Dielectrics is becoming increasingly important due to the rapid developments in electronics, optoelectronics, photonics and nanotechnology. In the past two decades, research on advanced dielectric materials and related applications has undergone an accelerated growth, due in larger part to the discovery of the superior piezoelectric properties in relaxor single crystals, the development of the lead-free piezoelectric/ferroelectric materials and the renaissance of the multiferroics.This book contains 9 feature articles which, together, provide a comprehensive account on the current state of advanced dielectrics and related phenomena. The first two articles present fundamental knowledge related to the characterization of ferroelectric hysteresis, which is the most widely used method to learn the ferroelectricity experimentally. The latest research progress in relaxor ferroelectric is given in the next two articles. The last five articles are dedicated to the multi-functionality of advanced dielectrics, with emphasis on multiferroic magnetoelectric composites, lead-free piezoceramics, pyroelectric/electrocaloric materials, polymer-based dielectrics, and flexible nanodielectrics.

This book provides an overview of key dielectric materials for capacitor technology. It covers preparation and characterization of state-of-the art dielectric materials including ceramics, polymers and polymer nanocomposites, for popular applications including energy storage, microwave communication and multi-layer ceramic capacitors.

Dielectrics is becoming increasingly important due to the rapid developments in electronics, optoelectronics, photonics and nanotechnology. In the past two decades, research on advanced dielectric materials and related applications has undergone an accelerated growth, due in larger part to the discovery of the superior piezoelectric properties in relaxor single crystals, the development of the lead-free piezoelectric/ferroelectric materials and the renaissance of the multiferroics. This book contains 9 feature articles which, together, provide a comprehensive account on the current state of advanced dielectrics and related phenomena. The first two articles present fundamental knowledge related to the characterization of ferroelectric hysteresis, which is the most widely used method to learn the ferroelectricity experimentally. The latest research progress in relaxor ferroelectric is given in the next two articles. The last five articles are dedicated to the multi-functionality of advanced dielectrics, with emphasis on multiferroic magnetoelectric composites, lead-free piezoceramics, pyroelectric/electrocaloric materials, polymer-based dielectrics, and flexible nanodielectrics.

Ecological restrictions in many parts of the world are demanding the elimination of Pb from all consumer items. At this moment in the piezoelectric ceramics industry, there is no issue of more importance than the transition to lead-free materials. The goal of Lead-Free Piezoelectrics is to provide a comprehensive overview of the fundamentals and developments in the field of lead-free materials and products to leading researchers in the world. The text presents chapters on demonstrated applications of the lead-free materials, which will allow readers to conceptualize the present possibilities and will be useful for both students and professionals conducting research on ferroelectrics, piezoelectrics, smart materials, lead-free materials, and a variety of applications including sensors, actuators, ultrasonic transducers and energy harvesters.

Examines the advantages of Embedded and FO-WLP technologies, potential application spaces, package structures available in the industry, process flows, and material challenges Embedded and fan-out wafer level packaging (FO-WLP) technologies have been developed across the industry over the past 15 years and have been in high volume manufacturing for nearly a decade. This book covers the advances that have been made in this new packaging technology and discusses the many benefits it provides to the electronic packaging industry and supply chain. It provides a compact overview of the major types of technologies offered in this field, on what is available, how it is processed, what is driving its development, and the pros and cons. Filled with contributions from some of the field's leading experts,Advances in Embedded and Fan-Out Wafer Level Packaging Technologies begins with a look at the history of the technology. It then goes on to examine the biggest technology and marketing trends. Other sections are dedicated to chip-first FO-WLP, chip-last FO-WLP, embedded die packaging, materials challenges, equipment challenges, and resulting technology fusions. Discusses specific company standards and their development results Content relates to practice as well as to contemporary and future challenges in electronics system integration and packaging Advances in Embedded and Fan-Out Wafer Level Packaging Technologies will appeal to microelectronic packaging engineers, managers, and decision makers working in OEMs, IDMs, IFMs, OSATs, silicon foundries, materials suppliers, equipment suppliers, and CAD tool suppliers. It is also an excellent book for professors and graduate students working in microelectronic packaging research.