The authors present readers with a compelling, one-stop, advanced system perspective on the intrinsic issues of digital system design. This invaluable reference prepares readers to meet the emerging challenges of the device and circuit issues associated with deep submicron technology. It incorporates future trends with practical, contemporary methodologies.

Written by the world’s most prominent microprocessor design leaders from industry and academia, this book provides complete coverage of all aspects of complex microprocessor design: technology, power management, clocking, high-performance architecture, design methodologies, memory and I/O design, computer aided design, testing and design for testability. The chapters provide state-of-the-art knowledge while including sufficient tutorial material to bring non-experts up to speed. A useful companion to design engineers working in related areas.

Design of High-Performance CMOS Voltage-Controlled Oscillators presents a phase noise modeling framework for CMOS ring oscillators. The analysis considers both linear and nonlinear operation. It indicates that fast rail-to-rail switching has to be achieved to minimize phase noise. Additionally, in conventional design the flicker noise in the bias circuit can potentially dominate the phase noise at low offset frequencies. Therefore, for narrow bandwidth PLLs, noise up conversion for the bias circuits should be minimized. We define the effective Q factor (Qeff) for ring oscillators and predict its increase for CMOS processes with smaller feature sizes. Our phase noise analysis is validated via simulation and measurement results. The digital switching noise coupled through the power supply and substrate is usually the dominant source of clock jitter. Improving the supply and substrate noise immunity of a PLL is a challenging job in hostile environments such as a microprocessor chip where millions of digital gates are present.

A modern, comprehensive introduction to DRAM for students and practicing chip designers Dynamic Random Access Memory (DRAM) technology has been one of the greatestdriving forces in the advancement of solid-state technology. With its ability to produce high product volumes and low pricing, it forces solid-state memory manufacturers to work aggressively to cut costs while maintaining, if not increasing, their market share. As a result, the state of the art continues to advance owing to the tremendous pressure to get more memory chips from each silicon wafer, primarily through process scaling and clever design. From a team of engineers working in memory circuit design, DRAM Circuit Design gives students and practicing chip designers an easy-to-follow, yet thorough, introductory treatment of the subject. Focusing on the chip designer rather than the end user, this volume offers expanded, up-to-date coverage of DRAM circuit design by presenting both standard and high-speed implementations. Additionally, it explores a range of topics: the DRAM array, peripheral circuitry, global circuitry and considerations, voltage converters, synchronization in DRAMs, data path design, and power delivery. Additionally, this up-to-date and comprehensive book features topics in high-speed design and architecture and the ever-increasing speed requirements of memory circuits. The only book that covers the breadth and scope of the subject under one cover, DRAM Circuit Design is an invaluable introduction for students in courses on memory circuit design or advanced digital courses in VLSI or CMOS circuit design. It also serves as an essential, one-stop resource for academics, researchers, and practicing engineers.

This book provides readers with a variety of algorithms and software tools, dedicated to the physical design of through-silicon-via (TSV) based, three-dimensional integrated circuits. It describes numerous “manufacturing-ready” GDSII-level layouts of TSV-based 3D ICs developed with the tools covered in the book. This book will also feature sign-off level analysis of timing, power, signal integrity, and thermal analysis for 3D IC designs. Full details of the related algorithms will be provided so that the readers will be able not only to grasp the core mechanics of the physical design tools, but also to be able to reproduce and improve upon the results themselves. This book will also offer various design-for-manufacturability (DFM), design-for-reliability (DFR), and design-for-testability (DFT) techniques that are considered critical to the physical design process.

Three-Dimensional Integrated Circuit Design, Second Eition, expands the original with more than twice as much new content, adding the latest developments in circuit models, temperature considerations, power management, memory issues, and heterogeneous integration. 3-D IC experts Pavlidis, Savidis, and Friedman cover the full product development cycle throughout the book, emphasizing not only physical design, but also algorithms and system-level considerations to increase speed while conserving energy. A handy, comprehensive reference or a practical design guide, this book provides effective solutions to specific challenging problems concerning the design of three-dimensional integrated circuits. Expanded with new chapters and updates throughout based on the latest research in 3-D integration: - Manufacturing techniques for 3-D ICs with TSVs - Electrical modeling and closed-form expressions of through silicon vias - Substrate noise coupling in heterogeneous 3-D ICs - Design of 3-D ICs with inductive links - Synchronization in 3-D ICs - Variation effects on 3-D ICs - Correlation of WID variations for intra-tier buffers and wires - Offers practical guidance on designing 3-D heterogeneous systems - Provides power delivery of 3-D ICs - Demonstrates the use of 3-D ICs within heterogeneous systems that include a variety of materials, devices, processors, GPU-CPU integration, and more - Provides experimental case studies in power delivery, synchronization, and thermal characterization

The book is organized in seven chapters. Physical design flow. Timing constraints. Place and route concepts. Tool vendors. Process constraints. Timing closure. Place and route methodology and flow. ECO and spare gates. Formal verification. Coupling noise. Chip optimization and tapeout.