The thermal processing of materials ranges from few fem to seconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.

The thermal processing of materials ranges from few fem to seconds by Swift Heavy Ion Implantation to about one second using advanced Rapid Thermal Annealing. This book offers after an historical excursus selected contributions on fundamental and applied aspects of thermal processing of classical elemental semiconductors and other advanced materials including nanostructures with novel optoelectronic, magnetic, and superconducting properties. Special emphasis is given on the diffusion and segregation of impurity atoms during thermal treatment. A broad range of examples describes the solid phase and/or liquid phase processing of elemental and compound semiconductors, dielectric composites and organic materials.

Denise Reichel studies the delicate subject of temperature measurement during lamp-based annealing of semiconductors, in particular during flash lamp annealing. The approach of background-correction using amplitude-modulated light to obtain the sample reflectivity is reinvented from rapid thermal annealing to apply to millisecond annealing. The author presents a new method independent of the lamp operation to obtain this amplitude modulation and derives a formula to describe the process. Further, she investigates the variables of the formula in depth to validate the method’s suitability for background-corrected temperature measurement. The experimental results finally proof its power for elevated temperatures.

This book provides a comprehensive survey of the technology of flash lamp annealing (FLA) for thermal processing of semiconductors. It gives a detailed introduction to the FLA technology and its physical background. Advantages, drawbacks and process issues are addressed in detail and allow the reader to properly plan and perform their own thermal processing. Moreover, this books gives a broad overview of the applications of flash lamp annealing, including a comprehensive literature survey. Several case studies of simulated temperature profiles in real material systems give the reader the necessary insight into the underlying physics and simulations. This book is a valuable reference work for both novice and advanced users.

Edited by well-known pioneers in the field, this handbook and ready reference provides a comprehensive overview of transparent conductive materials with a strong application focus. Following an introduction to the materials and recent developments, subsequent chapters discuss the synthesis and characterization as well as the deposition techniques that are commonly used for energy harvesting and light emitting applications. Finally, the book concludes with a look at future technological advances. All-encompassing and up-to-date, this interdisciplinary text runs the gamut from chemistry and materials science to engineering, from academia to industry, and from fundamental challenges to readily available applications.

Nowadays over 50% of integrated circuits are fabricated at wafer foundries. This book presents a foundry-integrated perspective of the field and is a comprehensive and up-to-date manual designed to serve process, device, layout, and design engineers. It comprises chapters carefully selected to cover topics relevant for them to deal with their work. The book provides an insight into the different types of design rules (DRs) and considerations for setting new DRs. It discusses isolation, gate patterning, S/D contacts, metal lines, MOL, air gaps, and so on. It explains in detail the layout rules needed to support advanced planarization processes, different types of dummies, and related utilities as well as presents a large set of guidelines and layout-aware modeling for RF CMOS and analog modules. It also discusses the layout DRs for different mobility enhancement techniques and their related modeling, listing many of the dedicated rules for static random-access memory (SRAM), embedded polyfuse (ePF), and LogicNVM. The book also provides the setting and calibration of the process parameters set and describes the 28~20 nm planar MOSFET process flow for low-power and high-performance mobile applications in a step-by-step manner. It includes FEOL and BEOL physical and environmental tests for qualifications together with automotive qualification and design for automotive (DfA). Written for the professionals, the book belongs to the bookshelf of microelectronic discipline experts.

Provides the reader how to apply flexible glass applications that are not possible or practical to address with alternative substrate materials. Examples of technology areas include displays, touch sensors, lighting, backplanes, and photovoltaics. Built on more than 10 years of valuable discussions and collaborations focused on truly defining what flexible glass means in the context of the emerging electronic and opto-electronic applications, this book provides a broad overview as well as detailed descriptions that cover flexible glass properties, device fabrication methods, and emerging applications. It provides the basis for identifying new device designs, applications, and manufacturing processes for which flexible glass substrates are uniquely suited and encourages and enables the reader to identify and pursue advanced flexible glass applications that do not exist today and provides a launching point for exciting future directions. The chapters are grouped into three sections. The first focuses on flexible glass and flexible glass reliability and has three chapters with authors from Corning. The second section focuses on flexible glass device fabrication which includes chapters on roll-to-roll processing, vacuum deposition, and printed electronics. These chapters are authored by established experts in their respective fields that have extensive experience in processing flexible glass substrates in toolsets that range from research to pilot scale. The third section focuses on flexible glass device applications and includes chapters on photovoltaics, displays, integrated photonics, and microelectronics integration. These are authored by experts with direct experience in fabricating and characterizing flexible glass devices. The diverse list of authors and their depth of experience in working with a variety of material systems, processes, and device technologies significantly adds valuable context to the overall flexible glass discussion.