Annotation The second edition covers the latest in fabrication technologies, actuation mechanisms, packaging, switching, resonator design, and microwave and wireless applications. This practical book steers readers past the drawbacks and towards the benefits of integrating RF/microwave MEMS into communications equipment

Receivers systems are considered the core of electronic warfare (EW) intercept systems. Without them, the fundamental purpose of such systems is null and void. This book considers the major elements that make up receiver systems and the receivers that go in them. This resource provides system design engineers with techniques for design and development of EW receivers for modern modulations (spread spectrum) in addition to receivers for older, common modulation formats. Each major module in these receivers is considered in detail. Design information is included as well as performance tradeoffs of various components. Major factors that influence the functioning of the modules are identified and discussed. Key performance parameters are identified as well, and approaches to achieving design goals are considered.

The multi-billion-dollar microsystem packaging business continues to play an increasingly important technical role in today’s information industry. The packaging process—including design and manufacturing technologies—is the technical foundation upon which function chips are updated for use in application systems, and it is an important guarantee of the continued growth of technical content and value of information systems. Introduction to Microsystem Packaging Technology details the latest advances in this vital area, which involves microelectronics, optoelectronics, RF and wireless, MEMS, and related packaging and assembling technologies. It is purposefully written so that each chapter is relatively independent and the book systematically presents the widest possible overview of packaging knowledge. Elucidates the evolving world of packaging technologies for manufacturing The authors begin by introducing the fundamentals, history, and technical challenges of microsystems. Addressing an array of design techniques for packaging and integration, they cover substrate and interconnection technologies, examples of device- and system-level packaging, and various MEMS packaging techniques. The book also discusses module assembly and optoelectronic packaging, reliability methodologies and analysis, and prospects for the evolution and future applications of microsystems packaging and associated environmental protection. With its research examples and targeted reference questions and answers to reinforce understanding, this text is ideal for researchers, engineers, and students involved in microelectronics and MEMS. It is also useful to those who are not directly engaged in packaging but require a solid understanding of the field and its associated technologies.

This is the first comprehensive book to address the design of RF MEMS-based circuits for use in high performance wireless systems. A groundbreaking research and reference tool, the book enables you to understand the realm of applications of RF MEMS technology; become knowledgeable of the wide variety and performance levels of RF MEMS devices; and partition the architecture of wireless systems to achieve greater levels of performance. This innovative resource also guides you through the design process of RF MEMS-based circuits, and establishes a practical knowledge base for the design of high-yield RF MEMS-based circuits. The book features exercises and detailed case studies on working RF MEMS circuits that help you decide what approaches best fit your design constraints. This unified treatment of RF MEMS-based circuit technology opens up a new world of solutions for meeting the unique challenges of low power/portable wireless products.

Microelectromechanical Systems (MEMS) stand poised for the next major breakthrough in the silicon revolution that began with the transistor in the 1960s and has revolutionized microelectronics. MEMS allow one to not only observe and process information of all types from small scale systems, but also to affect changes in systems and the environment at that scale. “RF MEMS Switches and Integrated Switching Circuits” builds on the extensive body of literature that exists in research papers on analytical and numerical modeling and design based on RF MEMS switches and micromachined switching circuits, and presents a unified framework of coverage. This volume includes, but is not limited to, RF MEMS approaches, developments from RF MEMS switches to RF switching circuits, and MEMS switch components in circuit systems. This book also: -Presents RF Switches and switching circuit MEMS devices in a unified framework covering all aspects of engineering innovation, design, modeling, fabrication, control and experimental implementation -Discusses RF switch devices in detail, with both system and component-level circuit integration using micro- and nano-fabrication techniques -Includes an emphasis on design innovation and experimental relevance rather than basic electromagnetic theory and device physics “RF MEMS Switches and Integrated Switching Circuits” is perfect for engineers, researchers and students working in the fields of MEMS, circuits and systems and RFs.

The operational theme permeating most definitions of the IoT concept, is the wireless communication of networked objects, in particular, smart sensing devices and machines, exchanging data a la Internet. In this book, a detailed look is taken at the fundamental principles of devices and techniques whose exploitation will facilitate the development of compact, power-efficient, autonomous, smart, networked sensing nodes underlying and encompassing the emerging IoT era.The book provides an understanding of nanoelectromechanical quantum circuits and systems (NEMX), as exemplified by firstly the uncovering of their origins, impetus and motivation, and secondly by developing an understanding of their device physics, including, the topics of actuation, mechanical vibration and sensing. Next the fundamentals of key devices, namely, MEMS/NEMS switches, varactors and resonators are covered, including a wide range of implementations. The book then looks at their energy supply via energy harvesting, as derived from wireless energy and mechanical vibrations. Finally, after an introduction to the fundamentals of IoT networks and nodes, the book concludes with an exploration of how the NEMX components are encroaching in a variety of emerging IoT applications.