This book provides comprehensive knowledge, aimed at practicing integrated circuit design engineer or researcher, to learn and design a low noise amplifier (LNA) for single and multiband applications. The content is structured in a way so that even a beginner can follow the design method easily. This book features the following characteristics: different types of LNA designs (with key building blocks) are discussed, and detailed analysis is given for each LNA design, which covers from the fundamental and principal knowledge to the justification of the design approach. Detailed design approaches are using 180 nm and 130nm CMOS technologies, purposely presented in this manner to give exposure to the design of LNA under different technologies. The LNAs in this book are designed for GSM, WCDMA and WLAN standards, but the same method can be used for other frequencies of operation. Comprehensive analyses on the extreme or corner condition effects are highlighted. Besides, detailed derivation of equations relating to the parameters of the LNA’s performance metrics help LNA designers in understanding how the performance metrics of the LNA can be optimized to meet the desired specification. Electromagnetic analyses using Sonnet, an electromagnetic tool able to replace the conventional post-layout simulation with resistance and capacitance parasitic extraction for more accurate frequency performance prediction are presented. The electromagnetic method is proposed to be used in the LNA design as it can accurately predict the LNA’s performance before tape-out for first-pass fabrication. MATLAB codes are provided to generate important S-parameters and noise figure values.

The Handbook of Smart Antennas for RFID Systems is a single comprehensive reference on the smart antenna technologies applied to RFID. This book will provide a timely reference book for researchers and students in the areas of both smart antennas and RFID technologies. It is the first book to combine two of the most important wireless technologies together in one book. The handbook will feature chapters by leading experts in both academia and industry offering an in-depth description of terminologies and concepts related to smart antennas in various RFID systems applications. Some topics are: adaptive beamforming for RFID smart antennas, multiuser interference suppression in RFID tag reading, phased array antennas for RFID applications, smart antennas in wireless systems and market analysis and case studies of RFID smart antennas. This handbook will cover the latest achievements in the designs and applications for smart antennas for RFID as well as the basic concepts, terms, protocols, systems architectures and case studies in smart antennas for RFID readers and tags.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Antennas are essential part of every wireless communication system. The increasing trend of applications in the radio frequency (RF) and millimeter wave frequency spectrum has reduced the antenna sizes to only a few millimeters, which makes it practical for on-chip implementations. Integrated Circuit (IC) designers who have traditionally remained isolated from antenna design now need to understand its design process and trade-offs. This comprehensive resource addresses the challenges, benefits and trade-offs of on-chip antenna implementation. It presents practical design and integration considerations of the IC and antenna combination and how both ends of the system can be utilized in a complimentary way. The book includes on-chip antenna layout considerations, layout for testability and various methods of their characterization. A look at the future trends and utilization of on-chip antennas for different applications concludes the book.

Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.