Containing more than 300 equations and nearly 500 drawings, photographs, and micrographs, this reference surveys key areas such as optical measurements and in-line calibration methods. It describes cleanroom-based measurement technology used during the manufacture of silicon integrated circuits and covers model-based, critical dimension, overlay

Fundamental measurement problems in engineering, mechanics, manufacturing, and physics are now being solved by powerful optical methods. This book presents a lucid, up-to-date discussion of these optical methods. Beginning from a firm base in modern optics, the book proceeds through relevant theory of interference and diffraction and integrates this theory with descriptions of laboratory techniques and apparatus. Among the techniques discussed are classical interferometry, photoelasticity, geometric moire, spatial filtering, moire interferometry, holography, holographic interferometry, laser speckle interferometry, and video-based speckle methods. By providing a firm base in the physical principles and at the same time allowing the reader to perform meaningful experiments related to the topic being studied, the book offers a unique user-oriented approach that will appeal to students, researchers and practising engineers.

This the fourth volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 58 chapters on Application of Imaging Techniques to Mechanics of Materials and Structure. It presents findings from experimental and computational investigations involving a range of imaging techniques including Recovery of 3D Stress Intensity Factors From Surface Full-field Measurements, Identification of Cohesive-zone Laws From Crack-tip Deformation Fields, Application of High Speed Digital Image Correlation for Vibration Mode Shape Analysis, Characterization of Aluminum Alloys Using a 3D Full Field Measurement, and Low Strain Rate Measurements on Explosives Using DIC.