The human ability to recognize objects on various backgrounds is amazing. Many times, industrial image processing tried to imitate this ability by its own techniques. This book discusses the recognition of defects on free-form edges and - homogeneous surfaces. My many years of experience has shown that such a task can be solved e?ciently only under particular conditions. Inevitably, the following questions must be answered: How did the defect come about? How and why is a person able to recognize a speci?c defect? In short, one needs an analysis of the process of defect creation as well as an analysis of its detection. As soon as the principle of these processes is understood, the processes can be described mathematically on the basis of an appropriate physical model and can then be captured in an algorithm for defect detection. This approach can be described as “image processing from a physicist’s perspective”. I have successfully used this approach in the development of several industrial image processingsystemsandimprovedupontheminthecourseoftime.Iwouldlike to present the achieved results in a hands-on book on the basis of edge-based algorithms for defect detection on edges and surfaces. I would like to thank all who have supported me in writing this book.

The human ability to recognize objects on various backgrounds is amazing. Many times, industrial image processing tried to imitate this ability by its own techniques. This book discusses the recognition of defects on free-form edges and - homogeneous surfaces. My many years of experience has shown that such a task can be solved e?ciently only under particular conditions. Inevitably, the following questions must be answered: How did the defect come about? How and why is a person able to recognize a speci?c defect? In short, one needs an analysis of the process of defect creation as well as an analysis of its detection. As soon as the principle of these processes is understood, the processes can be described mathematically on the basis of an appropriate physical model and can then be captured in an algorithm for defect detection. This approach can be described as “image processing from a physicist’s perspective”. I have successfully used this approach in the development of several industrial image processingsystemsandimprovedupontheminthecourseoftime.Iwouldlike to present the achieved results in a hands-on book on the basis of edge-based algorithms for defect detection on edges and surfaces. I would like to thank all who have supported me in writing this book.

Defect Recognition and Image Processing in Semiconductors 1997 provides a valuable overview of current techniques used to assess, monitor, and characterize defects from the atomic scale to inhomogeneities in complete silicon wafers. This volume addresses advances in defect analyzing techniques and instrumentation and their application to substrates, epilayers, and devices. The book discusses the merits and limits of characterization techniques; standardization; correlations between defects and device performance, including degradation and failure analysis; and the adaptation and application of standard characterization techniques to new materials. It also examines the impressive advances made possible by the increase in the number of nanoscale scanning techniques now available. The book investigates defects in layers and devices, and examines the problems that have arisen in characterizing gallium nitride and silicon carbide.

X-ray computed tomography has been used for several decades as a tool for measuring the three-dimensional geometry of the internal organs in medicine. However, in recent years, we have seen a move in manufacturing industries for the use of X-ray computed tomography; first to give qualitative information about the internal geometry and defects in a component, and more recently, as a fully-quantitative technique for dimensional and materials analysis. This trend is primarily due to the ability of X-ray computed tomography to give a high-density and multi-scale representation of both the external and internal geometry of a component, in a non-destructive, non-contact and relatively fast way. But, due to the complexity of X-ray computed tomography, there are remaining metrological issues to solve and the specification standards are still under development. This book will act as a one-stop-shop resource for students and users of X-ray computed tomography in both academia and industry. It presents the fundamental principles of the technique, detailed descriptions of the various components (hardware and software), current developments in calibration and performance verification and a wealth of example applications. The book will also highlight where there is still work to do, in the perspective that X-ray computed tomography will be an essential part of Industry 4.0.

This work presents two image-based inspection approaches for the quality evaluation of cylinder bore surfaces. In the first algorithm, metal folds on plateau-honed surfaces are inspected with scanning electron microscopy. An edge-aware structure tensor is proposed for feature extraction and localization of surface defects. The second algorithm uses a morphgraphical method for detecting graphite grains in optical micrographs. Based on the inspection results, quality parameters are proposed.

These Proceedings, consisting of Parts A and B, contain the edited versions of most of the papers presented at the annual Review of Progress in Quantitative Nondestructive Evaluation held at the University of Washington, Seattle on July 30 to August 4, 1995. The Review was organized by the Center for NDE at Iowa State University, in cooperation with the Ames Laboratory of the USDOE, the American Society of Nondestructive Testing, the Department of Energy, the National Institute of Standards and Technology, the Federal Aviation Administration, the National Science Foundation IndustryiUniversity Cooperative Research Centers, and the Working Group in Quantitative NDE. This year's Review of Progress in QNDE was attended by approximately 450 participants from the US and many foreign countries who presented over 375 papers. The meeting was divided into 36 sessions with as many as four sessions running concurrently. The Review covered all phases of NDE research and development from fundamental investigations to engineering applications or inspection systems, and it included many important methods of inspection science from acoustics to x-rays. In the last several years, the Review has stabilized at about its current size. Most participants seem to agree it is large enough to permit a full-scale overview of the latest developments but still small enough to retain the collegial atmosphere which has marked the Review since its inception. The Proceedings are structured in a format to reflect the organization of the Review itself, producing a more logical organization for both the meeting and the present volume.