Ni-Mn-Ga thin films have attracted significant attention over the past two decades due to its multifunctional properties, leveraging these characteristics in applications such as actuators, sensors, and micro-electromechanical systems (MEMS). The most favorable deposition technique for making Ni-Mn-Ga thin films is magnetron sputtering where the target used is near stoichiometric Ni2MnGa alloy. Ni-Mn-Ga alloy target manufacturing has been challenging and costly due to design constraints, process optimization issues and inefficient target utilization resulting in compounded negative economics. To address these problems, this research aimed at investigating and demonstrating the viability of a cost-effective, modern technology known as binder jetting additive manufacturing (BJAM) technique to produce targets with excellent target consumption efficiency based on proposed target design. The additive manufactured Ni-Mn-Ga alloy target process began with ball-milled Ni-Mn-Ga powder having bimodal particle distribution to ensure an increased packing density and mechanical strength after the determination of optimized 3D printing parameters. The printed targets were post-processed through curing, de-binding and sintering. Sintering was conducted in an inert/argon atmosphere to safeguard essential material properties which were benchmarked through characterization. Backscattered electron (BSE) micrographs showed AM targets were homogenous with martensitic twin microstructures necessary for shape memory behavior. The XRD results showed that the martensitic twin microstructures were mostly tetragonal and monoclinic crystal structures. The martensitic transformation temperatures for Ni-Mn-Ga targets ranged from 79.3 to 148.1°C and possessed a maximum density of 87.18%. Using the direct current (DC) magnetron sputtering, Ni-Mn-Ga thin films were deposited on Si (100) substrates at discharge currents ranging from 0.05 to 0.15 A and substrate temperatures 20°C to 700°C. The effect of discharge current and substrate temperature on surface morphology, composition, crystal structure of Ni-Mn-Ga thin films on silicon substrates were investigated. As the discharge current increased, the film showed increased grain size. The grain morphology, as appeared from the investigation of the film planar surface was of elongated grains. The film crystallinity also increased with increased discharge current, as proved by XRD investigations. The most important effect of maintaining the discharge current value constant and increasing the substrate temperature was the change in chemistry and crystallography of the obtained Ni-Mn-Ga thin films. The film deposited at 700°C showed the closest chemical composition to the target composition. For the other substrate temperatures, the high oxygen contamination, due perhaps to not-so-optimum deposition conditions, drastically altered the film composition. By increasing the substrate temperature, the film crystal structure changed from Heusler L2I cubic (high temperature phase) to monoclinic (low temperature phase). It was also demonstrated that, 3D printed sputtering targets of different geometrical designs are potential for improving target utilization efficiency and film properties.

Ferromagnetic shape memory alloys (FSMA's) are known to produce large strains in the presence of magnetic fields. Amongst the FSMA's near stoichiometric Ni2MnGa alloys present copious conceivable applications such as actuators and sensors due to these large magnetic field induced strains (MFIS's). Albeit, the large MFIS's are often observed in single crystals; which are difficult to manufacture and possess limited ductility. Recent investigations of polycrystalline Ni-Mn-Ga foams are reported to exhibit comparable MFIS's to those reported for single crystals. Therefore the ability to increase the MFIS in Ni-Mn-Ga alloys is envisioned through the introduction of pores in the microstructure. However, the manufacturing is difficult for all the above-mentioned Ni-Mn-Ga materials. Moreover, current techniques lack the ability to manufacture complex geometries. Additive Manufacturing (AM) via binder jetting is a method for producing porous near net shaped components utilizing micrometer sized material. This research investigates an additive manufacturing route of producing functional net shaped parts from pre-alloyed magnetic shape memory Ni-Mn-Ga powders. Three types of Ni-Mn-Ga powders were used in this investigation: spark eroded in liquid nitrogen (LN2), spark eroded in liquid argon (LAr), and ball milled (BM). Additive manufacturing via powder bed binder jetting, also known as 3D printing (3DP) was used in this research due to the ability to control part porosity and the possibility to obtain complex shaped parts from Ni-Mn-Ga alloys. The fourth-dimension (4D) is created by the predictable change in 3D printed part configuration over time as the result of shape-memory functionality. Powder characterization techniques including packing density measurements, size distribution analysis, and binder saturation experiments were conducted on the powders to obtain optimized printing parameters, respectively. The optimum layer thickness and binder saturation range was determined as 80 - 110 μm, and 110 - 250 %, respectively. Binder jetting of Ni-Mn-Ga powders followed by curing and sintering proved successful in producing net shaped porous structures (spring-like, 3-D hierarchical lattice structures, etc.) with suitable mechanical strength. Parts with porosities between 24.08 % and 73.43 % (1.164 g/cm3 to 6.35 g/cm3) have been obtained by using powders with distinct morphologies. The printed and sintered Ni-Mn-Ga parts undergo reversible martensitic transformations during heating and cooling, which is a prerequisite for the shape memory effect. Thermo-magneto-mechanical trained 3D printed parts obtained from ball milled Ni-Mn-Ga powders showed reversible magnetic-field-induced strains (MFIS's) of up to 0.01%. Binder jetting additive manufacturing is a viable technology in solving the design issues of functional parts made of Ni-Mn-Ga magnetic shape-memory alloys (MSMA).

