This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Physical Design for 3D Integrated Circuits reveals how to effectively and optimally design 3D integrated circuits (ICs). It also analyzes the design tools for 3D circuits while exploiting the benefits of 3D technology. The book begins by offering an overview of physical design challenges with respect to conventional 2D circuits, and then each chapter delivers an in-depth look at a specific physical design topic. This comprehensive reference: Contains extensive coverage of the physical design of 2.5D/3D ICs and monolithic 3D ICs Supplies state-of-the-art solutions for challenges unique to 3D circuit design Features contributions from renowned experts in their respective fields Physical Design for 3D Integrated Circuits provides a single, convenient source of cutting-edge information for those pursuing 2.5D/3D technology.

3D integration is an emerging technology for the design of many-core microprocessors and memory integration. This book, Advances in 3D Integrated Circuits and Systems, is written to help readers understand 3D integrated circuits in three stages: device basics, system level management, and real designs.Contents presented in this book include fabrication techniques for 3D TSV and 2.5D TSI; device modeling; physical designs; thermal, power and I/O management; and 3D designs of sensors, I/Os, multi-core processors, and memory.Advanced undergraduates, graduate students, researchers and engineers may find this text useful for understanding the many challenges faced in the development and building of 3D integrated circuits and systems.

3D PRINTING FOR ENERGY APPLICATIONS Explore current and future perspectives of 3D printing for the fabrication of high value-added complex devices 3D Printing for Energy Applications delivers an insightful and cutting-edge exploration of the applications of 3D printing to the fabrication of complex devices in the energy sector. The book covers aspects related to additive manufacturing of functional materials with applicability in the energy sector. It reviews both the technology of printable materials and 3D printing strategies itself, and its use in energy devices or systems. Split into three sections, the book covers the 3D printing of functional materials before delving into the 3D printing of energy devices. It closes with printing challenges in the production of complex objects. It also presents an interesting perspective on the future of 3D printing of complex devices. Readers will also benefit from the inclusion of: A thorough introduction to 3D printing of functional materials, including metals, ceramics, and composites An exploration of 3D printing challenges for production of complex objects, including computational design, multimaterials, tailoring AM components, and volumetric additive manufacturing Practical discussions of 3D printing of energy devices, including batteries, supercaps, solar panels, fuel cells, turbomachinery, thermoelectrics, and CCUS Perfect for materials scientists, 3D Printing for Energy Applications will also earn a place in the libraries of graduate students in engineering, chemistry, and material sciences seeking a one-stop reference for current and future perspectives on 3D printing of high value-added complex devices.

This book describes the first comprehensive approach to the optimization of interconnect architectures in 3D systems on chips (SoCs), specially addressing the challenges and opportunities arising from heterogeneous integration. Readers learn about the physical implications of using heterogeneous 3D technologies for SoC integration, while also learning to maximize the 3D-technology gains, through a physical-effect-aware architecture design. The book provides a deep theoretical background covering all abstraction-levels needed to research and architect tomorrow’s 3D-integrated circuits, an extensive set of optimization methods (for power, performance, area, and yield), as well as an open-source optimization and simulation framework for fast exploration of novel designs.

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