This book addresses the growing interest in low temperature technologies. Since the subject of low temperature materials and mechanisms is multidisciplinary, the chapters reflect the broadest possible perspective of the field. Leading experts in the specific subject area address the various related science and engineering chemistry, material science, electrical engineering, mechanical engineering, metallurgy, and physics.

The use of high-temperature materials in current and future applications, including silicone materials for handling hot foods and metal alloys for developing high-speed aircraft and spacecraft systems, has generated a growing interest in high-temperature technologies. High Temperature Materials and Mechanisms explores a broad range of issues related to high-temperature materials and mechanisms that operate in harsh conditions. While some applications involve the use of materials at high temperatures, others require materials processed at high temperatures for use at room temperature. High-temperature materials must also be resistant to related causes of damage, such as oxidation and corrosion, which are accelerated with increased temperatures. This book examines high-temperature materials and mechanisms from many angles. It covers the topics of processes, materials characterization methods, and the nondestructive evaluation and health monitoring of high-temperature materials and structures. It describes the application of high temperature materials to actuators and sensors, sensor design challenges, as well as various high temperature materials and mechanisms applications and challenges. Utilizing the knowledge of experts in the field, the book considers the multidisciplinary nature of high temperature materials and mechanisms, and covers technology related to several areas including energy, space, aerospace, electronics, and metallurgy. Supplies extensive references at the end of each chapter to enhance further study Addresses related science and engineering disciplines Includes information on drills, actuators, sensors and more A comprehensive resource of information consolidated in one book, this text greatly benefits students in materials science, aerospace and mechanical engineering, and physics. It is also an ideal resource for professionals in the industry.

Device and Circuit Cryogenic Operation for Low Temperature Electronics is a first in reviewing the performance and physical mechanisms of advanced devices and circuits at cryogenic temperatures that can be used for many applications. The first two chapters cover bulk silicon and SOI MOSFETs. The electronic transport in the inversion layer, the influence of impurity freeze-out, the special electrical properties of SOI structures, the device reliability and the interest of a low temperature operation for the ultimate integration of silicon down to nanometer dimensions are described. The next two chapters deal with Silicon-Germanium and III-V Heterojunction Bipolar Transistors, as well as III-V High Electron Mobility Transistors (HEMT). The basic physics of the SiGe HBT and its unique cryogenic capabilities, the optimization of such bipolar devices, and the performance of SiGe HBT BiCMOS technology at liquid nitrogen temperature are examined. The physical effects in III-V semiconductors at low temperature, the HEMT and HBT static, high frequency and noise properties, and the comparison of various cooled III-V devices are also addressed. The next chapter treats quantum effect devices made of silicon materials. The major quantum effects at low temperature, quantum wires, quantum dots as well as single electron devices and applications are investigated. The last chapter overviews the performances of cryogenic circuits and their applications. The low temperature properties and performance of inverters, multipliers, adders, operational amplifiers, memories, microprocessors, imaging devices, circuits and systems, sensors and read-out circuits are analyzed. Device and Circuit Cryogenic Operation for Low Temperature Electronics is useful for researchers, engineers, Ph.D. and M.S. students working in the field of advanced electron devices and circuits, new semiconductor materials, and low temperature electronics and physics.

Low-temperature stress is the primary abiotic stress that affects the growth and development of plants and their geographical distribution. This can lead to the solidification of membrane lipids and decrease of enzymatic reaction rate in plants in a relatively short time, or indirectly affect the imbalance of respiration and photosynthesis, accumulation of toxic substances, ATP depletion, cell solute leakage and wilting due to water loss. Low-temperature stress can be divided into chilling stress and freezing stress according to the damage caused to plants. Both chilling and freezing stress drastically threaten global food security and species diversity in the northern and frigid temperate zones. Once plants experience low-temperature stress, the regulation mechanism of gene expression is rapidly activated to cope with the adverse environment.

Themes reflect the work carried out within the framework of COST-501 and of COST-505 the latter being concerned with materials for steam turbines and the first results of the concerted action COST-501/II 'High temperature materials for power engineering' initiated in 1988.