Today's commercial, medical and military electronics are becoming smaller and smaller. At the same time these devices demand more power and currently this power requirement is met almost exclusively by battery power. This book includes coverage of ceramic hybrid separators for micro fuel cells and miniature fuel cells built with LTCC technology. It also covers novel fuel cells and discusses the application of fuel cell in microelectronics.

Air quality is deteriorating, the globe is warming, and petroleum resources are decreasing. The most promising solutions for the future involve the development of effective and efficient drive train technologies. This comprehensive volume meets this challenge and opportunity by integrating the wealth of disparate information found in scattered pape

Dieses Handbuch präsentiert die in den letzten zehn Jahren entstandenen neuen Anwendungsbereiche und gibt einen umfassenden Überblick über dieses wissenschaftlich und ökonomisch wichtige Gebiet. Einzigartig ist die Verbindung von Grundlagenforschung und industrieller Entwicklung.

Provides in-depth knowledge on novel materials that make electronics work under high-temperature and high-pressure conditions This book reviews the state of the art in research and development of lead-free interconnect materials for electronic packaging technology. It identifies the technical barriers to the development and manufacture of high-temperature interconnect materials to investigate into the complexities introduced by harsh conditions. It teaches the techniques adopted and the possible alternatives of interconnect materials to cope with the impacts of extreme temperatures for implementing at industrial scale. The book also examines the application of nanomaterials, current trends within the topic area, and the potential environmental impacts of material usage. Written by world-renowned experts from academia and industry, Harsh Environment Electronics: Interconnect Materials and Performance Assessment covers interconnect materials based on silver, gold, and zinc alloys as well as advanced approaches utilizing polymers and nanomaterials in the first section. The second part is devoted to the performance assessment of the different interconnect materials and their respective environmental impact. -Takes a scientific approach to analyzing and addressing the issues related to interconnect materials involved in high temperature electronics -Reviews all relevant materials used in interconnect technology as well as alternative approaches otherwise neglected in other literature -Highlights emergent research and theoretical concepts in the implementation of different materials in soldering and die-attach applications -Covers wide-bandgap semiconductor device technologies for high temperature and harsh environment applications, transient liquid phase bonding, glass frit based die attach solution for harsh environment, and more -A pivotal reference for professionals, engineers, students, and researchers Harsh Environment Electronics: Interconnect Materials and Performance Assessment is aimed at materials scientists, electrical engineers, and semiconductor physicists, and treats this specialized topic with breadth and depth.

Chief engineer Thomas J. Kelly gives a firsthand account of designing, building, testing, and flying the Apollo lunar module. It was, he writes, “an aerospace engineer’s dream job of the century.” Kelly’s account begins with the imaginative process of sketching solutions to a host of technical challenges with an emphasis on safety, reliability, and maintainability. He catalogs numerous test failures, including propulsion-system leaks, ascent-engine instability, stress corrosion of the aluminum alloy parts, and battery problems, as well as their fixes under the ever-present constraints of budget and schedule. He also recaptures the exhilaration of hearing Apollo 11’s Neil Armstrong report that “The Eagle has landed,” and the pride of having inadvertently provided a vital “lifeboat” for the crew of the disabled Apollo 13.