This book addresses the growing interest in low temperature technologies. Since the subject of low temperature materials and mechanisms is multidisciplinary, the chapters reflect the broadest possible perspective of the field. Leading experts in the specific subject area address the various related science and engineering chemistry, material science, electrical engineering, mechanical engineering, metallurgy, and physics.

The use of high-temperature materials in current and future applications, including silicone materials for handling hot foods and metal alloys for developing high-speed aircraft and spacecraft systems, has generated a growing interest in high-temperature technologies. High Temperature Materials and Mechanisms explores a broad range of issues related to high-temperature materials and mechanisms that operate in harsh conditions. While some applications involve the use of materials at high temperatures, others require materials processed at high temperatures for use at room temperature. High-temperature materials must also be resistant to related causes of damage, such as oxidation and corrosion, which are accelerated with increased temperatures. This book examines high-temperature materials and mechanisms from many angles. It covers the topics of processes, materials characterization methods, and the nondestructive evaluation and health monitoring of high-temperature materials and structures. It describes the application of high temperature materials to actuators and sensors, sensor design challenges, as well as various high temperature materials and mechanisms applications and challenges. Utilizing the knowledge of experts in the field, the book considers the multidisciplinary nature of high temperature materials and mechanisms, and covers technology related to several areas including energy, space, aerospace, electronics, and metallurgy. Supplies extensive references at the end of each chapter to enhance further study Addresses related science and engineering disciplines Includes information on drills, actuators, sensors and more A comprehensive resource of information consolidated in one book, this text greatly benefits students in materials science, aerospace and mechanical engineering, and physics. It is also an ideal resource for professionals in the industry.

Low Temperature Electronics: Physics, Devices, Circuits, and Applications summarizes the recent advances in cryoelectronics starting from the fundamentals in physics and semiconductor devices to electronic systems, hybrid superconductor-semiconductor technologies, photonic devices, cryocoolers and thermal management. Furthermore, this book provides an exploration of the currently available theory, research, and technologies related to cryoelectronics, including treatment of the solid state physical properties of the materials used in these systems. Current applications are found in infrared systems, satellite communications and medical equipment. There are opportunities to expand in newer fields such as wireless and mobile communications, computers, and measurement and scientific equipment. Low temperature operations can offer certain advantages such as higher operational speeds, lower power dissipation, shorter signal transmission times, higher semiconductor and metal thermal conductivities, and improved digital and analog circuit performance.The computer, telecommunication, and cellular phone market is pushing the semiconductor industry towards the development of very aggressive device and integrated circuit fabrication technologies. This is taking these technologies towards the physical miniaturization limit, where quantum effects and fabrication costs are becoming a technological and economical barrier for further development. In view of these limitations, operation of semiconductor devices and circuits at low temperature (cryogenic temperature) is studied in this book.* It is a book intended for a wide audience: students, scientists, technology development engineers, private companies, universities, etc.* It contains information which is for the first time available as an all-in-one source; Interdisciplinary material is arranged and made compatible in this book* It is a must as reference source

* Numerous line drawings with consistent format and units allow easy comparison of the behavior of a very wide range of materials * Transmission electron micrographs provide a direct insight in the basic microstructure of metals deforming at high temperatures * Extensive literature review of over 1000 references provide an excellent reference document, and a very balanced discussionUnderstanding the strength of materials at a range of temperatures is critically important to a huge number of researchers and practitioners from a wide range of fields and industry sectors including metallurgists, industrial designers, aerospace R&D personnel, and structural engineers. The most up-to date and comprehensive book in the field, Fundamentals of Creep in Metals and Alloys discusses the fundamentals of time-dependent plasticity or creep plasticity in metals, alloys and metallic compounds. This is the first book of its kind that provides broad coverage of a range of materials not just a sub-group such as metallic compounds, superalloys or crystals. As such it presents the most balanced view of creep for all materials scientists. The theory of all of these phenomena are extensively reviewed and analysed in view of an extensive bibliography that includes the most recent publications in the field. All sections of the book have undergone extensive peer review and therefore the reader can be sure they have access to the most up-to-date research, fully interrogated, from the world's leading investigators.· Numerous line drawings with consistent format and units allow easy comparison of the behavior of a very wide range of materials· Transmission electron micrographs provide a direct insight in the basic microstructure of metals deforming at high temperatures· Extensive literature review of over 1000 references provide an excellent reference document, and a very balanced discussion

