Heat Transfer in Electronic Equipment, 1991
Title | Heat Transfer in Electronic Equipment, 1991 PDF eBook |
Author | A. Ortega |
Publisher | |
Pages | 160 |
Release | 1991 |
Genre | Technology & Engineering |
ISBN |
Heat transfer in electronic equipment. Papers ; 1991
Title | Heat transfer in electronic equipment. Papers ; 1991 PDF eBook |
Author | |
Publisher | |
Pages | |
Release | 1991 |
Genre | |
ISBN |
Heat Transfer
Title | Heat Transfer PDF eBook |
Author | Younes Shabany |
Publisher | CRC Press |
Pages | 526 |
Release | 2009-12-17 |
Genre | Science |
ISBN | 1439814686 |
The continuing trend toward miniaturization and high power density electronics results in a growing interdependency between different fields of engineering. In particular, thermal management has become essential to the design and manufacturing of most electronic systems.Heat Transfer: Thermal Management of Electronics details how engineers can use
Air Cooling Technology for Electronic Equipment
Title | Air Cooling Technology for Electronic Equipment PDF eBook |
Author | Sung Jin Kim |
Publisher | CRC Press |
Pages | 264 |
Release | 2020-07-24 |
Genre | Technology & Engineering |
ISBN | 1000151743 |
Clear your bookcase of references containing bits and pieces of useful information and replace them with this thorough, single-volume guide to thermal analysis. Air Cooling Technology for Electronic Equipment is a helpful, practical resource that answers questions frequently asked by thermal and packaging engineers grappling with today's demand for increased thermal control in electronics. Superbly organized for quick reference, the book dedicates each chapter to answering fundamental questions, such as: What is the optimal spacing between the printed circuit boards? What is a good estimate of the heat transfer coefficient and the associate pressure drop for forced convection over package arrays? How are heat transfer and fluid flow characteristics in the entrance region different from those in the fully developed region? What is the effect of substrate conduction on convection cooling? The chapters, written by engineers and engineering educators who are experts in electronic cooling, are packed with details and present the latest developments in air cooling techniques and thermal design guidelines. They provide problem-solving analyses that are jargon-free, straightforward, and easy to understand. Air Cooling Technology for Electronic Equipment is a handy source of technical information for anyone who wants to get the most out of air cooling.
Thermal Design of Electronic Equipment
Title | Thermal Design of Electronic Equipment PDF eBook |
Author | Ralph Remsburg |
Publisher | CRC Press |
Pages | 440 |
Release | 2017-12-19 |
Genre | Technology & Engineering |
ISBN | 1351835912 |
In a field where change and growth is inevitable, new electronic packaging problems continually arise. Smaller, more powerful devices are prone to overheating, causing intermittent system failures, corrupted signals, lower MTBF, and outright system failure. Since convection cooling is the heat transfer path most engineers take to deal with thermal problems, it is appropriate to gain as much understanding about the underlying mechanisms of fluid motion as possible. Thermal Design of Electronic Equipment is the only book that specifically targets the formulas used by electronic packaging and thermal engineers. It presents heat transfer equations dealing with polyalphaolephin (PAO), silicone oils, perfluorocarbons, and silicate ester-based liquids. Instead of relying on theoretical expressions and text explanations, the author presents empirical formulas and practical techniques that allow you to quickly solve nearly any thermal engineering problem in electronic packaging.
Advanced Thermal Design of Electronic Equipment
Title | Advanced Thermal Design of Electronic Equipment PDF eBook |
Author | Ralph Remsburg |
Publisher | Springer Science & Business Media |
Pages | 618 |
Release | 2011-06-27 |
Genre | Technology & Engineering |
ISBN | 1441985093 |
The field of electronic packaging continues to grow at an amazing rate. To be successful in this field requires analytical skills, a foundation in mechanical engineering, and access to the latest developments in the electronics field. The emphasis for each project that the electronic packaging engineer faces changes from project to project, and from company to company, yet some constants should continue into the foreseeable future. One of these is the emphasis on ther mal design. Although just a few years ago thermal analysis of electronic equipment was an afterthought, it is becoming one of the primary aspects of many packaging jobs. It seems that the days of just adding a bigger fan to reduce the overheat ing problem are almost over. Replacing that thought is the up-front commitment to CFD (Computational Fluid Dynamics) software code, FEA (Finite Element Analysis) software, and the realization that the problem will only get worse. As the electronic circuit size is reduced, speed is increased. As the power of these systems increases and the volume allowed diminishes, heat flux or density (heat per unit area, W/m 2 or Btulh ft2) has spiraled. Much of the improvement in the reliability and packaging density of electronic circuits can be traced to advances in thermal design. While air cooling is still used extensively, advanced heat transfer techniques using exotic synthetic liquids are becoming more prominent, allowing still smaller systems to be manufactured. The appli cation of advanced thermal management techniques requires a background in fluid dynamics.
Advanced Thermal Design of Electronic Equipment
Title | Advanced Thermal Design of Electronic Equipment PDF eBook |
Author | Ralph Remsburg |
Publisher | Springer Science & Business Media |
Pages | 632 |
Release | 1998-02-28 |
Genre | Computers |
ISBN | 9780412122712 |
With today's high density, high performance electronic systems, packaging and more specifically thermal engineering has become the critical factor that limits on-time product introduction and reliability in the field. This book serves as a reference for engineers who must predict the thermal performance of a company's latest product as well as the technicians who must quickly solve the problem of an overheating chip in a product that is already on the shelves.