This book provides the reader with a complete methodology and software environment for creating efficient dynamic compact models for electro-thermal MEMS devices. It supplies the basic knowledge and understanding for using model order reduction at the engineering level. This tutorial is written for MEMS engineers and is enriched with many case studies which equip readers with the know-how to facilitate the simulation of a specific problem.

The modeling of electro-thermal processes, for example Joule heating, is becoming increasingly important in microsystems (in the following MEMS) development. In microelectronic systems, for example, high temperatures may cause the malfunction or even destruction of the device. Other devices, such as microsensors and microactuators need high temperatures to improve transduction efficiency. In both cases the designer should be able to predict the temperature distribution for the given electrical input and the impact of the temperature on the devices electronics in turn. In other words, one must run a joint electro-thermal simulation. Conventionally, in each sequence of electro-thermal simulation the temperature field is computed on a discrete grid whose size, due to increasingly complex microstructures, easily exceeds 100,000 degrees of freedom (DOF), i. e. ordinary differential equations. Although modern computers are able to handle engineering problems of this size, the system-level simulation would become prohibitive if full models were directly used. Hence, the reduction of the problem's size is the first milestone of efficient MEMS modeling and simulation. This thesis presents the application of mathematical model order reduction (MOR) methods (preferably Arnoldi algorithm) to the automatic generation of accurate dynamic compact thermal models (DCTM) of electro-thermal microsystems. Unlike conventional approaches to DCTM, which are based on the lumped-element decomposition of the model followed by parameter fitting, mathematical MOR is formal, robust and can be made fully automated. The reduced order models can be formally converted into Hardware Description Language (HDL) form and directly used in system-level simulation. The results obtained in this thesis led to the creation of the software tool mor4ansys at the chair for simulation of the university of Freiburg. Presently it is possible to use mor4ansys to automatically create reduced order thermal models (wi.

System-level modeling of MEMS - microelectromechanical systems - comprises integrated approaches to simulate, understand, and optimize the performance of sensors, actuators, and microsystems, taking into account the intricacies of the interplay between mechanical and electrical properties, circuitry, packaging, and design considerations. Thereby, system-level modeling overcomes the limitations inherent to methods that focus only on one of these aspects and do not incorporate their mutual dependencies. The book addresses the two most important approaches of system-level modeling, namely physics-based modeling with lumped elements and mathematical modeling employing model order reduction methods, with an emphasis on combining single device models to entire systems. At a clearly understandable and sufficiently detailed level the readers are made familiar with the physical and mathematical underpinnings of MEMS modeling. This enables them to choose the adequate methods for the respective application needs. This work is an invaluable resource for all materials scientists, electrical engineers, scientists working in the semiconductor and/or sensor industry, physicists, and physical chemists.

An increasing complexity of models used to predict real-world systems leads to the need for algorithms to replace complex models with far simpler ones, while preserving the accuracy of the predictions. This three-volume handbook covers methods as well as applications. This third volume focuses on applications in engineering, biomedical engineering, computational physics and computer science.

This book is a collection of selected papers presented at the last Scientific Computing in Electrical Engineering (SCEE) Conference, held in Sinaia, Romania, in 2006. The series of SCEE conferences aims at addressing mathematical problems which have a relevance to industry, with an emphasis on modeling and numerical simulation of electronic circuits, electromagnetic fields but also coupled problems and general mathematical and computational methods.

This book captures selected peer reviewed papers presented at the 5th International Conference on Sustainable Automotive Technologies, ICSAT 2013, held in Ingolstadt, Germany. ICSAT is the state-of-the-art conference in the field of new technologies for transportation. The book brings together the work of international researchers and practitioners under the following interrelated headings: fuel transportation and storage, material recycling, manufacturing and management costs, engines and emission reduction. The book provides a very good overview of research and development activities focused on new technologies and approaches capable of meeting the challenges to sustainable mobility.

This book highlights a unique combination of numerical tools and strategies for handling the challenges of multiphysics simulation, with a specific focus on electromechanical systems as the target application. Features: introduces the concept of design via simulation, along with the role of multiphysics simulation in today’s engineering environment; discusses the importance of structural optimization techniques in the design and development of electromechanical systems; provides an overview of the physics commonly involved with electromechanical systems for applications such as electronics, magnetic components, RF components, actuators, and motors; reviews the governing equations for the simulation of related multiphysics problems; outlines relevant (topology and parametric size) optimization methods for electromechanical systems; describes in detail several multiphysics simulation and optimization example studies in both two and three dimensions, with sample numerical code.