"Degradation process" refers to many types of reliability models, which correspond to various kinds of stochastic processes used for deterioration modeling. This book focuses on the case of a univariate degradation model with a continuous set of possible outcomes. The envisioned univariate models have one single measurable quantity which is assumed to be observed over time. The first three chapters are each devoted to one degradation model. The last chapter illustrates the use of the previously described degradation models on some real data sets. For each of the degradation models, the authors provide probabilistic results and explore simulation tools for sample paths generation. Various estimation procedures are also developed.

Engineering Asset Management discusses state-of-the-art trends and developments in the emerging field of engineering asset management as presented at the Fourth World Congress on Engineering Asset Management (WCEAM). It is an excellent reference for practitioners, researchers and students in the multidisciplinary field of asset management, covering such topics as asset condition monitoring and intelligent maintenance; asset data warehousing, data mining and fusion; asset performance and level-of-service models; design and life-cycle integrity of physical assets; deterioration and preservation models for assets; education and training in asset management; engineering standards in asset management; fault diagnosis and prognostics; financial analysis methods for physical assets; human dimensions in integrated asset management; information quality management; information systems and knowledge management; intelligent sensors and devices; maintenance strategies in asset management; optimisation decisions in asset management; risk management in asset management; strategic asset management; and sustainability in asset management.

In developing III-V optical devices for use in optical fiber communication systems, digital-audio systems, and optical printers, reliability is paramount. Understanding the origins and causes of degradation is critical to successful design. This unique book focuses specifically on helping researchers and engineers involved in III-V compound semiconductor thin film growth and processing better understand the mechanism of degradation and details the major degradation modes of optical devices fabricated from three different systems. The book explains the character of defects and imperfections induced during material growth and fabrication, presents techniques for failure analysis, and describes methods for elimination of defect-generating mechanisms. More than 200 illustrations and 40 equations help clarify important concepts.

Durability and Reliability of Polymers and Other Materials in Photovoltaic Modules describes the durability and reliability behavior of polymers used in Si-photovoltaic modules and systems, particularly in terms of physical aging and degradation process/mechanisms, characterization methods, accelerated exposure chamber and testing, module level testing, and service life prediction. The book compares polymeric materials to traditional materials used in solar applications, explaining the degradation pathways of the different elements of a photovoltaic module, including encapsulant, front sheet, back sheet, wires and connectors, adhesives, sealants, and more. In addition, users will find sections on the tests needed for the evaluation of polymer degradation and aging, as well as accelerated tests to aid in materials selection. As demand for photovoltaics continues to grow globally, with polymer photovoltaics offering significantly lower production costs compared to earlier approaches, this book will serve as a welcome resource on new avenues.

Reliability and Failure of Electronic Materials and Devices is a well-established and well-regarded reference work offering unique, single-source coverage of most major topics related to the performance and failure of materials used in electronic devices and electronics packaging. With a focus on statistically predicting failure and product yields, this book can help the design engineer, manufacturing engineer, and quality control engineer all better understand the common mechanisms that lead to electronics materials failures, including dielectric breakdown, hot-electron effects, and radiation damage. This new edition adds cutting-edge knowledge gained both in research labs and on the manufacturing floor, with new sections on plastics and other new packaging materials, new testing procedures, and new coverage of MEMS devices. Covers all major types of electronics materials degradation and their causes, including dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, and failure of contacts and solder joints New updated sections on "failure physics," on mass transport-induced failure in copper and low-k dielectrics, and on reliability of lead-free/reduced-lead solder connections New chapter on testing procedures, sample handling and sample selection, and experimental design Coverage of new packaging materials, including plastics and composites

This comparative tutorial describes the reasons behind device failures and provides practical information on what can be done to minimize failure-prone designs and enhance device reliability. The text demonstrates how, with such advantages as smaller size, low-cost and simple operation, LEDs are well suited for a wide range of applications - especially in the field of optical fibre communication. This book should prove of interest to engineers and scientists in research, design, manufacturing and development of semiconductor lasers, LEDs and optical transmission systems.