Reliability concerns have forced interconnect systems to scale more slowly than devices. As a result, reliability engineers and scientists are now responsible for much of the performance and lifetime gains anticipated in the microelectronics industry. To achieve these gains, the interconnect must be viewed as a complex system with many types of reliability issues. A critical understanding of electromigration, stress-induced voiding, mechanical integrity, thermal performance, chemical effects, and oxide reliability are necessary. And of course, new models and materials will likely be necessary to improve the interconnect system for future needs. This book brings together researchers from academia and industry to discuss fundamental mechanisms and phenomena in the reliability field. Topics include: novel measurement techniques; microstructural effects; reliability modelling; stress effects; advanced inter-connect reliability; adhesion and fracture; and packaging reliability issues.

The 31 papers, about half of the symposium's presentations, were selected to provide a representative sampling of the present status of materials used in vacuum microelectronics. They range across all aspects of electron field emission from theory and physical mechanisms to device structure, but many focus on the fabrication, characterization, and modeling of electron emissive materials. The sections cover field-emitter arrays and applications, carbon and wide-bandgap cathodes, and other cathode materials. Reproduced from typescripts. Annotation copyrighted by Book News, Inc., Portland, OR

Discusses the application of computer-aided and analytical methods and approaches of materials science and engineering mechanics to evaluating and assuring the short-term and long-term reliability of materials and structures in photonics engineering. The main concern is the mechanical reliability of the system and the impact of the mechanical behavior of photonics material and structures on the system's optical performance. The 49 papers cover general problems, strength degradation, fatigue and ageing in the materials, the structural analysis and modelling of the mechanical behavior, high- strength and metallized fibers, performance in harsh environments, and the reliability of devices. Annotation copyrighted by Book News, Inc., Portland, OR

This new game book for understanding atoms at play aims to document diffusion processes and various other properties operative in advanced technological materials. Diffusion in functional organic chemicals, polymers, granular materials, complex oxides, metallic glasses, and quasi-crystals among other advanced materials is a highly interactive and synergic phenomenon. A large variety of atomic arrangements are possible. Each arrangement affects the performance of these advanced, polycrystalline multiphase materials used in photonics, MEMS, electronics, and other applications of current and developing interest. This book is written by pioneers in industry and academia for engineers, chemists, and physicists in industry and academia at the forefront of today's challenges in nanotechnology, surface science, materials science, and semiconductors.