Device and Circuit Cryogenic Operation for Low Temperature Electronics is a first in reviewing the performance and physical mechanisms of advanced devices and circuits at cryogenic temperatures that can be used for many applications. The first two chapters cover bulk silicon and SOI MOSFETs. The electronic transport in the inversion layer, the influence of impurity freeze-out, the special electrical properties of SOI structures, the device reliability and the interest of a low temperature operation for the ultimate integration of silicon down to nanometer dimensions are described. The next two chapters deal with Silicon-Germanium and III-V Heterojunction Bipolar Transistors, as well as III-V High Electron Mobility Transistors (HEMT). The basic physics of the SiGe HBT and its unique cryogenic capabilities, the optimization of such bipolar devices, and the performance of SiGe HBT BiCMOS technology at liquid nitrogen temperature are examined. The physical effects in III-V semiconductors at low temperature, the HEMT and HBT static, high frequency and noise properties, and the comparison of various cooled III-V devices are also addressed. The next chapter treats quantum effect devices made of silicon materials. The major quantum effects at low temperature, quantum wires, quantum dots as well as single electron devices and applications are investigated. The last chapter overviews the performances of cryogenic circuits and their applications. The low temperature properties and performance of inverters, multipliers, adders, operational amplifiers, memories, microprocessors, imaging devices, circuits and systems, sensors and read-out circuits are analyzed. Device and Circuit Cryogenic Operation for Low Temperature Electronics is useful for researchers, engineers, Ph.D. and M.S. students working in the field of advanced electron devices and circuits, new semiconductor materials, and low temperature electronics and physics.

Measurements, Mechanisms, and Models of Heat Transport offers an interdisciplinary approach to the dynamic response of matter to energy input. Using a combination of fundamental principles of physics, recent developments in measuring time-dependent heat conduction, and analytical mathematics, this timely reference summarizes the relative advantages of currently used methods, and remediates flaws in modern models and their historical precursors. Geophysicists, physical chemists, and engineers will find the book to be a valuable resource for its discussions of radiative transfer models and the kinetic theory of gas, amended to account for atomic collisions being inelastic. This book is a prelude to a companion volume on the thermal state, formation, and evolution of planets. Covering both microscopic and mesoscopic phenomena of heat transport, Measurements, Mechanisms, and Models of Heat Transport offers both the fundamental knowledge and up-to-date measurements and models to encourage further improvem - Combines state-of-the-art measurements with core principles to lead to a better understanding of heat conduction and of radiative diffusion, and how these processes are linked - Focuses on macroscopic models of heat transport and the underlying physical principles, providing the tools needed to solve many different problems in heat transport - Connects thermodynamics with behavior of light in revising the kinetic theory of gas, which underlies all models of heat transport, and uses such links to re-derive formulae for blackbody emissions - Explores all states of matter, with an emphasis on crystalline and amorphous solids

Low-temperature stress is the primary abiotic stress that affects the growth and development of plants and their geographical distribution. This can lead to the solidification of membrane lipids and decrease of enzymatic reaction rate in plants in a relatively short time, or indirectly affect the imbalance of respiration and photosynthesis, accumulation of toxic substances, ATP depletion, cell solute leakage and wilting due to water loss. Low-temperature stress can be divided into chilling stress and freezing stress according to the damage caused to plants. Both chilling and freezing stress drastically threaten global food security and species diversity in the northern and frigid temperate zones. Once plants experience low-temperature stress, the regulation mechanism of gene expression is rapidly activated to cope with the adverse environment.