Research on radiation-tolerant electronics has increased rapidly over the past few years, resulting in many interesting approaches to modeling radiation effects and designing radiation-hardened integrated circuits and embedded systems. This research is strongly driven by the growing need for radiation-hardened electronics for space applications, high-energy physics experiments such as those on the Large Hadron Collider at CERN, and many terrestrial nuclear applications including nuclear energy and nuclear safety. With the progressive scaling of integrated circuit technologies and the growing complexity of electronic systems, their susceptibility to ionizing radiation has raised many exciting challenges, which are expected to drive research in the coming decade. In this book we highlight recent breakthroughs in the study of radiation effects in advanced semiconductor devices, as well as in high-performance analog, mixed signal, RF, and digital integrated circuits. We also focus on advances in embedded radiation hardening in both FPGA and microcontroller systems and apply radiation-hardened embedded systems for cryptography and image processing, targeting space applications.

A comprehensive guide to antenna design, manufacturing processes, antenna integration, and packaging Antenna-in-Package Technology and Applications contains an introduction to the history of AiP technology. It explores antennas and packages, thermal analysis and design, as well as measurement setups and methods for AiP technology. The authors—well-known experts on the topic—explain why microstrip patch antennas are the most popular and describe the myriad constraints of packaging, such as electrical performance, thermo-mechanical reliability, compactness, manufacturability, and cost. The book includes information on how the choice of interconnects is governed by JEDEC for automatic assembly and describes low-temperature co-fired ceramic, high-density interconnects, fan-out wafer level packaging–based AiP, and 3D-printing-based AiP. The book includes a detailed discussion of the surface laminar circuit–based AiP designs for large-scale mm-wave phased arrays for 94-GHz imagers and 28-GHz 5G New Radios. Additionally, the book includes information on 3D AiP for sensor nodes, near-field wireless power transfer, and IoT applications. This important book: • Includes a brief history of antenna-in-package technology • Describes package structures widely used in AiP, such as ball grid array (BGA) and quad flat no-leads (QFN) • Explores the concepts, materials and processes, designs, and verifications with special consideration for excellent electrical, mechanical, and thermal performance Written for students in electrical engineering, professors, researchers, and RF engineers, Antenna-in-Package Technology and Applications offers a guide to material selection for antennas and packages, antenna design with manufacturing processes and packaging constraints, antenna integration, and packaging.

Microwave and Millimeter Wave Circuits and Systems: Emerging Design, Technologies and Applications provides a wide spectrum of current trends in the design of microwave and millimeter circuits and systems. In addition, the book identifies the state-of-the art challenges in microwave and millimeter wave circuits systems design such as behavioral modeling of circuit components, software radio and digitally enhanced front-ends, new and promising technologies such as substrate-integrated-waveguide (SIW) and wearable electronic systems, and emerging applications such as tracking of moving targets using ultra-wideband radar, and new generation satellite navigation systems. Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate. Key Features: Discusses modeling and design strategies for new appealing applications in the domain of microwave and millimeter wave circuits and systems Written by experts active in the Microwave and Millimeter Wave frequency range (industry and academia) Addresses modeling/design/applications both from the circuit as from the system perspective Covers the latest innovations in the respective fields Each chapter treats a selected problem and challenge within the field of Microwave and Millimeter wave circuits, and contains case studies and examples where appropriate This book serves as an excellent reference for engineers, researchers, research project managers and engineers working in R&D, professors, and post-graduates studying related courses. It will also be of interest to professionals working in product development and PhD students.

The Fourier transform is one of the most fundamental tools for computing the frequency representation of signals. It plays a central role in signal processing, communications, audio and video compression, medical imaging, genomics, astronomy, as well as many other areas. Because of its widespread use, fast algorithms for computing the Fourier transform can benefit a large number of applications. The fastest algorithm for computing the Fourier transform is the Fast Fourier Transform (FFT), which runs in near-linear time making it an indispensable tool for many applications. However, today, the runtime of the FFT algorithm is no longer fast enough especially for big data problems where each dataset can be few terabytes. Hence, faster algorithms that run in sublinear time, i.e., do not even sample all the data points, have become necessary. This book addresses the above problem by developing the Sparse Fourier Transform algorithms and building practical systems that use these algorithms to solve key problems in six different applications: wireless networks; mobile systems; computer graphics; medical imaging; biochemistry; and digital circuits. This is a revised version of the thesis that won the 2016 ACM Doctoral Dissertation Award.

Despite the fact that in the digital domain, designers can take full benefits of IPs and design automation tools to synthesize and design very complex systems, the analog designers’ task is still considered as a ‘handcraft’, cumbersome and very time consuming process. Thus, tremendous efforts are being deployed to develop new design methodologies in the analog/RF and mixed-signal domains. This book collects 16 state-of-the-art contributions devoted to the topic of systematic design of analog, RF and mixed signal circuits. Divided in the two parts Methodologies and Techniques recent theories, synthesis techniques and design methodologies, as well as new sizing approaches in the field of robust analog and mixed signal design automation are presented for researchers and R/D engineers.

For thousands of years, men have struggled to establish their supremacy. At first, they used spirits to secure for themselves a function in a natural world that seemed to have taken sides with the feminine. Eventually, they created an all-mighty divinity, and established their status as second to none other than that highest of all authority. Sailing through history, we show that the way procreation was perceived has determined how men and women positioned themselves in the universe. It has wielded consequences that have deeply affected our evolution, from the primal vision of an all-encompassing natural world in which Mother Nature represented the source of all life, to the subjection of nature and woman, with God the Father sitting at the summit of the creation. This emphasis on gender and nature brings into perspective the current social and economic resurgence of women and the new attitude towards environment that needs to be protected from our own deeds. These intricate leitmotifs make us witness a turning point in our history.

About the way we use and reuse the resources in the building industry and ultimately eliminate the concept of waste. The book seeks to provide inspiration for 'building a circular future' by providing a set of principles and bringing forward the best practices from in and outside the building industry. This book presents findings, case studies, background and context for the project ?Building a Circular Future?, and consist of three main chapters: Design for Disassembly, Material Passport and Circular Economy. All content comes from extensive research and through workshops with partners across industries. The book furthermore provides 15 principles for "Building a Circular Future" and a thoroughly calculated business case, which documents that a demolition, that today would cost ?2.151.249,56 can be turned into a ?4.705.858,41 business upside in a future circular building industry.