This book is a hard bound edition of a special issue (vol. 48/20-22) of the journal Electrochimica Acta. It summarizes the highlights of the 53rd Annual meeting of the International Society of Electrochemistry and Annual meeting of the GDCh-Fachgruppe Angewandte Elektrochemie. The theme of the conference was Electrochemistry in Molecular and Microscopic dimensions and was based on the role of electrochemistry in the miniaturization of chemical and physical methods. Topics covered are : - development of electrochemistry with microscopic and molecular resolution; - initiation of advances in Electrochemical Microsystem Technologies EMT, and micro/nano-electronics; - development of Electrochemical Materials Science for nanomaterials; - enhancement of miniaturization and sensitivity of electroanalysis, and; - the bridge from electrochemistry to biology and medicine of microscopic and molecular understanding. - Summarizes the highlights of two major electrochemistry meetings. - It includes research papers on the electrochemical processes in micro- and nanotechnology. - Highlights developments and advances in electrochemistry.

Microelectronic Packaging analyzes the massive impact of electrochemical technologies on various levels of microelectronic packaging. Traditionally, interconnections within a chip were considered outside the realm of packaging technologies, but this book emphasizes the importance of chip wiring as a key aspect of microelectronic packaging, and focuses on electrochemical processing as an enabler of advanced chip metallization. Divided into five parts, the book begins by outlining the basics of electrochemical processing, defining the microelectronic packaging hierarchy, and emphasizing the impact of electrochemical technology on packaging. The second part discusses chip metallization topics including the development of robust barrier layers and alternative metallization materials. Part III explores key aspects of chip-package interconnect technologies, followed by Part IV's analysis of packages, boards, and connectors which covers materials development, technology trends in ceramic packages and multi-chip modules, and electroplated contact materials. Illustrating the importance of processing tools in enabling technology development, the book concludes with chapters on chemical mechanical planarization, electroplating, and wet etching/cleaning tools. Experts from industry, universities, and national laboratories submitted reviews on each of these subjects, capturing the technological advances made in each area. A detailed examination of how packaging responds to the challenges of Moore's law, this book serves as a timely and valuable reference for microelectronic packaging and processing professionals and other industrial technologists.