Structural Integrity and Reliability in Electronics

Structural Integrity and Reliability in Electronics
Title Structural Integrity and Reliability in Electronics PDF eBook
Author W.J. Plumbridge
Publisher Springer Science & Business Media
Pages 341
Release 2007-05-08
Genre Technology & Engineering
ISBN 1402026110

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Knowledge itself is soon obsolete; It is a blunt instrument. Only by understanding can problems be solved and progress achieved. Reliability in performance of electronic equipment, in the face of demands for continuing miniaturisation and the anticipated abolition of lead containing solders, represents a major engineering challenge. The involvement of numerous disciplines; such as electrical, electronic, mechanical, manufacturing, and materials engineering together with physicists and computer specialists, adds to the complexity of the situation. Nevertheless, with electronics being the World's largest industrial sector, the potential rewards to the winners are substantial. This book aims to provide the ingredients for understanding, together with knowledge of reliability in interconnection technology and of the implementation of lead free solders. It is strongly contended that such a combination forms the necessary basis for greater structural integrity and enhanced performance The text is essentially in three parts: The intentions of the Part I component {The Materials Perspective, Chapters 1 6) are to present a snapshot of the current, but rapidly changing, global scene and to establish a firm understanding of the fundamentals surrounding interconnection performance. With potential readers possessing a broad spectrum of knowledge and expertise, this is essential. It could be argued that the reason for the limited progress made in this field to date has been due to the difficulties encountered in communicating effectively across the discipline boundaries.

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging

Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging
Title Micro- and Opto-Electronic Materials and Structures: Physics, Mechanics, Design, Reliability, Packaging PDF eBook
Author Ephraim Suhir
Publisher Springer Science & Business Media
Pages 1471
Release 2007-05-26
Genre Technology & Engineering
ISBN 0387329897

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This handbook provides the most comprehensive, up-to-date and easy-to-apply information on the physics, mechanics, reliability and packaging of micro- and opto-electronic materials. It details their assemblies, structures and systems, and each chapter contains a summary of the state-of-the-art in a particular field. The book provides practical recommendations on how to apply current knowledge and technology to design and manufacture. It further describes how to operate a viable, reliable and cost-effective electronic component or photonic device, and how to make such a device into a successful commercial product.

Structural Dynamics of Electronic and Photonic Systems

Structural Dynamics of Electronic and Photonic Systems
Title Structural Dynamics of Electronic and Photonic Systems PDF eBook
Author Ephraim Suhir
Publisher John Wiley & Sons
Pages 610
Release 2011-04-04
Genre Technology & Engineering
ISBN 047088679X

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The proposed book will offer comprehensive and versatile methodologies and recommendations on how to determine dynamic characteristics of typical micro- and opto-electronic structural elements (printed circuit boards, solder joints, heavy devices, etc.) and how to design a viable and reliable structure that would be able to withstand high-level dynamic loading. Particular attention will be given to portable devices and systems designed for operation in harsh environments (such as automotive, aerospace, military, etc.) In-depth discussion from a mechanical engineer's viewpoint will be conducted to the key components’ level as well as the whole device level. Both theoretical (analytical and computer-aided) and experimental methods of analysis will be addressed. The authors will identify how the failure control parameters (e.g. displacement, strain and stress) of the vulnerable components may be affected by the external vibration or shock loading, as well as by the internal parameters of the infrastructure of the device. Guidelines for material selection, effective protection and test methods will be developed for engineering practice.

Computational Methods in Engineering & Science

Computational Methods in Engineering & Science
Title Computational Methods in Engineering & Science PDF eBook
Author Zhenhan Yao
Publisher Springer Science & Business Media
Pages 354
Release 2007-12-31
Genre Technology & Engineering
ISBN 3540482601

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Here are the printed proceedings of EPMESC X, held on August 21-23, 2006 in Sanya, Hainan Island of China. It includes 14 full papers of plenary and semi-plenary lectures and approximately 166 one-page summaries. The accompanying CD-ROM includes all 180 full papers presented at the conference.

Lead-Free Electronic Solders

Lead-Free Electronic Solders
Title Lead-Free Electronic Solders PDF eBook
Author KV Subramanian
Publisher Springer Science & Business Media
Pages 370
Release 2007-06-28
Genre Technology & Engineering
ISBN 0387484337

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Even though the effect of lead contamination on human health has been known for decades, very little attention has been paid to lead-based solders used in electronics until recently. This comprehensive book examines all the important issues associated with lead-free electronic solder. It collects the work of researchers recognized for their significant scientific contributions in the area.

Handbook of Materials Failure Analysis

Handbook of Materials Failure Analysis
Title Handbook of Materials Failure Analysis PDF eBook
Author Abdel Salam Hamdy Makhlouf
Publisher Butterworth-Heinemann
Pages 388
Release 2019-10-22
Genre Technology & Engineering
ISBN 0128113960

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Handbook of Materials Failure Analysis: With Case Studies from the Electronics Industries examines the reasons materials fail in certain situations, including material defects and mechanical failure as a result of various causes. The book begins with a general overview of materials failure analysis and its importance. It then proceeds to discussions on the types of failure analysis, specific tools and techniques, and an analysis of materials failure from various causes. As failure can occur for several reasons, including materials defects-related failure, materials design-related failure, or corrosion-related failures, the topics covered in this comprehensive source are an important tool for practitioners. - Provides the most up-to-date and balanced coverage of failure analysis, combining foundational knowledge and current research on the latest developments and innovations in the field - Offers an ideal accompaniment for those interested in materials forensic investigation, failure of materials, static failure analysis, dynamic failure analysis, and fatigue life prediction - Presents compelling new case studies from key industries to demonstrate concepts

Reliability Abstracts and Technical Reviews

Reliability Abstracts and Technical Reviews
Title Reliability Abstracts and Technical Reviews PDF eBook
Author
Publisher
Pages 704
Release 1962
Genre Reliability (Engineering)
ISBN

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