In the past decade, substrate noise has had a constant and significant impact on the design of analog and mixed-signal integrated circuits. Only recently, with advances in chip miniaturization and innovative circuit design, has substrate noise begun to plague fully digital circuits as well. To combat the effects of substrate noise, heavily over-designed structures are generally adopted, thus seriously limiting the advantages of innovative technologies. Substrate Noise: Analysis and Optimization for IC Design addresses the main problems posed by substrate noise from both an IC and a CAD designer perspective. The effects of substrate noise on performance in digital, analog, and mixed-signal circuits are presented, along with the mechanisms underlying noise generation, injection, and transport. Popular solutions to the substrate noise problem and the trade-offs often debated by designers are extensively discussed. Non-traditional approaches as well as semi-automated techniques to combat substrate noise are also addressed. Substrate Noise: Analysis and Optimization for IC Design will be of interest to researchers and professionals interested in signal integrity, as well as to mixed signal and RF designers.

This book is the first in a series of three dedicated to advanced topics in Mixed-Signal IC design methodologies. It is one of the results achieved by the Mixed-Signal Design Cluster, an initiative launched in 1998 as part of the TARDIS project, funded by the European Commission within the ESPRIT-IV Framework. This initiative aims to promote the development of new design and test methodologies for Mixed-Signal ICs, and to accelerate their adoption by industrial users. As Microelectronics evolves, Mixed-Signal techniques are gaining a significant importance due to the wide spread of applications where an analog front-end is needed to drive a complex digital-processing subsystem. In this sense, Analog and Mixed-Signal circuits are recognized as a bottleneck for the market acceptance of Systems-On-Chip, because of the inherent difficulties involved in the design and test of these circuits. Specially, problems arising from the use of a common substrate for analog and digital components are a main limiting factor. The Mixed-Signal Cluster has been formed by a group of 11 Research and Development projects, plus a specific action to promote the dissemination of design methodologies, techniques, and supporting tools developed within the Cluster projects. The whole action, ending in July 2002, has been assigned an overall budget of more than 8 million EURO.

This book presents case studies to illustrate that careful modeling of the assembly characteristics and layout details is required to bring simulations and measurements into agreement. Engineers learn how to use a proper combination of isolation structures and circuit techniques to make analog/RF circuits more immune to substrate noise. Topics include substrate noise propagation, passive isolation structures, noise couple in active devices, measuring the coupling mechanisms in analog/RF circuits, prediction of the impact of substrate noise on analog/RF circuits, and noise coupling in analog/RF systems.

This textbook provides readers with a comprehensive introduction to various noise sources that significantly reduce performance and reliability in nanometer-scale integrated circuits. The author covers different types of noise, such as crosstalk noise caused by signal switching of adjacent wires, power supply noise or IR voltage drop in the power line due to simultaneous buffer / gate switching events, substrate coupling noise, radiation-induced transients, thermally induced noise and noise due to process and environmental Coverages also includes the relationship between some of these noise sources, as well as compound effects, and modeling and mitigation of noise mechanisms.

One of the main trends of microelectronics is toward design for integrated systems, i.e., system-on-a-chip (SoC) or system-on-silicon (SoS). Due to this development, design techniques for mixed-signal circuits become more important than before. Among other devices, analog-to-digital and digital-to-analog converters are the two bridges between the analog and the digital worlds. Besides, low-power design technique is one of the main issues for embedded systems, especially for hand-held applications. Modular Low-Power, High-Speed CMOS Analog-to-Digital Converter for Embedded Systems aims at design techniques for low-power, high-speed analog-to-digital converter processed by the standard CMOS technology. Additionally this book covers physical integration issues of A/D converter integrated in SoC, i.e., substrate crosstalk and reference voltage network design.

Presenting a comprehensive overview of the design automation algorithms, tools, and methodologies used to design integrated circuits, the Electronic Design Automation for Integrated Circuits Handbook is available in two volumes. The second volume, EDA for IC Implementation, Circuit Design, and Process Technology, thoroughly examines real-time logic to GDSII (a file format used to transfer data of semiconductor physical layout), analog/mixed signal design, physical verification, and technology CAD (TCAD). Chapters contributed by leading experts authoritatively discuss design for manufacturability at the nanoscale, power supply network design and analysis, design modeling, and much more. Save on the complete set.

Noise Coupling is the root-cause of the majority of Systems on Chip (SoC) product fails. The book discusses a breakthrough substrate coupling analysis flow and modelling toolset, addressing the needs of the design community. The flow provides capability to analyze noise components, propagating through the substrate, the parasitic interconnects and the package. Using this book, the reader can analyze and avoid complex noise coupling that degrades RF and mixed signal design performance, while reducing the need for conservative design practices. With chapters written by leading international experts in the field, novel methodologies are provided to identify noise coupling in silicon. It additionally features case studies that can be found in any modern CMOS SoC product for mobile communications, automotive applications and readout front ends.