Impact ionization, avalanche and breakdown phenomena form the basis of many very interesting and important semiconductor devices, such as avalanche photodiodes, avalanche transistors, suppressors, sharpening diodes (diodes with delayed breakdown), as well as IMPATT and TRAPATT diodes. In order to provide maximal speed and power, many semiconductor devices must operate under or very close to breakdown conditions. Consequently, an acquaintance with breakdown phenomena is essential for scientists or engineers dealing with semiconductor devices.The aim of this book is to summarize the main experimental results on avalanche and breakdown phenomena in semiconductors and semiconductor devices and to analyze their features from a unified point of view. Attention is focused on the phenomenology of avalanche multiplication and the various kinds of breakdown phenomena and their qualitative analysis.

Semiconductors and Semimetals

The only available, comprehensive reference on dielectric phenomena in solids.

Special Injection Molding Techniques covers several techniques used to create multicomponent products, hollow areas, and hard-soft combinations that cannot be produced with standard injection molding processes. It also includes information on the processing techniques of special materials, including foaming agents, bio-based materials, and thermosets. The book describes the most industrially relevant special injection molding techniques, with a detailed focus on understanding the basics of each technique and its main mechanisms, i.e., temperature, mold filling, bonding, residual stresses, and material behavior, also providing an explanation of process routes and their variants, and discussions of the most influencing process parameters. As special molding technologies have the potential to transform plastics processing to a highly-efficient, integrated type of manufacturing, this book provides a timely survey of these technologies, putting them into context, accentuating new opportunities, and giving relevant information on processing. Provides information about the basics needed for understanding several special injection molding techniques, including flow phenomena, bonding mechanisms, and thermal behavior Covers the basics of each technique and its main mechanisms, i.e., temperature, mold filling, bonding, residual stresses, and material behavior Discusses the most relevant processing parameters for each injection molding technique Presents a variety of techniques, including gas and water assisted injection molding, multi component injection molding, hybrid injection molding, injection molding of bio-based materials, and techniques for thermoset

In general, a dielectric is considered as a non-conducting or insulating material (such as a ceramic or polymer used to manufacture a microelectronic device). This book describes the laws governing all dielectric phenomena.·A unified approach is used in describing each of the dielectric phenomena, with the aim of answering "what?", "how?" and "why" for the occurrence of each phenomenon;·Coverage unavailable in other books on ferroelectrics, piezoelectrics, pyroelectrics, electro-optic processes, and electrets;·Theoretical analyses are general and broadly applicable;·Mathematics is simplified and emphasis is placed on the physical insight of the mechanisms responsible for the phenomena;·Truly comprehensive coverage not available in the current literature.