This book constitutes the thoroughly refereed post-conference proceedings of the 17th International Conference on Inductive Logic Programming, ILP 2007, held in Corvallis, OR, USA, in June 2007 in conjunction with ICML 2007, the International Conference on Machine Learning. The 15 revised full papers and 11 revised short papers presented together with 2 invited lectures were carefully reviewed and selected from 38 initial submissions. The papers present original results on all aspects of learning in logic, as well as multi-relational learning and data mining, statistical relational learning, graph and tree mining, relational reinforcement learning, and learning in other non-propositional knowledge representation frameworks. Thus all current topics in inductive logic programming, ranging from theoretical and methodological issues to advanced applications in various areas are covered.

The research community lacks both the capability to explain the effectiveness of existing techniques and the metrics to predict the security properties and vulnerabilities of the next generation of nano-devices and systems. This book provides in-depth viewpoints on security issues and explains how nano devices and their unique properties can address the opportunities and challenges of the security community, manufacturers, system integrators, and end users. This book elevates security as a fundamental design parameter, transforming the way new nano-devices are developed. Part 1 focuses on nano devices and building security primitives. Part 2 focuses on emerging technologies and integrations.

Three-dimensional (3D) integrated circuit (IC) stacking is the next big step in electronic system integration. It enables packing more functionality, as well as integration of heterogeneous materials, devices, and signals, in the same space (volume). This results in consumer electronics (e.g., mobile, handheld devices) which can run more powerful applications, such as full-length movies and 3D games, with longer battery life. This technology is so promising that it is expected to be a mainstream technology a few years from now, less than 10-15 years from its original conception. To achieve this type of end product, changes in the entire manufacturing and design process of electronic systems are taking place. This book provides readers with an accessible tutorial on a broad range of topics essential to the non-expert in 3D System Integration. It is an invaluable resource for anybody in need of an overview of the 3D manufacturing and design chain.

This book offers a comprehensive reference guide for graduate students and professionals in both academia and industry, covering the fundamentals, architecture, processing details, and applications of 3D microelectronic packaging. It provides readers an in-depth understanding of the latest research and development findings regarding this key industry trend, including TSV, die processing, micro-bumps for LMI and MMI, direct bonding and advanced materials, as well as quality, reliability, fault isolation, and failure analysis for 3D microelectronic packages. Images, tables, and didactic schematics are used to illustrate and elaborate on the concepts discussed. Readers will gain a general grasp of 3D packaging, quality and reliability concerns, and common causes of failure, and will be introduced to developing areas and remaining gaps in 3D packaging that can help inspire future research and development.

With the popularity of hardware security research, several edited monograms have been published, which aim at summarizing the research in a particular field. Typically, each book chapter is a recompilation of one or more research papers, and the focus is on summarizing the state-of-the-art research. Different from the edited monograms, the chapters in this book are not re-compilations of research papers. The book follows a pedagogical approach. Each chapter has been planned to emphasize the fundamental principles behind the logic locking algorithms and relate concepts to each other using a systematization of knowledge approach. Furthermore, the authors of this book have contributed to this field significantly through numerous fundamental papers.