This volume provides the first comprehensive look at a pivotal new technology in integrated circuit fabrication. For some time researchers have sought alternate processes for interconnecting the millions of transistors on each chip because conventional physical vapor deposition can no longer meet the specifications of today's complex integrated circuits. Out of this research, ionized physical vapor deposition has emerged as a premier technology for the deposition of thin metal films that form the dense interconnect wiring on state-of-the-art microprocessors and memory chips.For the first time, the most recent developments in thin film deposition using ionized physical vapor deposition (I-PVD) are presented in a single coherent source. Readers will find detailed descriptions of relevant plasma source technology, specific deposition systems, and process recipes. The tools and processes covered include DC hollow cathode magnetrons, RF inductively coupled plasmas, and microwave plasmas that are used for depositing technologically important materials such as copper, tantalum, titanium, TiN, and aluminum. In addition, this volume describes the important physical processes that occur in I-PVD in a simple and concise way. The physical descriptions are followed by experimentally-verified numerical models that provide in-depth insight into the design and operation I-PVD tools.Practicing process engineers, research and development scientists, and students will find that this book's integration of tool design, process development, and fundamental physical models make it an indispensable reference.Key Features:The first comprehensive volume on ionized physical vapor depositionCombines tool design, process development, and fundamental physical understanding to form a complete picture of I-PVDEmphasizes practical applications in the area of IC fabrication and interconnect technologyServes as a guide to select the most appropriate technology for any deposition application*This single source saves time and effort by including comprehensive information at one's finger tips*The integration of tool design, process development, and fundamental physics allows the reader to quickly understand all of the issues important to I-PVD*The numerous practical applications assist the working engineer to select and refine thin film processes

The main target of this book is to state the latest advancement in ceramic coatings technology in various industrial fields. The book includes topics related to the applications of ceramic coating covers in enginnering, including fabrication route (electrophoretic deposition and physical deposition) and applications in turbine parts, internal combustion engine, pigment, foundry, etc.

High Power Impulse Magnetron Sputtering: Fundamentals, Technologies, Challenges and Applications is an in-depth introduction to HiPIMS that emphasizes how this novel sputtering technique differs from conventional magnetron processes in terms of both discharge physics and the resulting thin film characteristics. Ionization of sputtered atoms is discussed in detail for various target materials. In addition, the role of self-sputtering, secondary electron emission and the importance of controlling the process gas dynamics, both inert and reactive gases, are examined in detail with an aim to generate stable HiPIMS processes. Lastly, the book also looks at how to characterize the HiPIMS discharge, including essential diagnostic equipment. Experimental results and simulations based on industrially relevant material systems are used to illustrate mechanisms controlling nucleation kinetics, column formation and microstructure evolution.

Piezoelectric Ceramics focuses on the relationship between piezoelectricity and ferroelectricity as they apply to ceramics, taking into consideration the properties of materials that are being used and possibly be used in the industries. Composed of 12 chapters, the book starts by tracing the history of piezoelectricity and how this affects ceramics. The different measurement techniques are discussed, including dielectric, ferroelectric, and piezoelectric measurements. The book proceeds by discussing Perovskite structure and barium titanate. Covered areas include electric field, piezoelectric properties, particle size effect, and dielectric strength. The properties, compositions, and reactions of various perovskites are discussed. Numerical analyses are presented in this regard. The book also offers interpretations of the experiments conducted. The discussions end with the processes involved in the manufacture and applications of piezoelectric ceramics. Concerns in manufacturing include calcination, grinding, mixing, electroding, firing, and quality control. Piezolectric ceramics are applied in air transducers, instrument transducers, delay line transducers, underwater sound ultrasonic power, and wave filters. The book is important for readers interested in doing research on ceramics.

Tremendous progress has been made in the last few years in the growth, doping and processing technologies of the wide bandgap semiconductors. As a result, this class of materials now holds significant promis for semiconductor electronics in a broad range of applications. The principal driver for the current revival of interest in III-V Nitrides is their potential use in high power, high temperature, high frequency and optical devices resistant to radiation damage. This book provides a wide number of optoelectronic applications of III-V nitrides and covers the entire process from growth to devices and applications making it essential reading for those working in the semiconductors or microelectronics. Broad review of optoelectronic applications of III-V nitrides

Sintering is one of the final stages of ceramics fabrication and is used to increase the strength of the compacted material. In the Sintering of Ceramics section, the fabrication of electronic ceramics and glass-ceramics were presented. Especially dielectric properties were focused on. In other chapters, sintering behaviour of ceramic tiles and nano-alumina were investigated. Apart from oxides, the sintering of non-oxide ceramics was examined. Sintering the metals in a controlled atmosphere furnace aims to bond the particles together metallurgically. In the Sintering of Metals section, two sections dealt with copper containing structures. The sintering of titanium alloys is another topic focused in this section. The chapter on lead and zinc covers the sintering in the field of extractive metallurgy. Finally two more chapter focus on the basics of sintering,i.e viscous flow and spark plasma sintering.

This book provides a systematic and comprehensive description of high-entropy alloys (HEAs). The authors summarize key properties of HEAs from the perspective of both fundamental understanding and applications, which are supported by in-depth analyses. The book also contains computational modeling in tackling HEAs, which help elucidate the formation mechanisms and properties of HEAs from various length and time scales.