We live in a time of great change. In the electronics world, the last several decades have seen unprecedented growth and advancement, described by Moore’s law. This observation stated that transistor density in integrated circuits doubles every 1. 5–2 years. This came with the simultaneous improvement of individual device perf- mance as well as the reduction of device power such that the total power of the resulting ICs remained under control. No trend remains constant forever, and this is unfortunately the case with Moore’s law. The trouble began a number of years ago when CMOS devices were no longer able to proceed along the classical scaling trends. Key device parameters such as gate oxide thickness were simply no longer able to scale. As a result, device o- state currents began to creep up at an alarming rate. These continuing problems with classical scaling have led to a leveling off of IC clock speeds to the range of several GHz. Of course, chips can be clocked higher but the thermal issues become unmanageable. This has led to the recent trend toward microprocessors with mul- ple cores, each running at a few GHz at the most. The goal is to continue improving performance via parallelism by adding more and more cores instead of increasing speed. The challenge here is to ensure that general purpose codes can be ef?ciently parallelized. There is another potential solution to the problem of how to improve CMOS technology performance: three-dimensional integrated circuits (3D ICs).

This book constitutes the refereed proceedings of the 13th International Workshop on Power and Timing Modeling, Optimization and Simulation, PATMOS 2003, held in Torino, Italy in September 2003. The 43 revised full papers and 18 revised poster papers presented together with three keynote contributions were carefully reviewed and selected from 85 submissions. The papers are organized in topical sections on gate-level modeling and characterization, interconnect modeling and optimization, asynchronous techniques, RTL power modeling and memory optimization, high-level modeling, power-efficient technologies and designs, communication modeling and design, and low-power issues in processors and multimedia.

It follows with a thorough treatment of design operational and operational transconductance amplifiers, and concludes with a unified presentation of sample-data and continuous-time signal processing systems.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

This book describes the design of CMOS circuits for ultra-low power consumption including analog, radio frequency (RF), and digital signal processing circuits (DSP). The book addresses issues from circuit and system design to production design, and applies the ultra-low power circuits described to systems for digital hearing aids and capsule endoscope devices. Provides a valuable introduction to ultra-low power circuit design, aimed at practicing design engineers; Describes all key building blocks of ultra-low power circuits, from a systems perspective; Applies circuits and systems described to real product examples such as hearing aids and capsule endoscopes.

WelcometotheproceedingsofPATMOS2004,thefourteenthinaseriesofint- national workshops. PATMOS 2004 was organized by the University of Patras with technical co-sponsorship from the IEEE Circuits and Systems Society. Over the years, the PATMOS meeting has evolved into an important - ropean event, where industry and academia meet to discuss power and timing aspects in modern integrated circuit and system design. PATMOS provides a forum for researchers to discuss and investigate the emerging challenges in - sign methodologies and tools required to develop the upcoming generations of integrated circuits and systems. We realized this vision this year by providing a technical program that contained state-of-the-art technical contributions, a keynote speech, three invited talks and two embedded tutorials. The technical program focused on timing, performance and power consumption, as well as architectural aspects, with particular emphasis on modelling, design, charac- rization, analysis and optimization in the nanometer era. This year a record 152 contributions were received to be considered for p- sible presentation at PATMOS. Despite the choice for an intense three-day m- ting, only 51 lecture papers and 34 poster papers could be accommodated in the single-track technical program. The Technical Program Committee, with the - sistance of additional expert reviewers, selected the 85 papers to be presented at PATMOS and organized them into 13 technical sessions. As was the case with the PATMOS workshops, the review process was anonymous, full papers were required, and several reviews were received per manuscript.

The latest techniques for designing robust, high performance integrated circuits in nanoscale technologies Focusing on a new technological paradigm, this practical guide describes the interconnect-centric design methodologies that are now the major focus of nanoscale integrated circuits (ICs). High Performance Integrated Circuit Design begins by discussing the dominant role of on-chip interconnects and provides an overview of technology scaling. The book goes on to cover data signaling, power management, synchronization, and substrate-aware design. Specific design constraints and methodologies unique to each type of interconnect are addressed. This comprehensive volume also explains the design of specialized circuits such as tapered buffers and repeaters for data signaling, voltage regulators for power management, and phase-locked loops for synchronization. This is an invaluable resource for students, researchers, and engineers working in the area of high performance ICs. Coverage includes: Technology scaling Interconnect modeling and extraction Signal propagation and delay analysis Interconnect coupling noise Global signaling Power generation Power distribution networks CAD of power networks Techniques to reduce power supply noise Power dissipation Synchronization theory and tradeoffs Synchronous system characteristics On-chip clock generation and distribution Substrate noise in mixed-signal ICs Techniques to reduce substrate noise