This "must have" reference work for semiconductor professionals and researchers provides a basic understanding of how the most commonly used tools and techniques in silicon-based semiconductors are applied to understanding the root cause of electrical failures in integrated circuits.

The Electronic Device Failure Analysis Society proudly announces the Seventh Edition of the Microelectronics Failure Analysis Desk Reference, published by ASM International. The new edition will help engineers improve their ability to verify, isolate, uncover, and identify the root cause of failures. Prepared by a team of experts, this updated reference offers the latest information on advanced failure analysis tools and techniques, illustrated with numerous real-life examples. This book is geared to practicing engineers and for studies in the major area of power plant engineering. For non-metallurgists, a chapter has been devoted to the basics of material science, metallurgy of steels, heat treatment, and structure-property correlation. A chapter on materials for boiler tubes covers composition and application of different grades of steels and high temperature alloys currently in use as boiler tubes and future materials to be used in supercritical, ultra-supercritical and advanced ultra-supercritical thermal power plants. A comprehensive discussion on different mechanisms of boiler tube failure is the heart of the book. Additional chapters detailing the role of advanced material characterization techniques in failure investigation and the role of water chemistry in tube failures are key contributions to the book.

The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

Includes bibliographical references and index.

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers cover a wide range of testing and failure analysis topics of practical value to anyone working to detect, understand, and eliminate electronic device and system failures.

The 29th edition of the IEEE International Symposium on the Physical and Failure Analysis of Integrated Circuits (IPFA 2022) be held in person as a physical conference at the iconic Marina Bay Sands, Singapore from 18 21 July 2022 IPFA will continue to focus on the fundamental understanding of the electrical and physical characterization techniques and associated technologies that assist in probing the nature of wear out and failure in conventional and new CMOS devices, in turn resulting in improved knowhow of the physics of device circuit module failure that serves as critical input for future design for reliability We are also soliciting submissions in new and upcoming research areas including failure analysis for hardware security, reliability and failure analysis of power electronics, photovoltaic technologies, 2D Nanodevices and applications of machine learning and artificial intelligence to the field of failure analysis and reliability assessments

This volume features the latest research and practical data from the premier event for the microelectronics failure analysis community. The papers address the symposium's theme, Exploring the Many Facets of Failure Analysis.