The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners. This book, first published in 2007, focuses on the application of defects and impurities in current and emerging semiconductor technologies.

The MRS Symposium Proceeding series is an internationally recognised reference suitable for researchers and practitioners.

The field of organic/inorganic hybrids has evolved significantly, providing materials with increasing architectural complexities and functionalities. Scientists involved in this field are gradually moving from building materials using a classical molecular approach (e.g. polymerization) to assembling materials on the nanoscale, using a variety of innovative strategies which can vary from the assembly of DNA motifs, to the formation of mesoporous materials by spinodal decomposition, or the use of nanoparticles or oxoclusters as nanobuilding blocks for building complex structures such as nacre-like transition metal oxides. This precise control over the materials architecture also adds functionality to the hybrid materials, whether it is for designing special membranes for phase separation and chromatography or thin films for photonic or magnetic applications. This book presents contributions from researchers worldwide and discusses organosiloxane-based materials; mesoporous materials and films; layered materials; surface and interface modification and characterization; controlled release and biological applications; nanoparticles synthesis and assembly; nanocomposites and new concepts.

Thin-film compound semiconductor photovoltaic solar cells have demonstrated efficiencies of nearly 20% and are leading candidates to provide lower-cost energy due to potential advantages in manufacturing and materials costs. To fulfill the promise, a number of technical issues are being addressed, including a lack of fundamental understanding of these unique materials, devices and processes for large-area deposition. This book focuses on advances in the materials science, chemistry, processing and device issues of thin-film compound semiconductor materials that are used, or have potential use, in photovoltaic solar cells and related applications. Topics include: growth and performance of compound thin-film solar cells; novel materials and processes; defects and impurities; industrial perspectives; contacts and interfaces; grain boundaries and inhomogeneities; and structural, optical and electronic characterization.

The use of copper, silver, gold and platinum in jewelry as a measure of wealth is well known. This book contains 19 chapters written by international authors on other uses and applications of noble and precious metals (copper, silver, gold, platinum, palladium, iridium, osmium, rhodium, ruthenium, and rhenium). The topics covered include surface-enhanced Raman scattering, quantum dots, synthesis and properties of nanostructures, and its applications in the diverse fields such as high-tech engineering, nanotechnology, catalysis, and biomedical applications. The basis for these applications is their high-free electron concentrations combined with high-temperature stability and corrosion resistance and methods developed for synthesizing nanostructures. Recent developments in all these areas with up-to-date references are emphasized.

LEARN ABOUT MICROSYSTEMS PACKAGING FROM THE GROUND UP Written by Rao Tummala, the field’s leading author, Fundamentals of Microsystems Packaging is the only book to cover the field from wafer to systems, including every major contributing technology. This rigorous and thorough introduction to electronic packaging technologies gives you a solid grounding in microelectronics, photonics, RF, packaging design, assembly, reliability, testing, and manufacturing and its relevance to both semiconductors and systems. You’ll find: *Full coverage of electrical, mechanical, chemical, and materials aspects of each technology *Easy-to-read schematics and block diagrams *Fundamental approaches to all system issues *Examples of all common configurations and technologies—wafer level packaging, single chip, multichip, RF, opto-electronic, microvia boards, thermal and others *Details on chip-to-board connections, sealing and encapsulation, and manufacturing processes *Basics of electrical and reliability testing