Thin Film Coatings: Properties, Deposition, and Applications discusses the holistic subject of conventional and emerging thin film technologies without bias to a specific technology based on the existing literature. It covers properties and delves into the various methods of thin film deposition, including the most recent techniques and a direction for future developments. It also discusses the cutting-edge applications of thin film coatings such as self-healing and smart coatings, biomedical, hybrid, and scalable thin films. Finally, the concept of Industry 4.0 in thin film coating technology is examined. This book: Explores a wide range and is not specific to material and method of deposition Demonstrates the application of thin film coatings in nearly all sectors, such as energy and anti-microbial applications Details the preparation and properties of hybrid and scalable (ultra) thin materials for advanced applications Provides detailed bibliometric analyses on applications of thin film coatings Discusses Industry 4.0 and 3D printing in thin film technology With its broad coverage, this comprehensive reference will appeal to a wide audience of materials scientists and engineers and others studying and developing advanced thin film technologies.

This thoroughly updated new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications of sputtering technology. It forms a bridge between fundamental theory and practical application, giving an insight into innovative new materials, devices and systems. Organized into three parts for ease of use, this Handbook introduces the fundamentals of thin films and sputtering deposition, explores the theory and practices of this field, and also covers new technology such as nano-functional materials and MEMS. Wide varieties of functional thin film materials and processing are described, and experimental data is provided with detailed examples and theoretical descriptions. A strong applications focus, covering current and emerging technologies, including nano-materials and MEMS (microelectrolmechanical systems) for energy, environments, communications, and/or bio-medical field. New chapters on computer simulation of sputtering and MEMS completes the update and insures that the new edition includes the most current and forward-looking coverage available All applications discussed are supported by theoretical discussions, offering readers both the "how" and the "why" of each technique 40% revision: the new edition includes an entirely new team of contributing authors with backgrounds specializing in the various new applications that are covered in the book and providing the most up-to-date coverage available anywhere

This book provides a highly practical treatment of Glancing Angle Deposition (GLAD), a thin film fabrication technology optimized to produce precise nanostructures from a wide range of materials. GLAD provides an elegant method for fabricating arrays of nanoscale helices, chevrons, columns, and other porous thin film architectures using physical vapour deposition processes such as sputtering or evaporation. The book gathers existing procedures, methodologies, and experimental designs into a single, cohesive volume which will be useful both as a ready reference for those in the field and as a definitive guide for those entering it. It covers: Development and description of GLAD techniques for nanostructuring thin films Properties and characterization of nanohelices, nanoposts, and other porous films Design and engineering of optical GLAD films including fabrication and testing, and chiral films Post-deposition processing and integration to optimize film behaviour and structure Deposition systems and requirements for GLAD fabrication A patent survey, extensive relevant literature, and a survey of GLAD's wide range of material properties and diverse applications.