Including papers from the 9th edition of the International Conference on Computational Methods and Experiments in Material and Contact Characterisation this volume presents the work of selected researchers on the subject. Material and contact characterisation is a rapidly advancing field and this volume contains the latest research. Of particular interest to industry and society is the knowledge of surface treatment and contact mechanics of these materials to determine the in-service behaviour of components subject to contact conditions. Modern society requires systems that operate at conditions that use resources effectively. In terms of components durability, the understanding of surface engineering wear frictional and lubrication dynamics has never been so important. Current research is focussed on modification technologies that can increase the surface durability of materials. The characteristics of the system reveal which surface engineering methods should be chosen and as a consequence it is essential to study the combination of surface treatment and contact mechanics. The accurate characterisation of the physical and chemical properties of materials requires the application of both experimental techniques and computer simulation methods in order to gain a correct analysis. A very wide range of materials, starting with metals through polymers and semiconductors to composites, necessitates a whole spectrum of characteristic experimental techniques and research methods. The papers in the book cover a number of topics, including: Computer methods and simulation; Experimental and measurement techniques; Mechanical characterisation and testing; Materials under extreme conditions; Polymers and plastics; Advances in composites; Micro and macro characterisation; Corrosion and erosion; Damage, fatigue and fracture; Recycled materials; Materials and energy; Surface problems and contact mechanics; Surface modification and treatments; Thick and thin coatings; Tribomechanics and wear mechanics; Biomechanical characterisation; Biomechanical applications and Case studies.

Experiments, and discusses the following topics: Surface treatments; Thick coatings; Thin coatings; Surface problems in contact mechanics; Indentation and hardness; Fatigue; Numerical analysis; Applications and case studies." --Book Jacket.

Composed of papers presented at the 10th conference on Multiphase flow this book presents the latest research on the subject. The research included in this volume focuses on using synergies between experimental and computational techniques to gain a better understanding of all classes of multiphase and complex flow.

This Third Edition updates a landmark text with the latest findings The Third Edition of the internationally lauded Semiconductor Material and Device Characterization brings the text fully up-to-date with the latest developments in the field and includes new pedagogical tools to assist readers. Not only does the Third Edition set forth all the latest measurement techniques, but it also examines new interpretations and new applications of existing techniques. Semiconductor Material and Device Characterization remains the sole text dedicated to characterization techniques for measuring semiconductor materials and devices. Coverage includes the full range of electrical and optical characterization methods, including the more specialized chemical and physical techniques. Readers familiar with the previous two editions will discover a thoroughly revised and updated Third Edition, including: Updated and revised figures and examples reflecting the most current data and information 260 new references offering access to the latest research and discussions in specialized topics New problems and review questions at the end of each chapter to test readers' understanding of the material In addition, readers will find fully updated and revised sections in each chapter. Plus, two new chapters have been added: Charge-Based and Probe Characterization introduces charge-based measurement and Kelvin probes. This chapter also examines probe-based measurements, including scanning capacitance, scanning Kelvin force, scanning spreading resistance, and ballistic electron emission microscopy. Reliability and Failure Analysis examines failure times and distribution functions, and discusses electromigration, hot carriers, gate oxide integrity, negative bias temperature instability, stress-induced leakage current, and electrostatic discharge. Written by an internationally recognized authority in the field, Semiconductor Material and Device Characterization remains essential reading for graduate students as well as for professionals working in the field of semiconductor devices and materials. An Instructor's Manual presenting detailed solutions to all the problems in the book is available from the Wiley editorial department.

In this collection, scientists and engineers from across industry, academia, and government present their latest improvements and innovations in all aspects of metal forming science and technology, with the intent of facilitating linkages and collaborations among these groups. Chapters cover the breadth of metal forming topics, from fundamental science to industrial application.

Microstructural characterization is usually achieved by allowing some form of probe to interact with a carefully prepared specimen. The most commonly used probes are visible light, X-ray radiation, a high-energy electron beam, or a sharp, flexible needle. These four types of probe form the basis for optical microscopy, X-ray diffraction, electron microscopy, and scanning probe microscopy. Microstructural Characterization of Materials, 2nd Edition is an introduction to the expertise involved in assessing the microstructure of engineering materials and to the experimental methods used for this purpose. Similar to the first edition, this 2nd edition explores the methodology of materials characterization under the three headings of crystal structure, microstructural morphology, and microanalysis. The principal methods of characterization, including diffraction analysis, optical microscopy, electron microscopy, and chemical microanalytical techniques are treated both qualitatively and quantitatively. An additional chapter has been added to the new edition to cover surface probe microscopy, and there are new sections on digital image recording and analysis, orientation imaging microscopy, focused ion-beam instruments, atom-probe microscopy, and 3-D image reconstruction. As well as being fully updated, this second edition also includes revised and expanded examples and exercises, with a solutions manual available at http://develop.wiley.co.uk/microstructural2e/ Microstructural Characterization of Materials, 2nd Edition will appeal to senior undergraduate and graduate students of material science, materials engineering, and materials chemistry, as well as to qualified engineers and more advanced researchers, who will find the book a useful and comprehensive general reference source.

This book covers state-of-the-art techniques commonly used in modern materials characterization. Two important aspects of characterization, materials structures and chemical analysis, are included. Widely used techniques, such as metallography (light microscopy), X-ray diffraction, transmission and scanning electron microscopy, are described. In addition, the book introduces advanced techniques, including scanning probe microscopy. The second half of the book accordingly presents techniques such as X-ray energy dispersive spectroscopy (commonly equipped in the scanning electron microscope), fluorescence X-ray spectroscopy, and popular surface analysis techniques (XPS and SIMS). Finally, vibrational spectroscopy (FTIR and Raman) and thermal analysis are also covered.