Si Front-end Processing
Title | Si Front-end Processing PDF eBook |
Author | |
Publisher | |
Pages | 320 |
Release | 1999 |
Genre | Semiconductor doping |
ISBN |
Si Front-End Processing: Volume 669
Title | Si Front-End Processing: Volume 669 PDF eBook |
Author | Erin C. Jones |
Publisher | |
Pages | 362 |
Release | 2001-12-14 |
Genre | Science |
ISBN |
The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.
Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610
Title | Si Front End Processing - Physics and Technology II of Dopant-Defect Interactions II: Volume 610 PDF eBook |
Author | Aditya Agarwal |
Publisher | |
Pages | 448 |
Release | 2001-04-09 |
Genre | Technology & Engineering |
ISBN |
This proceedings of the April 2000 symposium deals with formation of electrical junctions in the front-end processing of devices for the approaching end-of-the-roadmap. The 60 papers address 2D dopant characterization, ion implantation and shallow junction technology, group III diffusion and activation, carbon diffusion and activation, group V diffusion and activation, vacancy-type defects, regrown amorphous layers, and structure and properties of point and extended defects. Topics include ultra-shallow junction formation and gate activation in deep-submicron CMOS, low energy implantation of boron with decaborane ions, modeling ramp rate effects on shallow junction formation, clustering equilibrium and deactivation kinetics in As doped silicon, and atomistic modeling of complex silicon processing scenarios. c. Book News Inc.
Advanced Short-time Thermal Processing for Si-based CMOS Devices
Title | Advanced Short-time Thermal Processing for Si-based CMOS Devices PDF eBook |
Author | Fred Roozeboom |
Publisher | The Electrochemical Society |
Pages | 488 |
Release | 2003 |
Genre | Computers |
ISBN | 9781566773966 |
Simulation of Semiconductor Processes and Devices 2007
Title | Simulation of Semiconductor Processes and Devices 2007 PDF eBook |
Author | Tibor Grasser |
Publisher | Springer Science & Business Media |
Pages | 472 |
Release | 2007-09-18 |
Genre | Computers |
ISBN | 3211728600 |
The "Twelfth International Conference on Simulation of Semiconductor Processes and Devices" (SISPAD 2007) continues a long series of conferences and is held in September 2007 at the TU Wien, Vienna, Austria. The conference is the leading forum for Technology Computer-Aided Design (TCAD) held alternatingly in the United States, Japan, and Europe. The first SISPAD conference took place in Tokyo in 1996 as the successor to three preceding conferences NUPAD, VPAD, and SISDEP. With its longstanding history SISPAD provides a world-wide forum for the presentaƯ tion and discussion of outstanding recent advances and developments in the field of numerical process and device simulation. Driven by the ongoing miniaturization in semiconductor fabrication technology, the variety of topics discussed at this meeting reflects the ever-growing complexity of the subject. Apart from the classic topics like process, device, and interconnect simulation, mesh generation, a broad specƯ trum of numerical issues, and compact modeling, new simulation approaches like atomistic and first-principles methods have emerged as important fields of research and are currently making their way into standard TCAD suites
Handbook of Silicon Based MEMS Materials and Technologies
Title | Handbook of Silicon Based MEMS Materials and Technologies PDF eBook |
Author | Markku Tilli |
Publisher | William Andrew |
Pages | 827 |
Release | 2015-09-02 |
Genre | Technology & Engineering |
ISBN | 0323312233 |
The Handbook of Silicon Based MEMS Materials and Technologies, Second Edition, is a comprehensive guide to MEMS materials, technologies, and manufacturing that examines the state-of-the-art with a particular emphasis on silicon as the most important starting material used in MEMS. The book explains the fundamentals, properties (mechanical, electrostatic, optical, etc.), materials selection, preparation, manufacturing, processing, system integration, measurement, and materials characterization techniques, sensors, and multi-scale modeling methods of MEMS structures, silicon crystals, and wafers, also covering micromachining technologies in MEMS and encapsulation of MEMS components. Furthermore, it provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques, shows how to protect devices from the environment, and provides tactics to decrease package size for a dramatic reduction in costs. Provides vital packaging technologies and process knowledge for silicon direct bonding, anodic bonding, glass frit bonding, and related techniques Shows how to protect devices from the environment and decrease package size for a dramatic reduction in packaging costs Discusses properties, preparation, and growth of silicon crystals and wafers Explains the many properties (mechanical, electrostatic, optical, etc.), manufacturing, processing, measuring (including focused beam techniques), and multiscale modeling methods of MEMS structures Geared towards practical applications rather than theory
The NeuroProcessor
Title | The NeuroProcessor PDF eBook |
Author | Yevgeny Perelman |
Publisher | Springer Science & Business Media |
Pages | 126 |
Release | 2008-08-20 |
Genre | Technology & Engineering |
ISBN | 1402087268 |
Understanding brain structure and principles of operation is one of the major challengesofmodernscience.SincetheexperimentsbyGalvanionfrogmuscle contraction in 1792, it is known that electrical impulses lie at the core of the brain activity. The technology of neuro-electronic interfacing, besides its importance for neurophysiological research, has also clinical potential, so called neuropr- thetics. Sensory prostheses are intended to feed sensory data into patient’s brain by means of neurostimulation. Cochlear prostheses [1] are one example of sensory prostheses that are already used in patients. Retinal prostheses are currently under research [2]. Recent neurophysiological experiments [3, 4] show that brain signals recorded from motor cortex carry information regarding the movement of subject’s limbs (Fig. 1.1). These signals can be further used to control ext- nal machines [4] that will replace missing limbs, opening the ?eld of motor prosthetics, devices that will restore lost limbs or limb control. Fig. 1.1. Robotic arm controlled by monkey motor cortex signals. MotorLab, U- versity of Pittsburgh. Prof Andy Schwartz, U. Pitt 2 1 Introduction Another group of prostheses would provide treatment for brain diseases, such as prevention of epileptic seizure or the control of tremor associated with Parkinson disease [5]. Brain implants for treatment of Epilepsy and Parkinson symptoms (Fig. 1.2) are already available commercially [6, 7]. Fig. 1.2. Implantable device for Epilepsy seizures treatment [7]. Cyberonics, Inc.