designs has come of age, facilitated by so phisticated tools that enable designers to cope with ever-increasing de mands for added product functionality, features, and complexity. Most designers are trained in the traditional methods of approaching complex digital electronics with standard parts but have little, if any, exposure to custom or even semicustom integrated circuit design. Most see only a broad survey of IC technology. This book is targeted at the new ASIC designer who is getting ready to tackle that first ASIC design and is concerned about the unknowns that lie ahead. Economic and perfor mance considerations as well as tool capability and process fabrication quality have evolved to the point where consideration of ASIC design is now commonplace in an ever-increasing number of electronic systems designs. Engineers are now given the challenge of coping not only with new technologies but with new design methodologies that are fundamen tally necessary and advantageous to support new competitive high-tech products. Laypeople and engineers alike have marveled at the advances made over the years in electronics' complexity, performance, density, and cost. The migration of systems to modules to boards to integrated circuits clearly underscores the radical transition that the physical incarnation of electronics has undergone.

This book is the second of two volumes addressing the design challenges associated with new generations of semiconductor technology. The various chapters are compiled from tutorials presented at workshops in recent years by prominent authors from all over the world. Technology, productivity and quality are the main aspects under consideration to establish the major requirements for the design and test of upcoming systems on a chip.

The field of application-specific integrated circuits (ASICs) is fast-paced being at the very forefront of modern nanoscale fabrication and presents a deeply engaging career path. ASICs can provide us with high-speed computation in the case of digital circuits. For example, central processing units, graphics processing units, field-programmable gate arrays, and custom-made digital signal processors are examples of ASICs and the transistors they are fabricated from. We can use that same technology complementary metal-oxide semiconductor processes to implement high-precision sensing of or interfacing to the world through analog-to-digital converters, digital-to-analog converters, custom image sensors, and highly integrated micron-scale sensors such as magnetometers, accelerometers, and microelectromechanical machines. ASIC technologies now transitioning toward magneto-resistive and phase-changing materials also offer digital memory capacities that have aided our technological progress. Combining these domains, we have moved toward big data analytics and the new era of artificial intelligence and machine learning. This book provides a small selection of chapters covering aspects of ASIC development and the surrounding business model.

Achieving first-time success is crucial in the ASIC design league considering the soaring cost, tight time-to-market window, and competitive business environment. One key factor in ensuring first-time success is a well-defined ASIC design methodology. Here we propose a novel ASIC design methodology that has been proven for the RUMPS401 (Rahman University Multi-Processor System 401) Multiprocessor System-on-Chip (MPSoC) project. The MPSoC project is initiated by Universiti Tunku Abdul Rahman (UTAR) VLSI design center. The proposed methodology includes the use of Universal Verification Methodology (UVM). The use of electronic design automation (EDA) software during each step of the design methodology is also presented. The first-time success RUMPS401 demonstrates the use of the proposed ASIC design methodology and the good of using one. Especially this project is carried on in educational environment that is even more limited in budget, resources and know-how, compared to the business and industrial counterparts. Here a novel ASIC design methodology that is tailored to first-time success MPSoC is presented.