Retaining the comprehensive and in-depth approach that cemented the bestselling first edition's place as a standard reference in the field, the Handbook of Semiconductor Manufacturing Technology, Second Edition features new and updated material that keeps it at the vanguard of today's most dynamic and rapidly growing field. Iconic experts Robert Doering and Yoshio Nishi have again assembled a team of the world's leading specialists in every area of semiconductor manufacturing to provide the most reliable, authoritative, and industry-leading information available. Stay Current with the Latest Technologies In addition to updates to nearly every existing chapter, this edition features five entirely new contributions on... Silicon-on-insulator (SOI) materials and devices Supercritical CO2 in semiconductor cleaning Low-κ dielectrics Atomic-layer deposition Damascene copper electroplating Effects of terrestrial radiation on integrated circuits (ICs) Reflecting rapid progress in many areas, several chapters were heavily revised and updated, and in some cases, rewritten to reflect rapid advances in such areas as interconnect technologies, gate dielectrics, photomask fabrication, IC packaging, and 300 mm wafer fabrication. While no book can be up-to-the-minute with the advances in the semiconductor field, the Handbook of Semiconductor Manufacturing Technology keeps the most important data, methods, tools, and techniques close at hand.

Volume 1: Packaging is an authoritative reference source of practical information for the design or process engineer who must make informed day-to-day decisions about the materials and processes of microelectronic packaging. Its 117 articles offer the collective knowledge, wisdom, and judgement of 407 microelectronics packaging experts-authors, co-authors, and reviewers-representing 192 companies, universities, laboratories, and other organizations. This is the inaugural volume of ASMAs all-new ElectronicMaterials Handbook series, designed to be the Metals Handbook of electronics technology. In over 65 years of publishing the Metals Handbook, ASM has developed a unique editorial method of compiling large technical reference books. ASMAs access to leading materials technology experts enables to organize these books on an industry consensus basis. Behind every article. Is an author who is a top expert in its specific subject area. This multi-author approach ensures the best, most timely information throughout. Individually selected panels of 5 and 6 peers review each article for technical accuracy, generic point of view, and completeness.Volumes in the Electronic Materials Handbook series are multidisciplinary, to reflect industry practice applied in integrating multiple technology disciplines necessary to any program in advanced electronics. Volume 1: Packaging focusing on the middle level of the electronics technology size spectrum, offers the greatest practical value to the largest and broadest group of users. Future volumes in the series will address topics on larger (integrated electronic assemblies) and smaller (semiconductor materials and devices) size levels.

ATMOSPHERIC CORROSION Presents a comprehensive look at atmospheric corrosion, combining expertise in corrosion science and atmospheric chemistry Atmospheric corrosion has been a subject of engineering study, largely empirical, for nearly a century. Scientists came to the field rather later on and had considerable difficulty bringing their arsenal of tools to bear on the problem. Atmospheric corrosion was traditionally studied by specialists in corrosion having little knowledge of atmospheric chemistry, history, or prospects. Atmospheric Corrosion provides a combined approach bringing together experimental corrosion and atmospheric chemistry. The second edition expands on this approach by including environmental aspects of corrosion, atmospheric corrosion modeling, and international corrosion exposure programs. The combination of specialties provides a more comprehensive coverage of the topic. These scientific insights into the corrosion process and its amelioration are the focus of this book. Key topics include the following: Basic principles of atmospheric corrosion chemistry Corrosion mechanisms in controlled and uncontrolled environments Degradation of materials in architectural, transport, and structural applications; electronic devices; and cultural artifacts Protection of existing materials and choosing new ones that resist corrosion Prediction of how and where atmospheric corrosion may evolve in the future Complete with appendices discussing experimental techniques, computer models, and the degradation of specific metals, Atmospheric Corrosion, Second Edition continues to be an invaluable resource for corrosion scientists, corrosion engineers, conservators, environmental scientists, and anyone interested in the theory and application of this evolving field. The book concerns primarily the atmospheric corrosion of metals and is written at a level suitable for advanced undergraduates or beginning graduate students in any of the physical or engineering sciences.

This third edition textbook provides the basics of reliability physics and engineering that are needed by electrical engineers, mechanical engineers, civil engineers, biomedical engineers, materials scientists, and applied physicists to help them to build better devices/products. The information contained within should help all fields of engineering to develop better methodologies for: more reliable product designs, more reliable materials selections, and more reliable manufacturing processes— all of which should help to improve product reliability. A mathematics level through differential equations is needed. Also, a familiarity with the use of excel spreadsheets is assumed. Any needed statistical training and tools are contained within the text. While device failure is a statistical process (thus making statistics important), the emphasis of this book is clearly on the physics of failure and developing the reliability engineering tools required for product improvements during device-design and device-fabrication phases.