MEMS and Nanotechnology, Volume 4 represents one of eight volumes of technical papers presented at the Society for Experimental Mechanics Annual Conference on Experimental and Applied Mechanics, held at Uncasville, Connecticut, June 13-16, 2011. The full set of proceedings also includes volumes on Dynamic Behavior of Materials, Mechanics of Biological Systems and Materials, Mechanics of Time-Dependent Materials and Processes in Conventional and Multifunctional Materials; Optical Measurements, Modeling and, Metrology; Experimental and Applied Mechanics, Thermomechanics and Infra-Red Imaging, and Engineering Applications of Residual Stress.

This the second volume of six from the Annual Conference of the Society for Experimental Mechanics, 2010, brings together 40 chapters on Microelectromechanical Systems and Nanotechnology. It presents early findings from experimental and computational investigations on MEMS and Nanotechnology including contributions on Nanomechanical Standards, Magneto-mechanical MEMS Sensors, Piezoelectric MEMS for Energy Harvesting, and Linear and Nonlinear Mass Sensing.

Now in its third edition, Fundamentals of Microfabrication and Nanotechnology continues to provide the most complete MEMS coverage available. Thoroughly revised and updated the new edition of this perennial bestseller has been expanded to three volumes, reflecting the substantial growth of this field. It includes a wealth of theoretical and practical information on nanotechnology and NEMS and offers background and comprehensive information on materials, processes, and manufacturing options. The first volume offers a rigorous theoretical treatment of micro- and nanosciences, and includes sections on solid-state physics, quantum mechanics, crystallography, and fluidics. The second volume presents a very large set of manufacturing techniques for micro- and nanofabrication and covers different forms of lithography, material removal processes, and additive technologies. The third volume focuses on manufacturing techniques and applications of Bio-MEMS and Bio-NEMS. Illustrated in color throughout, this seminal work is a cogent instructional text, providing classroom and self-learners with worked-out examples and end-of-chapter problems. The author characterizes and defines major research areas and illustrates them with examples pulled from the most recent literature and from his own work.

Experimental and Applied Mechanics, Volume 4: Proceedings of the 2012 Annual Conference on Experimental and Applied Mechanics, the fourth volume of seven from the Conference, brings together 54 contributions to this important area of research and engineering. The collection presents early findings and case studies on fundamental and applied aspects of Experimental and Applied Mechanics, including papers on: Fracture & Fatigue Microscale & Microstructural Effects in Fatigue & Fracture Material Applications Composite Characterization Using Digital Image Correlation Techniques Multi-Scale Simulation and Testing of Composites Residual Stress Inverse Problems/Hybrid Methods Nano-Composites Microstructure Material Characterization Modeling and Uncertainty Quantification Impact Behavior of Composites

Contributions reporting on fundamental and applied investigations of the material science, biochemistry, and physics of biomedical microdevices with applications to Genomics and Proteomics. Topics include gene expression profiling utilizing microarray technology; imaging and sensing for gene detection and use in DNA analysis; and coverage of advanced microfluidic devices and the Humane Genome Project.

The fabrication of MEMS has been predominately achieved by etching the polysilicon material. However, new materials are in large demands that could overcome the hurdles in fabrication or manufacturing process. Although, an enormous amount of work being accomplished in the area, most of the information is treated as confidential or privileged. It is extremely hard to find the meaningful information for the new or related developments. This book is collection of chapters written by experts in MEMS and NEMS technology. Chapters are contributed on the development of new MEMS and NEMS materials as well as on the properties of these devices. Important properties such as residual stresses and buckling behavior in the devices are discussed as separate chapters. Various models have been included in the chapters that studies the mode and mechanism of failure of the MEMS and NEMS. This book is meant for the graduate students, research scholars and engineers who are involved in the research and developments of advanced MEMS and NEMS for a wide variety of applications. Critical information has been included for the readers that will help them in gaining precise control over dimensional stability, quality, reliability, productivity and maintenance in MEMS and NEMS. No such book is available in the market that addresses the developments and failures in these advanced devices.