Mechanics of Solder Alloy Interconnects

Mechanics of Solder Alloy Interconnects
Title Mechanics of Solder Alloy Interconnects PDF eBook
Author Darrel R. Frear
Publisher Springer Science & Business Media
Pages 434
Release 1994-01-31
Genre Computers
ISBN 9780442015053

Download Mechanics of Solder Alloy Interconnects Book in PDF, Epub and Kindle

The Mechanics of Solder Alloy Interconnects is a resource to be used in developing a solder joint reliability assessment. Each chapter is written to be used as a stand-alone resource for a particular aspect of materials and modeling issues. With this gained understanding, the reader in search of a solution to a solder joint reliability problem knows where in the materials and modeling communities to go for the appropriate answer.

The Mechanics of Solder Alloy Interconnects

The Mechanics of Solder Alloy Interconnects
Title The Mechanics of Solder Alloy Interconnects PDF eBook
Author
Publisher
Pages 418
Release 1994
Genre Solder and soldering
ISBN

Download The Mechanics of Solder Alloy Interconnects Book in PDF, Epub and Kindle

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture
Title Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture PDF eBook
Author E-H Wong
Publisher Woodhead Publishing
Pages 477
Release 2015-05-23
Genre Technology & Engineering
ISBN 0857099116

Download Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture Book in PDF, Epub and Kindle

Robust Design of Microelectronics Assemblies Against Mechanical Shock, Temperature and Moisture discusses how the reliability of packaging components is a prime concern to electronics manufacturers. The text presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques. The authors use their extensive experience to produce detailed chapters covering temperature, moisture, and mechanical shock induced failure, adhesive interconnects, and viscoelasticity. Useful program files and macros are also included. - Discusses how the reliability of packaging components is a prime concern to electronics manufacturers - Presents a thorough review of this important field of research, providing users with a practical guide that discusses theoretical aspects, experimental results, and modeling techniques - Includes program files and macros for additional study

Assembly and Reliability of Lead-Free Solder Joints

Assembly and Reliability of Lead-Free Solder Joints
Title Assembly and Reliability of Lead-Free Solder Joints PDF eBook
Author John H. Lau
Publisher Springer Nature
Pages 545
Release 2020-05-29
Genre Technology & Engineering
ISBN 9811539200

Download Assembly and Reliability of Lead-Free Solder Joints Book in PDF, Epub and Kindle

This book focuses on the assembly and reliability of lead-free solder joints. Both the principles and engineering practice are addressed, with more weight placed on the latter. This is achieved by providing in-depth studies on a number of major topics such as solder joints in conventional and advanced packaging components, commonly used lead-free materials, soldering processes, advanced specialty flux designs, characterization of lead-free solder joints, reliability testing and data analyses, design for reliability, and failure analyses for lead-free solder joints. Uniquely, the content not only addresses electronic manufacturing services (EMS) on the second-level interconnects, but also packaging assembly on the first-level interconnects and the semiconductor back-end on the 3D IC integration interconnects. Thus, the book offers an indispensable resource for the complete food chain of electronics products.

Lead-Free Solder Interconnect Reliability

Lead-Free Solder Interconnect Reliability
Title Lead-Free Solder Interconnect Reliability PDF eBook
Author Dongkai Shangguan
Publisher ASM International
Pages 292
Release 2005
Genre Technology & Engineering
ISBN 161503093X

Download Lead-Free Solder Interconnect Reliability Book in PDF, Epub and Kindle

Solder Materials

Solder Materials
Title Solder Materials PDF eBook
Author Kwang-lung Lin
Publisher World Scientific
Pages 388
Release 2018-07-13
Genre Technology & Engineering
ISBN 9813238216

Download Solder Materials Book in PDF, Epub and Kindle

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.

Modeling and Simulation for Microelectronic Packaging Assembly

Modeling and Simulation for Microelectronic Packaging Assembly
Title Modeling and Simulation for Microelectronic Packaging Assembly PDF eBook
Author Shen Liu
Publisher John Wiley & Sons
Pages 586
Release 2011-05-17
Genre Technology & Engineering
ISBN 0470827807

Download Modeling and Simulation for Microelectronic Packaging Assembly Book in PDF, Epub and Kindle

Although there is increasing need for modeling and simulation in the IC package design phase, most assembly processes and various reliability tests are still based on the time consuming "test and try out" method to obtain the best solution. Modeling and simulation can easily ensure virtual Design of Experiments (DoE) to achieve the optimal solution. This has greatly reduced the cost and production time, especially for new product development. Using modeling and simulation will become increasingly necessary for future advances in 3D package development. In this book, Liu and Liu allow people in the area to learn the basic and advanced modeling and simulation skills to help solve problems they encounter. Models and simulates numerous processes in manufacturing, reliability and testing for the first time Provides the skills necessary for virtual prototyping and virtual reliability qualification and testing Demonstrates concurrent engineering and co-design approaches for advanced engineering design of microelectronic products Covers packaging and assembly for typical ICs, optoelectronics, MEMS, 2D/3D SiP, and nano interconnects Appendix and color images available for download from the book's companion website Liu and Liu have optimized the book for practicing engineers, researchers, and post-graduates in microelectronic packaging and interconnection design, assembly manufacturing, electronic reliability/quality, and semiconductor materials. Product managers, application engineers, sales and marketing staff, who need to explain to customers how the assembly manufacturing, reliability and testing will impact their products, will also find this book a critical resource. Appendix and color version of selected figures can be found at www.wiley.com/go/liu/packaging