Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product. Master Extreme Ultraviolet Lithography Techniques Produce high-density, ultrafast microchips using the latest EUVL methods. Written by industry experts, Extreme Ultraviolet Lithography details the equipment, materials, and procedures required to radically extend fabrication capabilities to wavelengths of 32 nanometers and below. Work with masks and resists, configure high-reflectivity mirrors, overcome power and thermal challenges, enhance resolution, and minimize wasted energy. You will also learn how to use Mo/Si deposition technology, fine-tune performance, and optimize cost of ownership. Design EUVL-ready photomasks, resist layers, and source-collector modules Assemble optical components, mirrors, microsteppers, and scanners Harness laser-produced and discharge pulse plasma sources Enhance resolution using proximity correction and phase-shift Generate modified illumination using holographic elements Measure critical dimensions using metrology and scatterometry Deploy stable Mo/Si coatings and high-sensitivity multilayers Handle mask defects, layer imperfections, and thermal instabilities

Editorial Review Dr. Bakshi has compiled a thorough, clear reference text covering the important fields of EUV lithography for high-volume manufacturing. This book has resulted from his many years of experience in EUVL development and from teaching this subject to future specialists. The book proceeds from an historical perspective of EUV lithography, through source technology, optics, projection system design, mask, resist, and patterning performance, to cost of ownership. Each section contains worked examples, a comprehensive review of challenges, and relevant citations for those who wish to further investigate the subject matter. Dr. Bakshi succeeds in presenting sometimes unfamiliar material in a very clear manner. This book is also valuable as a teaching tool. It has become an instant classic and far surpasses others in the EUVL field. --Dr. Akira Endo, Chief Development Manager, Gigaphoton Inc. Description Extreme ultraviolet lithography (EUVL) is the principal lithography technology aiming to manufacture computer chips beyond the current 193-nm-based optical lithography, and recent progress has been made on several fronts: EUV light sources, optics, optics metrology, contamination control, masks and mask handling, and resists. This comprehensive volume is comprised of contributions from the world's leading EUVL researchers and provides all of the critical information needed by practitioners and those wanting an introduction to the field. Interest in EUVL technology continues to increase, and this volume provides the foundation required for understanding and applying this exciting technology. About the editor of EUV Lithography Dr. Vivek Bakshi previously served as a senior member of the technical staff at SEMATECH; he is now president of EUV Litho, Inc., in Austin, Texas.

Extreme ultraviolet (EUV) lithography is a next generation platform with the potential to extend Moore's Law. The EUV mirror is a fundamental component of this system. Efficient Extreme Ultraviolet Mirror Design describes an approach to designing EUV mirrors with reduced computational time and memory requirements, providing a comprehensive grounding in the fundamentals of the EUV mirror and knowledge of the finite-difference time-domain (FDTD) method. The discussion is made timely by the opening of commercial avenues for the application of EUV as it begins to be implemented in the development of 5G, AI, edge computing, VR and the Internet of Things. This book explores the theory, function and fabrication of EUV mirrors, as well as the correlation between design by Fresnel's equations and design by photonic bands, and develops a rigorous and efficient FDTD method by applying these considerations to three simulation cases. Intended primarily for EUV industry professionals, Efficient Extreme Ultraviolet Mirror Design will be of particular use to researchers investigating large scale problems or near-field scattering problems in EUV lithography. It will serve as an excellent reference text for anyone working in or studying optical engineering, as well as a high-level introduction for researchers from other fields interested in photolithography and the FDTD method. Key Features Addresses knowledge of extreme ultraviolet (EUV) mirrors and EUV lithography. Establishes a relation between photonic bands and Fresnel's equation. Introduces the high reflectivity EUV mirror design rules. Applies numerical simulation for EUV mirror design. Details efficient finite-difference time-domain (FDTD) approach.

This comprehensive volume, edited by a senior technical staff member at SEMATECH, is the authoritative reference book on EUV source technology. The volume contains 38 chapters contributed by leading researchers and suppliers in the EUV source field. Topics range from a state-of-the-art overview and in-depth explanation of EUV source requirements, to fundamental atomic data and theoretical models of EUV sources based on discharge-produced plasmas (DPP) and laser-produced plasmas, to a description of prominent DPP and LPP designs and other technologies for producing EUV radiation. Additional topics include EUV source metrology and components (collectors, electrodes), debris mitigation, and mechanisms of component erosion in EUV sources. The volume is intended to meet the needs of both practitioners of the technology and readers seeking an introduction to the subject.

As the requirements of the semiconductor industry have become more demanding in terms of resolution and speed it has been necessary to push photoresist materials far beyond the capabilities previously envisioned. Currently there is significant worldwide research effort in to so called Next Generation Lithography techniques such as EUV lithography and multibeam electron beam lithography. These developments in both the industrial and the academic lithography arenas have led to the proliferation of numerous novel approaches to resist chemistry and ingenious extensions of traditional photopolymers. Currently most texts in this area focus on either lithography with perhaps one or two chapters on resists, or on traditional resist materials with relatively little consideration of new approaches. This book therefore aims to bring together the worlds foremost resist development scientists from the various community to produce in one place a definitive description of the many approaches to lithography fabrication. - Assembles up-to-date information from the world's premier resist chemists and technique development lithographers on the properties and capabilities of the wide range of resist materials currently under investigation - Includes information on processing and metrology techniques - Brings together multiple approaches to litho pattern recording from academia and industry in one place

This detailed, comprehensive book describes the fundamental properties of soft X-rays and extreme ultraviolet (EUV) radiation and discusses their applications in a wide variety of fields, including EUV lithography for semiconductor chip manufacture and soft X-ray biomicroscopy. The author begins by presenting the relevant basic principles such as radiation and scattering, wave propagation, diffraction, and coherence. He then goes on to examine a broad range of phenomena and applications. The topics covered include spectromicroscopy, EUV astronomy, synchrotron radiation, and soft X-ray lasers. The author also provides a wealth of useful reference material such as electron binding energies, characteristic emission lines and photo-absorption cross-sections. The book will be of great interest to graduate students and researchers in engineering, physics, chemistry, and the life sciences. It will also appeal to practising engineers involved in semiconductor fabrication and materials science.