Recent Advances in Circuits and Systems brings you a balanced, state-of-the-art presentation of the latest concepts, methods, algorithms, techniques, procedures and applications of the fascinating field of Circuits and Systems. Written by eminent, leading, international experts, the contributors provide up-to-date aspects of topics discussed and present fresh, original insights into their own experience with Circuits and Systems.The main aim of this book is to present most of the new trends and recent advances of the impressive evolution in the discipline of circuits and systems. Special emphasis is given in the interaction between the classic areas of systems theory (feedback control, circuits design, electronics, etc) and the modern techniques of computational intelligence (neural networks, genetic algorithms, fuzzy logic and expert systems) since this fertile interaction promises to open up new horizons in circuits and systems theory.This book is composed of four parts. Part I is devoted to Circuits and Electronics and also includes Power Systems. Part II refers to Systems Theory and Control (H infinity problems, feedback control, non-linear systems, robust stability and robust control, multivariable systems, hybrid systems and hydraulic systems). Part III presents the latest developments in the Robotics (theory and applications) while Part IV is devoted to Computational Intelligence in Systems Theory.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.