Driven by advanced CMOS technology, power management units, RF transceivers, and sensors, analog and mixed-signal circuits can now be fully integrated with VLSI digital systems for applications ranging from mobile, internet-of-things (IoT), wearable, and implantable medical devices. Evidently, the circuit- and system-level innovations have pushed the device performance boundaries to become orders of magnitude higher, whilst keeping the same or even lower power consumption.Selected Topic in Power, RF, and Mixed-Signal ICs provides a practical overview and state-of-the-art advancements on several selected topics in the areas of power, RF, and mixed-signal integrated circuits and systems.Topics covered in the book include:• Very-High-Frequency DC-DC Switching Converters• Analog and Digital Low-Dropout Regulators• Analog and Digital Sub-Sampling Frequency Synthesizers• Hybrid ADC Architecture with Digital Assisted Techniques• CMOS Image Sensors and Their Biomedical Applications• CMOS Temperature Sensors• CMOS Millimeter-Wave Power Amplifiers• Zigbee/BLE Transmitter for IoT Applications

Selected Topic in Power, RF, and Mixed-Signal ICs provides a practical overview and state-of-the-art advancements on several selected topics in the areas of power, RF, and mixed-signal integrated circuits and systems.

CMOS process technology progress has led to a revolution towards new and innovative integrated circuits and systems. This trend is still moving forward for applications ranging from high-speed wireless and wireline data transfer down to ultra-low-power mobile applications for more interconnected world. The high performance analog and RF circuits and systems are at the heart of all these developments. Selected Topics in RF, Analog and Mixed Signal Circuits and Systems provides an overview and the state of the art developments on several selected topics in RF, analog and mixed signal circuits and system. The topics include ADC conversion and equalization for high-speed links, clock and data recovery for high speed wireline transmission with speeds in several Gb/s, signal generation for terahertz application, oscillator phase noise fundamentals and analog/digital PLL overview. Topics covered in the book include:Overview of Oscillator Phase NoiseClock and Data Recovery in High-Speed Wireline CommunicationPhase Lock Loop Design TechniquesTerahertz and mm-Wave Signal Generation, Synthesis and Amplification: Reaching the Fundamental LimitsEqualization and A/D conversion for high-speed links

Advances in Analog and RF IC Design for Wireless Communication Systems gives technical introductions to the latest and most significant topics in the area of circuit design of analog/RF ICs for wireless communication systems, emphasizing wireless infrastructure rather than handsets. The book ranges from very high performance circuits for complex wireless infrastructure systems to selected highly integrated systems for handsets and mobile devices. Coverage includes power amplifiers, low-noise amplifiers, modulators, analog-to-digital converters (ADCs) and digital-to-analog converters (DACs), and even single-chip radios. This book offers a quick grasp of emerging research topics in RF integrated circuit design and their potential applications, with brief introductions to key topics followed by references to specialist papers for further reading. All of the chapters, compiled by editors well known in their field, have been authored by renowned experts in the subject. Each includes a complete introduction, followed by the relevant most significant and recent results on the topic at hand. This book gives researchers in industry and universities a quick grasp of the most important developments in analog and RF integrated circuit design. - Emerging research topics in RF IC design and its potential application - Case studies and practical implementation examples - Covers fundamental building blocks of a cellular base station system and satellite infrastructure - Insights from the experts on the design and the technology trade-offs, the challenges and open questions they often face - References to specialist papers for further reading

Design exibility and power consumption in addition to the cost, have always been the most important issues in design of integrated circuits (ICs), and are the main concerns of this research, as well. Energy Consumptions: Power dissipation (P ) and energy consumption are - diss pecially importantwhen there is a limited amountof power budgetor limited source of energy. Very common examples are portable systems where the battery life time depends on system power consumption. Many different techniques have been - veloped to reduce or manage the circuit power consumption in this type of systems. Ultra-low power (ULP) applications are another examples where power dissipation is the primary design issue. In such applications, the power budget is so restricted that very special circuit and system level design techniquesare needed to satisfy the requirements. Circuits employed in applications such as wireless sensor networks (WSN), wearable battery powered systems [1], and implantable circuits for biol- ical applications need to consume very low amount of power such that the entire system can survive for a very long time without the need for changingor recharging battery[2–4]. Using newpowersupplytechniquessuchas energyharvesting[5]and printable batteries [6], is another reason for reducing power dissipation. Devel- ing special design techniques for implementing low power circuits [7–9], as well as dynamic power management (DPM) schemes [10] are the two main approaches to control the system power consumption. Design Flexibility: Design exibility is the other important issue in modern in- grated systems.

MOS technology has rapidly become the de facto standard for mixed-signal integrated circuit design due to the high levels of integration possible as device geometries shrink to nanometer scales. The reduction in feature size means that the number of transistor and clock speeds have increased significantly. In fact, current day microprocessors contain hundreds of millions of transistors operating at multiple gigahertz. Furthermore, this reduction in feature size also has a significant impact on mixed-signal circuits. Due to the higher levels of integration, the majority of ASICs possesses some analog components. It has now become nearly mandatory to integrate both analog and digital circuits on the same substrate due to cost and power constraints. This book presents some of the newer problems and opportunities offered by the small device geometries and the high levels of integration that is now possible. The aim of this book is to summarize some of the most critical aspects of high-speed analog/RF communications circuits. Attention is focused on the impact of scaling, substrate noise, data converters, RF and wireless communication circuits and wireline communication circuits, including high-speed I/O. Contents: Achieving Analog Accuracy in Nanometer CMOS (M P Flynn et al.); Self-Induced Noise in Integrated Circuits (R Gharpurey & S Naraghi); High-Speed Oversampling Analog-to-Digital Converters (A Gharbiya et al.); Designing LC VCOs Using Capacitive Degeneration Techniques (B Jung & R Harjani); Fully Integrated Frequency Synthesizers: A Tutorial (S T Moon et al.); Recent Advances and Design Trends in CMOS Radio Frequency Integrated Circuits (D J Allstot et al.); Equalizers for High-Speed Serial Links (P K Hanumolu et al.); Low-Power, Parallel Interface with Continuous-Time Adaptive Passive Equalizer and Crosstalk Cancellation (C P Yue et al.). Readership: Technologists, scientists, and engineers in the field of high-speed communication circuits. It can also be used as a textbook for graduate and advanced undergraduate courses.