Interwoven within our semiconductor technology development had been the development of technologies aimed at identifying, evaluating and mitigating the environmental, health and safety (EH&S) risks and exposures associated with the manufacturing and packaging of integrated circuits. Driving and advancing these technologies have been international efforts by SEMI's Safety Division, the Semiconductor Safety Association (SSA), and the Semiconductor Industry Association (SIA). The purpose of the Semiconductor Safety Handbook is to provide a current, single source reference for many of the primary semiconductor EH&S technologies and disciplines. To this end, the contributors have assembled a comprehensive text written by some of the leading experts in EH&S in the semiconductor industry. This text had taken three years to complete and has involved tremendous effort and commitment by the authors.They have attempted to construct a reference manual that is comprehensive in its coverage of the technical aspects of each individual subject, while at the same time addressing practical applications of each topic. The scope of this text, from its inception, was intended to address significantly more than what would typically be classified under the definition of ""safety."" However, all of the chapters have a direct application to the protection and preservation of semiconductor employees, the surrounding communities and the environment.This book is a hands-on reference to environmental, health and safety issues critical to the semiconductor industry. It was also the author's intent to produce a text that provides a practical user's guide for semiconductor environmental, health and safety practitioners as well as those individuals responsible for operation, maintenance and production in wafer fabrication facilities.

The first comprehensive guide to the chemicals and gases used in semiconductor manufacturing The fabrication of semiconductor devices involves a series of complex chemical processes such as photolithography, etching, cleaning, thin film deposition, and polishing. Until now, there has been no convenient source of information on the properties, applications, and health and safety considerations of the chemicals used in these processes. The Handbook of Chemicals and Gases for the Semiconductor Industry meets this need. Each of the Handbook's eight chapters is related to a specific area of semiconductor processing. The authors provide a brief overview of each step in the process, followed by tables containing physical properties, handling, safety, and other pertinent information on chemicals and gases typically used in these processes. The 270 chemical and gas entries include data on physical properties, emergency treatment procedures, waste disposal, and incompatible materials, as well as descriptions of applications, chemical mechanisms involved, and references to the literature. Appendices cross-reference entries by process, chemical name, and CAS number. The Handbook's eight chapters are: Thin Film Deposition Materials Wafer Cleaning Materials Photolithography Materials Wet and Dry Etching Materials Chemical Mechanical Planarizing Methods Carrier Gases Uncategorized Materials Semiconductor Chemicals Analysis No other single source brings together these useful and important data on chemicals and gases used in the manufacture of semiconductor devices. The Handbook of Chemicals and Gases for the Semiconductor Industry will be a valuable reference for process engineers, scientists, suppliers to the semiconductor industry, microelectronics researchers, and students.

WORLD-CLASS SEMICONDUCTOR MANUFACTURING EXPERTISE AT YOUR FINGERTIPS This is a comprehensive reference to the semiconductor manufacturing process and ancillary facilities -- from raw material preparation to packaging and testing, applying basics to emerging technologies. Readers charged with optimizing the design and performance of manufacturing processes will find all the information necessary to produce the highest quality chips at the lowest price in the shortest time possible. The Semiconductor Manufacturing Handbook provides leading-edge information on semiconductor wafer processes, MEMS, nanotechnology, and FPD, plus the latest manufacturing and automation technologies, including: Yield Management Automated Material Handling System Fab and Cleanroom Design and Operation Gas Abatement and Waste Treatment Management And much more Written by 60 international experts, and peer reviewed by a seasoned advisory board, this handbook covers the fundamentals of relevant technology and its real-life application and operational considerations for planning, implementing, and controlling manufacturing processes. It includes hundreds of detailed illustrations and a list of relevant books, technical papers, and websites for further research. This inclusive, wide-ranging coverage makes the Semiconductor Manufacturing Handbook the most comprehensive single-volume reference ever published in the field. STATE-OF-THE-ART SEMICONDUCTOR TECHNOLOGIES AND MANUFACTURING PROCESSES: SEMICONDUCTOR FUNDAMENTALS How Chips Are Designed and Made * Substrates * Copper and Low-k Dielectrics * Silicide Formation * Plasma * Vacuum * Photomask WAFER PROCESSING TECHNOLOGIES Microlithography * Ion Implantation * Etch * PVD/ALD * CVD * ECD * Epitaxy * CMP * Wet Cleaning FINAL MANUFACTURING Packaging * Grinding, Stress Relief, Dicing * Inspection, Measurement, and Testing NANOTECHNOLOGY, MEMS, AND FPD GAS AND CHEMICALS Specialty Gas System and DCA * Gas Abatement Systems * Chemical and Slurries Delivery System * Ultra Pure Water FAB YIELD, OPERATIONS, AND FACILITIES Yield Management * Automated Materials Handling System * Metrology * Six Sigma * Advanced Process Control * EHS * Fab Design and Construction * Cleanroom * Vibration and Acoustic Control * ESD * Airborne Molecular Control * Particle Monitoring * Wastewater Neutralization Systems

This book provides a comprehensive review of the primary industrial hygiene topics relevant to semiconductor processing: chemical and physical agents, and ventilation systems. The book also has excellent chapters on newer industrial hygiene concerns that are not specific to the semiconductor industry: ergonomics, indoor air quality, personal protective equipment, plan review, and records retention. While much of the information in these chapters can be applied to all industries, the focus and orientation is specific to issues in the semiconductor industry.

This book provides an in-depth review of the rapidly developing field of spintronic semiconductors. It covers a broad range of topics, including growth and basic physical properties of diluted magnetic semiconductors based on II-VI, III-V and IV semiconductors, recent developments in theory and experimental techniques and potential device applications; its aim is to provide postgraduate students, researchers and engineers a comprehensive overview of our present knowledge and future perspectives of spintronic semiconductors.

This thoroughly revised and updated three volume set continues to be the standard reference in the field, providing the latest in microelectronics design methods, modeling tools, simulation techniques, and manufacturing procedures. Unlike reference books that focus only on a few aspects of microelectronics packaging, these outstanding volumes discuss state-of-the-art packages that meet the power, cooling, protection, and interconnection requirements of increasingly dense and fast microcircuitry. Providing an excellent balance of theory and practical applications, this dynamic compilation features step-by-step examples and vital technical data, simplifying each phase of package design and production. In addition, the volumes contain over 2000 references, 900 figures, and 250 tables. Part I: Technology Drivers covers the driving force of microelectronics packaging - electrical, thermal, and reliability. It introduces the technology developer to aspects of manufacturing that must be considered during product development. Part II: Semiconductor Packaging discusses the interconnection of the IC chip to the first level of packaging and all first level packages. Electrical test, sealing, and encapsulation technologies are also covered in detail. Part III: Subsystem Packaging explores board level packaging as well as connectors, cables, and optical packaging.

A broad review of semiconductor materials and process technology, with emphasis on very large-scale integration (VLSI) and ultra large scale integration (ULSI). Brings together "snapshots" of the various aspects in different fields within the technology.