Excerpt from Scanning Electron Microscope Examination of Wire Bonds From High-Reliability Devices: Nbs Technical Note 785 Of the several hundred sem photographs made, the examples shown were selected to be indicative of particular faults. It is not intended to suggest that the faults illustrated are unique to a particular device type, production line, or circuit configuration. In fact, most of the faults were observed to some extent in all types of the devices investi gated. About the Publisher Forgotten Books publishes hundreds of thousands of rare and classic books. Find more at www.forgottenbooks.com This book is a reproduction of an important historical work. Forgotten Books uses state-of-the-art technology to digitally reconstruct the work, preserving the original format whilst repairing imperfections present in the aged copy. In rare cases, an imperfection in the original, such as a blemish or missing page, may be replicated in our edition. We do, however, repair the vast majority of imperfections successfully; any imperfections that remain are intentionally left to preserve the state of such historical works.

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